SiC466, SiC467, SiC468, SiC469
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Vishay Siliconix
4.5 V to 60 V Input, 2 A, 4 A, 6 A, 10 A
microBUCK® DC/DC Converter
FEATURES
LINKS TO ADDITIONAL RESOURCES
Design Tool
Evaluation
Boards
Design Tools
DESCRIPTION
The SiC46x is a family of wide input voltage high efficiency
synchronous buck regulators with integrated high side and
low side power MOSFETs. Its power stage is capable of
supplying high continuous current at up to 2 MHz switching
frequency. This regulator produces an adjustable output
voltage down to 0.8 V from 4.5 V to 60 V input rail
to accommodate a variety of applications, including
computing, consumer electronics, telecom, and industrial.
SiC46x’s architecture delivers ultrafast transient response
with minimum output capacitance and tight ripple regulation
at very light load. The device is internally compensated and
is stable with any capacitor. No external ESR network is
required for loop stability purpose. The device also
incorporates a power saving scheme that significantly
increases light load efficiency. The regulator integrates a full
protection feature set, including over current protection
(OCP), output overvoltage protection (OVP), short circuit
protection (SCP), output undervoltage protection (UVP) and
thermal shutdown (OTP). It also has UVLO for input rail and
a user programmable soft start.
The SiC46x family is available in 2 A, 4 A, 6 A, 10 A pin
compatible 5 mm by 5 mm lead (Pb)-free power enhanced
MLP55-27L package.
• Versatile
- Single supply operation from 4.5 V to 60 V
input voltage
- Adjustable output voltage down to 0.8 V
- Scalable solution 2 A (SiC469), 4 A (SiC468),
6 A (SiC467), 10 A (SiC466)
- Output voltage tracking and sequencing with
pre-bias start up
- ± 1 % output voltage accuracy at -40 °C to +125 °C
• Internal compensation
• Highly efficient
- 98 % peak efficiency
- 4 μA supply current at shutdown
- 156 μA operating current not switching
• Highly configurable
- Adjustable switching frequency from 100 kHz to 2 MHz
- Adjustable soft start and selectable preset 100 %, 75 %,
and 50 % current limit
- 2 modes of operation, forced continuous conduction,
power save
• Robust and reliable
- Output over voltage protection
- Output under voltage / short circuit protection with auto
retry
- Power good flag and over temperature protection
- Supported by Vishay PowerCAD online design
simulation
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
•
•
•
•
•
•
•
Industrial and automation
Home automation
Industrial and server computing
Networking, telecom, and base station power supplies
Wall transformer regulation
Robotics
High end hobby electronics: remote control cars, planes,
and drones
• Battery management systems
• Power tools
• Vending, ATM, and slot machines
Axis Title
TYPICAL APPLICATION CIRCUIT
100
97
10000
VIN = 24 V, VOUT = 12 V
VIN = 48 V, VOUT = 12 V
SiC466
SiC467
SiC468
SiC469
VDD
VDRV
SS
CIN
VOUT
SW
VOUT
NC
VFB
PGND
fSW
AGND
Css
ILIMIT
MODE
CBOOT
Phase
NC
Rup
Rdown
RMODE
Rfsw
Fig. 1 - Typical Application Circuit
COUT
91
1000
88
85
1st line
2nd line
VIN
BOOT
VCIN
PGOOD
EN
Input
4.5 VDC to 60 VDC
2nd line
eff - Efficiency (%)
94
VIN = 24 V, VOUT = 5 V
82
79
100
VIN = 48 V, VOUT = 5 V
76
73
70
0.01
10
0.1
1
IOUT - Output Current (A)
Fig. 2 - SiC467 Efficiency vs. Output Current
S21-1151-Rev. H, 06-Dec-2021
Document Number: 76044
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Vishay Siliconix
PHASE 5
30
VIN
29 PGND
ķ
16 VDRV
VDRV 1 6
15 GL
GL 1 5
14 SW
SW 1 4
13 SW
SW 1 3
12 SW
SW 1 2
27 MODE
26 VDD
24 fSW
22 VFB
23 AGND
21 NC
25 ILIM
2 PGOOD
3 EN
4 BOOT
ķ
PGND 11
PGND 10
PGND 9
VIN 8
VIN 7
PHASE 6
PGND 1 7
30 PGND
29
VIN
5 PHASE
6 PHASE
VIN 7
BOOT 4
NC 1 8
17 PGND
PGND 11
EN 3
28 AGND
VIN 8
18 NC
1 VCIN
SS 19
PGND 9
28 AGND
PGOOD 2
19 SS
PGND 10
IJ
VCIN 1
20 VOUT
20 VOUT
22 VFB
21 NC
24 fSW
23 AGND
25 ILIM
26 VDD
27 MODE
PIN CONFIGURATION
Fig. 3 - Pin Configuration
PIN DESCRIPTION
PIN NUMBER
SYMBOL
DESCRIPTION
1
VCIN
Supply voltage for internal regulators VDD and VDRV. This pin should be tied to VIN, but can also be
connected to a lower supply voltage (> 5 V) to reduce losses in the internal linear regulators
2
PGOOD
3
EN
Open-drain power good indicator - high impedance indicates power is good. An external pull-up
resistor is required
Enable pin. Tie high / low to enable / disable the IC accordingly. This is a high voltage compatible pin,
can be tied to 60 V
4
BOOT
High side driver bootstrap voltage
5, 6
PHASE
Return path of high side gate driver
7, 8, 29
VIN
9, 10, 11, 17, 30
PGND
12, 13, 14
SW
Power stage switch node
15
GL
Low side MOSFET gate signal
16
VDRV
18, 21
NC
No connection internally
19
SS
Set the soft start ramp by connecting a capacitor to AGND. An internal current source will charge the
capacitor
20
VOUT
22
VFB
23, 28
AGND
24
fSW
25
ILIMIT
26
VDD
27
Mode
S21-1151-Rev. H, 06-Dec-2021
Power stage input voltage. Drain of high side MOSFET
Power ground
Supply voltage for internal gate driver. When using the internal LDO as a bias power supply, VDRV is
the LDO output. Connect a 4.7 μF decoupling capacitor to PGND
Output voltage sense point for internal ripple injection components
Feedback input for switching regulator used to program the output voltage - connect to an external
resistor divider from VOUT to AGND
Analog ground
Set the on-time by connecting a resistor to AGND
Set the current limit by connecting ILIMIT pin to AGND, float or VDD
Bias supply for the IC. VDD is an LDO output, connect a 1 μF decoupling capacitor to AGND
Set various operation modes by connecting a resistor to AGND. See specification table for details
Document Number: 76044
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Vishay Siliconix
ORDERING INFORMATION
PART NUMBER
PACKAGE
MARKING CODE
PowerPAK® MLP55-27L
SiC466ED-T1-GE3
SiC466
SiC466EVB-D
Reference board
PowerPAK® MLP55-27L
SiC467ED-T1-GE3
SiC467
SiC467EVB-D
Reference board
PowerPAK® MLP55-27L
SiC468ED-T1-GE3
SiC468
SiC468EVB-E
Reference board
PowerPAK® MLP55-27L
SiC469ED-T1-GE3
SiC469
SiC469EVB-E
Reference board
PART MARKING INFORMATION
=
pin 1 indicator
P/N
P/N =
=
Siliconix logo
LL
=
ESD symbol
FYWW
part number code
F
=
assembly factory code
Y
=
year code
WW
=
week code
LL
=
lot code
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
ELECTRICAL PARAMETER
CONDITIONS
LIMITS
VCIN, VIN
Reference to PGND
-0.3 to 66
EN
Reference to PGND
-0.3 to 60
SW / PHASE
Reference to PGND
-0.3 to 66
100 ns
-10 to 72
SW / PHASE (AC)
VDRV
Reference to PGND
-0.3 to 6
VDD
Reference to AGND
-0.3 to VDRV + 0.3
BOOT
UNIT
V
-0.3 to VPHASE + VDRV
AGND to PGND
-0.3 to 0.3
VOUT
Reference to PGND
30
All other pins
Reference to AGND
-0.3 to VDD + 0.3
Junction temperature
TJ
-40 to +150
Storage temperature
TSTG
-65 to +150
Temperature
°C
Power Dissipation
Thermal resistance from junction to ambient
12
Thermal resistance from junction to case
2
°C/W
ESD Protection
Electrostatic discharge protection
Human body model, JESD22-A114
2000
Charged device model, JESD22-A101
500
V
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating/conditions for extended periods may affect device reliability.
S21-1151-Rev. H, 06-Dec-2021
Document Number: 76044
3
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RECOMMENDED OPERATING CONDITIONS (all voltages referenced to GND = 0 V)
PARAMETER
MIN.
TYP.
MAX.
Input voltage (VIN)
4.5
-
60
Control input voltage (VCIN) (1)
4.5
-
60
0
-
60
Bias supply (VDD)
4.75
5
5.25
Drive supply voltage (VDRV)
4.75
5.3
5.55
Output voltage (VOUT)
0.8
-
15
Enable (EN)
UNIT
V
Temperature
Recommended ambient temperature
-40 to +105
Operating junction temperature
-40 to +125
°C
Note
(1) For input voltages below 5 V, provide a separate supply to V
CIN of at least 5 V to prevent the internal VDD rail UVLO from triggering
ELECTRICAL SPECIFICATIONS (VIN = VCIN = 48 V, TJ = -40 °C to +125 °C, unless otherwise stated)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
VIN = VCIN = 6 V to 60 V,
VEN = 5 V, not switching
4.55
5
5.3
VIN = VCIN = 5 V,
VEN = 5 V, not switching
4.5
5
-
-
150
-
mV
3.75
4
4.25
V
mV
Power Supplies
VDD supply
VDD dropout
VDD UVLO threshold, rising
VDD UVLO hysteresis
Input current
Shutdown current
VDD
VDD_DROPOUT
VIN = VCIN = 5 V, IVDD = 1 mA
VDD_UVLO
VDD_UVLO_HYST
V
-
150
-
IVCIN
Non-switching, VFB > 0.8 V
-
156
200
IVCIN_SHDN
VEN = 0 V
-
4
8
TJ = 25 °C
796
800
804
TJ = -40 °C to +125 °C (1)
792
800
808
μA
Controller and Timing
Feedback voltage
VFB input bias current
Minimum on-time
tON accuracy
On-time range
VFB
m/V
IFB
-
2
-
nA
tON_MIN.
-
45
100
ns
tON_ACCURACY
-10
-
10
%
tON_RANGE
100
-
8000
ns
Minimum off-time
tOFF_MIN.
-
250
-
ns
Soft start current
ISS
2
5
7
μA
-3
-
3
mV
Zero crossing detection point
S21-1151-Rev. H, 06-Dec-2021
ZCD
LX-PGND
Document Number: 76044
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Vishay Siliconix
ELECTRICAL SPECIFICATIONS (VIN = VCIN = 48 V, TJ = -40 °C to +125 °C, unless otherwise stated)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
Fault Protections
SiC466 valley current limit
SiC467 valley current limit
IOCP
SiC468 valley current limit
SiC469 valley current limit
Output OVP threshold
OVP
Output UVP threshold
UVP
Over temperature protection
ILM tied to VDD
-
13
-
ILM is not connect
-
9.75
-
ILM tied to AGND
-
6.5
-
ILM tied to VDD
-
10
-
ILM is not connect
-
7.5
-
ILM tied to AGND
-
5
-
ILM tied to VDD
-
6
-
ILM is not connect
-
4.2
-
ILM tied to AGND
-
3
-
ILM tied to VDD
-
4
-
ILM is not connect
-
3
-
ILM tied to AGND
-
2
-
-
20
-
-
-80
-
VFB with respect to 0.8 V reference
OTPR
Rising temperature
-
150
-
OTPHYST
Hysteresis
-
35
-
VFB_RISING_VTH_OV
VFB rising above 0.8 V reference
-
20
-
VFB_FALLING_VTH_UV
VFB falling below 0.8 V reference
-
-10
-
30
40
55
A
%
°C
Power Good
Power good output threshold
%
Power good hysteresis
PGOOD_HYST
Power good on resistance
RON_PGOOD
-
6
15
Ω
Power good delay time
tDLY_PGOOD
15
25
35
μs
EN logic high level
VEN_H
1.2
1.4
1.5
EN logic low level
VEN_L
1
1.2
1.35
VEN_HYS
150
200
400
mV
REN
-
6
-
MΩ
IMODE
-
5
-
μA
mV
EN / MODE / Threshold
EN logic hysteresis
EN pull down resistance
Mode pull up current
Mode 1
Power save mode enabled, VDD, VDRV
Pre-reg on
-
2
-
Mode 2
Power save mode disabled, VDD, VDRV
Pre-reg on
-
301
-
Mode 3
Power save mode disabled, VDRV Pre-reg
off, VDD Pre-reg on, provide external VDRV
-
499
-
Mode 4
Power save mode enabled, VDRV Pre-reg off,
VDD Pre-reg on, provide external VDRV
-
1000
-
RMODE
V
kΩ
Note
(1) Guaranteed by design
S21-1151-Rev. H, 06-Dec-2021
Document Number: 76044
5
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Vishay Siliconix
FUNCTIONAL BLOCK DIAGRAM
VCIN
VIN
BOOT
Sync.
rectifier
VDRV
Regulator
VDD
VDD UVLO
EN
HS UVLO
Enable
fSW
ton
On time
generator
min. toff
VDD
HS
driver
5 μA
PHASE
MODE
MODE
VOUT
PHASE
VDD
0.8 V
5 μA
SW
Control
logic
Ramp
VDRV
PWM
Comp
LS
driver
Reference
PHASE
Zero
crossing
GL
OTA
SS
PGOOD
VFB
Over voltage
under voltage
ILIMIT
VFB
PHASE
Over
current
Over
temperature
Power
good
AGND
PGND
Fig. 4 - Functional Block Diagram
OPERATIONAL DESCRIPTION
Device Overview
• Dedicated enable pin for easy power sequencing
SiC46x is a high efficiency synchronous buck regulator
family capable of delivering up to 10 A continuous current.
The device has programmable switching frequency of
100 kHz to 2 MHz. The control scheme is based on voltage
mode constant on time. It delivers fast transient response
and minimizes external components. Thanks to the internal
current ramp information, no high ESR output bulk or virtual
ESR network is required for the loop stability. This device
also incorporates a power saving feature by enabling diode
emulation mode and frequency fold back as the load
decreases.
• Power good open drain output
• This device is available in MLP55-27L package to deliver
high power density and minimize PCB area
Power Stage
SiC46x integrates a high performance power stage with a
n-channel high side MOSFET and a n-channel low side
MOSFET optimized to achieve up to 98 % efficiency.
The power input voltage (VIN) can go up to 60 V and down
as low as 4.5 V for power conversion.
SiC46x has a full set of protection and monitoring features:
• Over current protection in pulse-by-pulse mode
• Output overvoltage protection
• Output undervoltage protection with device going into
hiccup mode
• Over temperature protection with hysteresis
S21-1151-Rev. H, 06-Dec-2021
Document Number: 76044
6
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Control Scheme
SiC46x employs a voltage - mode COT control mechanism
in conjunction with adaptive zero current detection which
allows for power saving in discontinuous conduction mode
(DCM). The switching frequency, fSW, is set by an external
resistor Rfsw connected from fsw pin to ground. The SiC46x
operates between 200 kHz to 2 MHz depending on VIN and
VOUT conditions.
V OUT
R fsw = --------------------------------------------12
f sw × 190 × 10
Note, that there is no VIN dependency on fSW as long as VIN
and VCIN are connected to the same supply.
SiC46x employs an advanced voltage - mode COT control
mechanism.
During steady-state operation, feedback voltage (VFB) is
compared with internal reference (0.8 V typ.) and the
amplified error signal (VCOMP) is generated at the internal
comp node. An internally generated ramp signal and VCOMP
feed into a comparator. Once VRAMP crosses VCOMP, an
on-time pulse is generated for a fixed time. During the
on-time pulse, the high side MOSFET will be turned on.
Once the on-time pulse expires, the low side MOSFET will
be turned on after a dead time period. The low side MOSFET
will stay on for a minimum duration equal to the minimum
off-time (tOFF_MIN.) and remains on until VRAMP crosses
VCOMP. The cycle is then repeated.
Fig. 5 illustrates the operation as described above.
Vishay Siliconix
Power-Save Mode and Mode Pin Operation
To improve efficiency at light-loads, SiC46x provides a set
of innovative implementations to eliminate LS re-circulating
current and switching losses. The internal zero crossing
detector (ZCD) monitors SW node voltage to determine
when inductor current starts to flow negatively. In power
saving mode, as soon as inductor valley current crosses
zero, the device first deploys diode emulation mode by
turning off the LS FET. If load further decreases, switching
frequency is reduced proportional to the load condition to
save switching losses while keeping output ripple within
tolerance.
To improve the converter efficiency, the user can choose to
disable the internal VDRV regulator by picking either mode 3
or mode 4 and connecting a 5 V supply to the VDRV pin. This
reduces power dissipation in the SiC46x by eliminating the
VDRV linear regulator losses.
The mode pin supports several modes of operation as
shown in table 1. An internal current source is used to set
the voltage on this pin using an external resistor:
TABLE 1 - OPERATION MODES
MODE
RANGE (kΩ)
1
2
3
4
0 to 100
298 to 304
494 to 504
900 to 1100
POWER SAVE
MODE
Enabled
Disabled
Disabled
Enabled
INTERNAL VDRV
REGULATOR
ON
ON
OFF (1)
OFF (1)
Note
(1) Connect a 5 V (± 5 %) supply to the V
DRV pin
VRAMP
The mode pin is not latched to any state and can be
changed on the fly.
VCOMP
PWM
Fixed on-time
Fig. 5 - Operational Principle
S21-1151-Rev. H, 06-Dec-2021
Document Number: 76044
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OUTPUT MONITORING AND PROTECTION FEATURES
Output Over-Current Protection (OCP)
Sequencing of Input / Output Supplies
SiC46x has cycle by cycle current limiting. The inductor
valley current is monitored during LS FET turn-on period
through RDS(on) sensing. After a pre-defined blanking time,
the valley current is compared with an internal threshold. If
monitored current is higher than threshold, high side
MOSFET is kept off until the inductor current falls below
OCP threshold.
SiC46x has no sequencing requirements on any of its
input / output (VIN, VDRV, VDD, VCIN, EN) supplies or enables.
The SiC46x has an enable pin to turn the part on and off.
Driving this pin high enables the device, while grounding it
turns it off.
OCP is enabled immediately after VDD passes UVLO rising
threshold.
The SiC46x enable has a weak pull down to prevent
unwanted turn on due to a floating GPIO.
There are 3 settings for the valley current OCP namely 50 %,
75 % and 100 %. The selection can be chosen by
connecting the ILIMIT pin either to VDD, float or GND.
Connecting to VDD will select 100 % of the preset valley
current OCP corresponding to the SiC46x being used. If the
pin is floating, the valley current OCP is 75 %. Connecting
to GND, the valley current OCP is 50 %.
There are no sequencing requirements with respect to other
input / output supplies.
OCPthreshold
Iload
Iinductor
GH
Fig. 6 - Over-Current Protection Illustration
Enable
Soft-Start
During soft start time period, inrush current is limited and the
output voltage is ramped gradually. The following control
scheme is implemented:
Once the VDD voltage reaches the UVLO trip point, an
internal “Soft start Reference” (SR) begins to ramp up. The
SR ramp rate is determined by the external soft start
capacitor. There is an internal 5 μA current source tied to the
soft start pin which charges the external soft start cap.
The internal SR signal is being used as a reference voltage
to the loop error amplifier (see functional block diagram).
The control scheme guarantees that the output voltage
during the soft start interval will ramp up coincidently with
the SR signal. voltage. The speed of the internal soft start
ramp can SiC46x soft-start time is adjustable by selecting a
capacitor value from the following equation.
Output Undervoltage Protection (UVP)
UVP is implemented by monitoring output through VFB pin.
If the voltage level at VFB goes below 0.16 V (VOUT is 20 %
of VOUT set point) for more than 25 μs a UVP event is
recognized and both HS and LS MOSFETs are turned off.
After a time-out period equal to 20 soft start cycles, the IC
attempts to re-start by going through a soft start cycle. If the
fault condition still exists, the above cycle will be repeated.
UVP is only active after the completion of soft-start
sequence.
Output Over Voltage Protection (OVP)
For OVP implementation, output is monitored through FB
pin. After soft start, if the voltage level at FB is above 0.96 V
(typ.) (VOUT is 120 % of VOUT set point), OVP is triggered with
both the HS and LS MOSFETs turned off. Normal operation
is resumed once FB voltage drops back to 0.96 V.
OVP is active immediately after VDD passes UVLO level.
C ext x 0.8 V
SS time = -------------------------------5 μA
During soft-start period, OCP is activated. Short circuit
protection is not active until soft-start is complete.
Pre-Bias Start-Up
In case of pre-bias startup, if the sensed voltage on FB is
higher than the internal soft-start ramp value, control logic
prevents HS and LS FET from switching to avoid negative
output voltage spike and excessive current sinking through
LS FET.
Over Temperature Protection (OTP)
SiC46x has internal thermal monitor block that turns off both
HS and LS FETs when junction temperature is above 150 °C
(typ). A hysteresis of 35 °C is implemented, so when junction
temperature drops below 115 °C, the device restarts by
initiating soft-start sequence again.
In order to improve the efficiency at light load condition, OTP
is disabled when the inductor current is discontinued.
S21-1151-Rev. H, 06-Dec-2021
Fig. 7 - Pre-Bias Start-Up
Document Number: 76044
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Power Good
SiC46x’s power good is an open-drain output. Pull PGOOD
pin high up to 5 V through a 10K resistor to use this signal.
Power good window is shown in the Fig. 8. If voltage level
on FB pin is out of this window, PG signal is de-asserted by
pulling down to GND. To prevent false triggering during
transient events, PGOOD has a 25 μs blanking time.
VFB_Rising_Vth_OV
(typ. = 0.96 V)
VFB_Falling_Vth_OV
(typ. = 0.91 V)
Vref (0.8 V)
VFB_Falling_Vth_UV
VFB_Rising_Vth_UV
(typ. = 0.72 V)
(typ. = 0.77 V)
VFB
Pull-high
PG
Pull-low
Fig. 8 - PGOOD Window and Timing Diagram
SiC46x microBUCK FAMILY SCHEMATIC
EN
R_EN_H
R_EN_L
Heading
0.1μF
28 AGND-PAD
30 PGND-PAD
9 PGND1
4.7μF
19
AGND
Rmode
Cdd
2K
1μF
25
R_fsw
23
VFB 22
20 VOUT
SW 2
SW 3
14
SW 1
VDRV
Cdrv
Css 33nF
52.3K
NC
12
GL
15
16
17 PGND
47μF
Analog ground
(AGND), and power
ground (PGND)
are tied internally
in the SiC46x
VDD
26
FSW 24
SiC466
SiC467
SiC468
SiC469
10 PGND2
11 PGND3
Cin
Mode 27
ILIMIT
13
Cin_D
102K
SS
NC
PGOOD 2
R_PGD
7 VIN1
8 VIN2
0.1μF
PG
NC
18
4
BOOT
3.3
5
PHASE 1
PHASE 2
EN
1 VCIN
29 VIN-PAD
+Vin
6V to 60V
6
3
Notes in small
black text near
component
values refer to
Vishay SiC46x
spreadsheet
calcualtor
references
C_boot
DNP
R_boot
560K
R_FB_L
10K
21
AGND
52.3K
R_FB_H
+VOUT= 5 V
L
0.1μF
64 μF
Cout_D
Cout_C
64 μF
Cout_B
PGND
Fig. 9 - SiC467 Configured for 6 V to 60 V Input, 5 V Output at 6 A, 500 kHz Operation with Power Save Mode Enabled
all Ceramic Output Capacitance Design
S21-1151-Rev. H, 06-Dec-2021
Document Number: 76044
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Vishay Siliconix
EXTERNAL COMPONENT SELECTION FOR THE SiC46x
This section explains external component selection for
the SiC46x family of regulators. Component reference
designators in any equation refer to the schematic shown in
Fig. 9.
The online simulation tool PowerCAD helps to make external
component calculation simple. The user simply needs to
enter required operating conditions.
Output Voltage Adjustment
If a different output voltage is needed, simply change the
value of VOUT and solve for R_FB_H based on the following
formula:
R _FB_L ( V OUT - V FB )
R _FB_H = ---------------------------------------------------V FB
Where VFB is 0.8 V for the SiC46x. R_FB_L should be a
maximum of 10 kΩ to prevent VOUT from drifting at no load.
Switching Frequency Selection
The following equation illustrates the relationship between
on-time, VIN, VOUT, and Rfsw value:
V OUT
R _fsw = -------------------------------------------– 12
f sw × 190 × 10
Inductor Selection
The choice of inductor is specific to each application and
quickly determined with the following equations:
V OUT
t ON = -----------------------------------V IN_max. x f sw
and
( V IN - V OUT ) x t ON
L = -------------------------------------------------I OUT_MAX. x K
Where K is a percentage of maximum output current ripple
required. The designer can quickly make a choice of
inductor if the ripple percentage is decided, usually no more
than 30 % however higher or lower percentages of IOUT can
be acceptable depending on application. This device allows
choices larger than 30 %.
Other than the inductance the DCR and saturation current
parameters are key values. The DCR causes an I2R loss
which will decrease the system efficiency and generate
heat. The saturation current has to be higher than the
maximum output current plus ½ of the ripple current. In an
over current condition the inductor current may be very high.
All this needs to be considered when selecting the inductor.
Output Capacitor Selection
The SiC46x is stable with any type of output capacitors by
choosing the appropriate VRAMP components. This allows
the user to choose the output capacitance based on the
best trade off of board space, cost and application
requirements.
The output capacitors are chosen based upon required ESR
and capacitance. The maximum ESR requirement is
controlled by the output ripple voltage requirement and the
DC tolerance. The output voltage has a DC value that is
equal to the valley of the output ripple plus half of the
peak-to-peak ripple. A change in the output ripple voltage
will lead to a change in DC voltage at the output. The
relationship between output voltage ripple, output
capacitance and ESR of the output capacitor is shown by
the following equation:
1
V RIPPLE = I RIPPLE ( MAX. ) x ------------------------------- 8 x C x f - + ESR
o
(1)
sw
Where VRIPPLE is the maximum allowed output ripple
voltage; IRIPPLE(MAX.) is the maximum inductor ripple current;
fsw is the switching frequency of the converter; Co is the total
output capacitance; ESR is the equivalent series resistance
of the total output capacitors.
In addition to the output ripple voltage requirement, the
output capacitors need to meet transient requirements. A
worst case load release condition (from maximum load to no
load at the exact moment when inductor current is at the
peak) determines the required capacitance. If the load
release is instantaneous (load changes from maximum to
zero within 1 μs), the output capacitor must absorb all the
energy stored in the inductor. The peak voltage on the
capacitor, VPK, under this worst case condition can be
calculated by following equation:
C OUT_MIN.
2
1
L x I OUT + --- x I RIPPLE(MAX.)
2
= -------------------------------------------------------------------------------2
2
( V PK ) - ( V OUT )
(2)
During the load release time, the voltage across the inductor
is approximately -VOUT. This causes a down-slope or falling
di/dt in the inductor. If the load di/dt is not much faster than
the di/dt of the inductor, then the inductor current will tend
to track the falling load current. This will reduce the excess
inductive energy that must be absorbed by the output
capacitor; therefore a smaller capacitance can be used. The
following can be used to calculate the required capacitance
for a given diLOAD/dt.
Peak inductor current, ILPK, is shown by the next equation:
1
I LPK = I MAX. + --- x I RIPPLE(MAX.)
2
di LOAD
The slew rate of load current = ------------------dt
S21-1151-Rev. H, 06-Dec-2021
Document Number: 76044
10
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C OUT_MIN. = I LPK
I LPK
I MAX.
L x -------------- - ------------------- x dt
V OUT dI LOAD
x --------------------------------------------------------------2 ( V PK - V OUT )
Vishay Siliconix
(3)
Based on application requirement, either equation (2) or
equation (3) can be used to calculate the ideal output
capacitance to meet transition requirement. Compare this
calculated capacitance with the result from equation (1) and
choose the larger value to meet both ripple and transition
requirement.
Enable Pin Voltage
The EN pin has an internal pull down resistor and only
requires an enable voltage. This needs to be greater than
1.4 V. An input voltage or a resistor connected across VIN
and EN can be used. The internal pull down resistance is
5 MΩ.
Input Capacitance
In order to determine the minimum capacitance the input
voltage ripple needs to be specified; VCINPKPK ≤ 500 mV is a
suitable starting point. This magnitude is determined by the
final application specification. The input current needs to be
determined for the lowest operating input voltage,
I CIN ( RMS ) =
I OUT x
2
V OUT
1
2
D x ( 1 – D ) + ------ × ------------------------------------- × ( 1 – D ) × D
12 L × ƒ sw × I OUT
The minimum input capacitance can then be found,
D x (1 - D)
C IN_min. = I OUT x ----------------------------------------V CINPKPK x f sw
If high ESR capacitors are used, it is good practice to also
add low ESR ceramic capacitance. A 4.7 μF ceramic input
capacitance is a suitable starting point.
Care must be taken to account for voltage derating of the
capacitance when choosing an all ceramic input
capacitance.
S21-1151-Rev. H, 06-Dec-2021
Document Number: 76044
11
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SiC466, SiC467, SiC468, SiC469
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Vishay Siliconix
ELECTRICAL CHARACTERISTICS (VIN = 48 V, VOUT = 5 V, fsw = 300 kHz, SiC466 (10 A), unless otherwise noted)
Axis Title
Axis Title
100
100
10000
VIN = 12 V, L = 3.3 µH
98
97
94
1000
1st line
2nd line
92
VIN = 24 V, L = 4.7 µH
90
VIN = 36 V, L = 4.7 µH
88
100
86
84
91
1000
88
85
VIN = 24 V, L = 4.7 µH
82
79
VIN = 48 V, L = 4.7 µH
73
10
80
0
1
2
3
4
5
6
7
8
9
10
70
0.01
10
0.1
IOUT - Output Current (A)
Fig. 10 - SiC466 Efficiency vs. Output Current,
VOUT = 5 V
Fig. 13 - SiC466 Efficiency vs. Output Current - Light Load,
VOUT = 5 V
Axis Title
Axis Title
100
97
96
94
94
1000
VIN = 24 V, L = 6.8 µH
92
VIN = 36 V, L = 8.2 µH
90
88
VIN = 48 V, L = 10 µH
100
86
2nd line
eff - Efficiency (%)
98
84
10000
VIN = 24 V, L = 6.8 µH
91
1000
88
VIN = 36 V, L = 8.2 µH
85
1st line
2nd line
10000
1st line
2nd line
2nd line
eff - Efficiency (%)
1
IOUT - Output Current (A)
100
VIN = 48 V, L = 10 µH
82
100
79
76
82
73
10
80
0
1
2
3
4
5
6
7
8
9
10
70
0.01
10
0.1
1
IOUT - Output Current (A)
IOUT - Output Current (A)
Fig. 11 - SiC466 Efficiency vs. Output Current,
VOUT = 12 V
Fig. 14 - SiC466 Efficiency vs. Output Current - Light Load,
VOUT = 12 V
Axis Title
Axis Title
100
10000
100
10000
90
1000
1st line
2nd line
70
60
50
100
40
30
80
1000
70
1st line
2nd line
80
2nd line
TC - Case Temperature (°C)
90
2nd line
TC - Case Temperature (°C)
100
VIN = 36 V, L = 4.7 µH
76
VIN = 48 V, L = 4.7 µH
82
1st line
2nd line
94
2nd line
eff - Efficiency (%)
96
2nd line
eff - Efficiency (%)
10000
VIN = 12 V, L = 3.3 µH
60
50
100
40
30
10
20
0
1
2
3
4
5
6
7
8
9
10
10
20
0
1
2
3
4
5
6
7
8
9
10
IOUT - Output Current (A)
IOUT - Output Current (A)
Fig. 12 - SiC466 Load Current vs. Case Temperature,
VIN = 48 V, VOUT = 5 V
Fig. 15 - SiC466 Load Current vs. Case Temperature,
VIN = 48 V, VOUT = 12 V
S21-1151-Rev. H, 06-Dec-2021
Document Number: 76044
12
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Vishay Siliconix
ELECTRICAL CHARACTERISTICS (VIN = 48 V, VOUT = 5 V, fsw = 300 kHz, SiC467 (6 A), unless otherwise noted)
Axis Title
Axis Title
100
100
10000
VIN = 12 V, L = 5.6 µH
98
97
94
1000
1st line
2nd line
92
VIN = 24 V, L = 6.8 µH
90
VIN = 36 V, L = 8.2 µH
88
100
86
84
91
1000
88
85
VIN = 24 V, L = 6.8 µH
82
100
79
VIN = 36 V, L = 8.2 µH
76
VIN = 48 V, L = 8.2 µH
82
VIN = 48 V, L = 8.2 µH
73
10
80
0
1
2
3
4
5
10
70
0.01
6
0.1
IOUT - Output Current (A)
Fig. 16 - SiC467 Efficiency vs. Output Current,
VOUT = 5 V
Fig. 19 - SiC467 Efficiency vs. Output Current - Light Load,
VOUT = 5 V
Axis Title
Axis Title
100
10000
98
10000
VIN = 24 V, L = 10 µH
97
94
1000
92
1st line
2nd line
VIN = 36 V, L = 15 µH
90
VIN = 48 V, L = 15 µH
88
100
86
84
91
1000
88
VIN = 36 V, L = 15 µH
1st line
2nd line
VIN = 24 V, L = 10 µH
94
2nd line
eff - Efficiency (%)
96
2nd line
eff - Efficiency (%)
1
IOUT - Output Current (A)
100
85
VIN = 48 V, L = 15 µH
82
100
79
76
82
73
10
80
0
1
2
3
4
5
10
70
0.01
6
0.1
1
IOUT - Output Current (A)
IOUT - Output Current (A)
Fig. 17 - SiC467 Efficiency vs. Output Current,
VOUT = 12 V
Fig. 20 - SiC467 Efficiency vs. Output Current - Light Load,
VOUT = 12 V
Axis Title
Axis Title
10000
100
10000
100
90
1000
1st line
2nd line
70
60
50
100
40
30
80
1000
70
1st line
2nd line
80
2nd line
TC - Case Temperature (°C)
90
2nd line
TC - Case Temperature (°C)
1st line
2nd line
94
2nd line
eff - Efficiency (%)
96
2nd line
eff - Efficiency (%)
10000
VIN = 12 V, L = 5.6 µH
60
50
100
40
30
10
20
0
1
2
3
4
5
6
10
20
0
1
2
3
4
5
6
IOUT - Output Current (A)
IOUT - Output Current (A)
Fig. 18 - SiC467 Load Current vs. Case Temperature,
VIN = 48 V, VOUT = 5 V
Fig. 21 - SiC467 Load Current vs. Case Temperature,
VIN = 48 V, VOUT = 12 V
S21-1151-Rev. H, 06-Dec-2021
Document Number: 76044
13
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiC466, SiC467, SiC468, SiC469
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Vishay Siliconix
ELECTRICAL CHARACTERISTICS (VIN = 48 V, VOUT = 5 V, fsw = 300 kHz, SiC468 (4 A), unless otherwise noted)
Axis Title
Axis Title
100
100
10000
VIN = 12 V, L = 10 µH
98
97
VIN = 24 V, L = 15 µH
94
1000
1st line
2nd line
92
VIN = 24 V, L = 15 µH
90
VIN = 36 V, L = 15 µH
88
100
86
84
91
1000
88
85
VIN = 36 V, L = 15 µH
82
79
73
10
80
0
1
2
3
10
70
0.01
4
0.1
1
IOUT - Output Current (A)
IOUT - Output Current (A)
Fig. 22 - SiC468 Efficiency vs. Output Current,
VOUT = 5 V
Fig. 25 - SiC468 Efficiency vs. Output Current - Light Load,
VOUT = 5 V
Axis Title
Axis Title
100
10000
97
96
94
94
VIN = 24 V, L = 15 µH
1000
1st line
2nd line
92
VIN = 36 V, L = 22 µH
90
VIN = 48 V, L = 22 µH
88
100
86
2nd line
eff - Efficiency (%)
98
84
10000
VIN = 24 V, L = 15 µH
91
1000
VIN = 36 V, L = 22 µH
88
85
1st line
2nd line
100
2nd line
eff - Efficiency (%)
100
VIN = 48 V, L = 15 µH
76
VIN = 48 V, L = 15 µH
82
VIN = 48 V, L = 22 µH
82
100
79
76
82
73
10
80
0
1
2
3
10
70
0.01
4
0.1
1
IOUT - Output Current (A)
IOUT - Output Current (A)
Fig. 23 - SiC468 Efficiency vs. Output Current,
VOUT = 12 V
Fig. 26 - SiC468 Efficiency vs. Output Current - Light Load,
VOUT = 12 V
Axis Title
Axis Title
10000
100
10000
100
90
1000
1st line
2nd line
70
60
50
100
40
80
1000
70
1st line
2nd line
80
2nd line
TC - Case Temperature (°C)
90
2nd line
TC - Case Temperature (°C)
1st line
2nd line
94
2nd line
eff - Efficiency (%)
96
2nd line
eff - Efficiency (%)
10000
VIN = 12 V, L = 10 µH
60
50
100
40
30
30
10
20
0
1
2
3
4
10
20
0
1
2
3
4
IOUT - Output Current (A)
IOUT - Output Current (A)
Fig. 24 - SiC468 Load Current vs. Case Temperature,
VIN = 48 V, VOUT = 5 V
Fig. 27 - SiC468 Load Current vs. Case Temperature,
VIN = 48 V, VOUT = 12 V
S21-1151-Rev. H, 06-Dec-2021
Document Number: 76044
14
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiC466, SiC467, SiC468, SiC469
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Vishay Siliconix
ELECTRICAL CHARACTERISTICS (VIN = 48 V, VOUT = 5 V, fsw = 300 kHz, SiC469 (2 A), unless otherwise noted)
Axis Title
Axis Title
100
100
10000
VIN = 12 V, L = 10 µH
98
97
94
1000
90
1st line
2nd line
92
VIN = 24 V, L = 15 µH
88
VIN = 36 V, L = 15 µH
86
100
VIN = 48 V, L = 15 µH
84
91
1000
88
85
VIN = 24 V, L = 15 µH
82
VIN = 36 V, L = 15 µH
79
73
10
80
0
1
70
0.01
2
1
IOUT - Output Current (A)
Fig. 28 - SiC469 Efficiency vs. Output Current,
VOUT = 5 V
Fig. 31 - SiC469 Efficiency vs. Output Current - Light Load,
VOUT = 5 V
Axis Title
Axis Title
100
97
96
94
94
1000
VIN = 24 V, L = 15 µH
92
VIN = 36 V, L = 22 µH
90
88
VIN = 48 V, L = 22 µH
100
86
2nd line
eff - Efficiency (%)
98
84
10000
VIN = 24 V, L = 15 µH
91
1000
88
VIN = 36 V, L = 22 µH
1st line
2nd line
10000
1st line
2nd line
2nd line
eff - Efficiency (%)
10
0.1
IOUT - Output Current (A)
100
85
VIN = 48 V, L = 22 µH
82
100
79
76
82
73
10
80
0
1
70
0.01
2
10
0.1
1
IOUT - Output Current (A)
IOUT - Output Current (A)
Fig. 29 - SiC469 Efficiency vs. Output Current,
VOUT = 12 V
Fig. 32 - SiC469 Efficiency vs. Output Current - Light Load,
VOUT = 12 V
Axis Title
Axis Title
10000
100
10000
100
90
1000
1st line
2nd line
70
60
50
100
40
30
80
1000
70
1st line
2nd line
80
2nd line
TC - Case Temperature (°C)
90
2nd line
TC - Case Temperature (°C)
100
VIN = 48 V, L = 15 µH
76
82
1st line
2nd line
94
2nd line
eff - Efficiency (%)
96
2nd line
eff - Efficiency (%)
10000
VIN = 12 V, L = 10 µH
60
50
100
40
30
10
20
0
1
2
10
20
0
1
2
IOUT - Output Current (A)
IOUT - Output Current (A)
Fig. 30 - SiC469 Load Current vs. Case Temperature,
VIN = 48 V, VOUT = 5 V
Fig. 33 - SiC469 Load Current vs. Case Temperature,
VIN = 48 V, VOUT = 12 V
S21-1151-Rev. H, 06-Dec-2021
Document Number: 76044
15
For technical questions, contact: powerictechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiC466, SiC467, SiC468, SiC469
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Vishay Siliconix
ELECTRICAL CHARACTERISTICS (VIN = 48 V, VOUT = 5 V, fsw = 300 kHz, SiC467 (6 A), unless otherwise noted)
Axis Title
Axis Title
1.04
10000
1.04
10000
1.03
1.03
1.00
0.99
100
0.98
1.01
1000
1.00
1st line
2nd line
1.01
2nd line
Normalized Efficiency
1000
1st line
2nd line
2nd line
Normalized Efficiency
1.02
1.02
0.99
0.98
0.97
100
0.96
0.95
0.97
0.94
10
0.96
0
0.93
0
100 200 300 400 500 600 700 800 900
200
400
1000
10
1200
fsw - Switching Frequency (kHz)
Fig. 34 - SiC466 Efficiency vs. Switching Frequency
Fig. 37 - SiC467 Efficiency vs. Switching Frequency
Axis Title
1.04
1.04
1.03
1.03
4000
10000
1.02
0.99
200
0.98
0.97
0.96
1.01
1000
1.00
1st line
2nd line
1.00
1st line
2nd line
1.01
2nd line
Normalized Efficiency
1.02
2nd line
Normalized Efficiency
800
fsw - Switching Frequency (kHz)
Axis Title
0.99
0.98
100
0.97
0.96
0.95
0.95
0.94
0
200
400
600
800
1000
10
1200
0.94
0
200
400
600
800
1000
10
1200
fsw - Switching Frequency (kHz)
fsw - Switching Frequency (kHz)
Fig. 35 - SiC468 Efficiency vs. Switching Frequency
Fig. 38 - SiC469 Efficiency vs. Switching Frequency
Axis Title
Axis Title
2.00
10000
10000
808
1.80
1000
1.20
1.00
0.80
100
0.60
0.40
0.20
10
0
-60 -40 -20
0
20
40
60
80 100 120 140
804
1000
802
1st line
2nd line
1.40
2nd line
VFB - Voltage Reference (mV)
806
1.60
1st line
2nd line
2nd line
RDS(on) - Normalized On-State Resistance
600
800
798
100
796
794
10
792
-60 -40 -20
0
20
40
60
80 100 120 140
T - Temperature (°C)
T - Temperature (°C)
Fig. 36 - RDS(ON) vs. Temperature
Fig. 39 - Voltage Reference vs. Temperature
S21-1151-Rev. H, 06-Dec-2021
Document Number: 76044
16
For technical questions, contact: powerictechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiC466, SiC467, SiC468, SiC469
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Vishay Siliconix
ELECTRICAL CHARACTERISTICS (VIN = 48 V, VOUT = 5 V, fsw = 300 kHz, SiC467 (6 A), unless otherwise noted)
Axis Title
Axis Title
10000
0.8
0.6
1000
1st line
2nd line
0.2
0
-0.2
100
-0.4
0.4
1000
0.2
1st line
2nd line
0.4
2nd line
Load Regulation (%)
0.6
2nd line
Line Regulation (%)
10000
0.8
0
-0.2
100
-0.4
-0.6
-0.6
10
-0.8
0
6
12
18
24
30
36
42
48
54
10
-0.8
0
60
1
2
Fig. 40 - Line Regulation
Fig. 43 - Load Regulation
5
4
3
100
2
1
10
0
18
24
30
36
42
48
54
10000
8
7
6
1000
5
1st line
2nd line
1000
2nd line
IVCIN_SHDN + IVIN_SHDN - Shutdown Current (µA)
6
1st line
2nd line
2nd line
IVCIN_SHDN + IVIN_SHDN - Shutdown Current (µA)
7
12
6
Axis Title
10000
4
3
100
2
1
10
0
60
-60 -40 -20
0
20
40
60
80 100 120 140
VCIN / VIN - Input Voltage (V)
T - Temperature (°C)
Fig. 41 - Shutdown Current vs. Input Voltage
Fig. 44 - Shutdown Current vs. Junction Temperature
Axis Title
Axis Title
190
10000
10000
220
180
1000
150
140
130
100
120
110
100
10
90
0
6
12
18
24
30
36
42
48
54
60
180
1000
160
1st line
2nd line
160
2nd line
IVCIN + IVIN - Input Current (µA)
200
170
1st line
2nd line
2nd line
IVCIN + IVIN - Input Current (µA)
5
IOUT - Output Current (A)
Axis Title
6
4
VIN - Input Voltage (V)
8
0
3
140
120
100
100
80
10
60
-60 -40 -20
0
20
40
60
80 100 120 140
VCIN / VIN - Input Voltage (V)
T - Temperature (°C)
Fig. 42 - Input Current vs. Input Voltage
Fig. 45 - Input Current vs. Junction Temperature
S21-1151-Rev. H, 06-Dec-2021
Document Number: 76044
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SiC466, SiC467, SiC468, SiC469
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Vishay Siliconix
ELECTRICAL CHARACTERISTICS (VIN = 48 V, VOUT = 5 V, fsw = 300 kHz, SiC467 (6 A), unless otherwise noted)
Axis Title
Axis Title
10000
2.4
1.2
10000
VEN = 5.0 V
1000
VIH_EN
1.5
1.2
VIL_EN
0.9
100
1.0
0.8
0.7
0.6
0.6
0.3
0.5
10
0
-60 -40 -20
0
20
40
60
80 100 120 140
1000
0.9
1st line
2nd line
1.8
2nd line
EN Current, IEN (µA)
1.1
1st line
2nd line
2nd line
VEN - EN Logic Threshold (V)
2.1
100
10
0.4
-60 -40 -20
0
20
40
60
80 100 120 140
T - Temperature (°C)
T - Temperature (°C)
Fig. 46 - EN Logic Threshold vs. Junction Temperature
Fig. 49 - EN Current vs. Junction Temperature
Fig. 47 - Load Transient (3 A to 6 A), Time = 100 μs/div
Fig. 50 - Line Transient (8 V to 48 V), Time = 10 ms/div
Fig. 48 - Start-Up with EN, Time = 1 ms/div
Fig. 51 - Start-up with VIN, Time = 5 ms/div
S21-1151-Rev. H, 06-Dec-2021
Document Number: 76044
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Vishay Siliconix
ELECTRICAL CHARACTERISTICS (VIN = 48 V, VOUT = 5 V, fsw = 300 kHz, SiC467 (6 A), unless otherwise noted)
Fig. 52 - Output Ripple 2 A, Time = 5 μs/div
Fig. 54 - Output Ripple 300 mA, Time = 5 μs/div
Fig. 53 - Output Ripple PSM, Time = 10 ms/div
S21-1151-Rev. H, 06-Dec-2021
Document Number: 76044
19
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Vishay Siliconix
PCB LAYOUT RECOMMENDATIONS
Step 1: VIN/GND Planes and Decoupling
Step 3: VSWH Plane
Snubber
VIN plane
PGND plane
VSWH
PGND plane
Fig. 57
VSWH
1. Connect output inductor to SiC46x with large plane to
lower the resistance
Fig. 55
1. Layout VIN and PGND planes as shown above
2. Ceramic capacitors should be placed between VIN and
PGND, and very close to the device for best decoupling
effect
2. If any snubber network is required, place the
components on the bottom side as shown above
Step 4: VDD/VDRV Input Filter
3. Different values / packages of ceramic capacitors should
be used to cover entire decoupling spectrum e.g. 1210
and 0603
4. Smaller capacitance values, placed closer to device’s
VIN pin(s), is better for high frequency noise absorbing
AGND
Step 2: VCIN Pin
VCIN decouple
cap
P
G
N
D
AGND plane
Fig. 58
Fig. 56
1. VCIN (pin 1) is the input pin for both internal LDO and tON
block. tON time varies based on input voltage. It is
necessary to put a decoupling capacitor close to this pin
1. CVDD cap should be placed between pin 26 and pin 23
(the AGND of driver IC) to achieve best noise filtering
2. CVDRV cap should be placed close to VDRV (pin 16) and
PGND (pin 17) to reduce effects of trace impedance and
provide maximum instantaneous driver current for low
side MOSFET during switching cycle
2. The connection can be made through a via and the cap
can be placed at bottom layer
S21-1151-Rev. H, 06-Dec-2021
Document Number: 76044
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Step 5: BOOT Resistor and Capacitor Placement
Vishay Siliconix
Step 6: Signal Routing
AGND
plane
PGND
V
o
u
t
s
i
g
n
a
l
Fig. 60
Fig. 59
1. These components need to be placed very close
to SiC46x, right between PHASE (pin 5, 6) and BOOT
(pin 4)
2. In order to reduce parasitic inductance, it is
recommended to use 0402 chip size for the resistor and
the capacitor
1. Separate the small analog signal from high current path.
As shown above, the high current paths with high dv/dt,
di/dt are placed on the left side of the IC, while the small
control signals are placed on the right side of the IC. All
the components for small analog signal should be
placed closer to IC with minimum trace length
2. Pin 23 is the IC analog ground, which should have a
single connection to power ground. The AGND ground
plane connected with pin 23 helps keep AGND quiet and
improve noise immunity
3. Feedback signal can be routed through inner layer. Make
sure this signal is far away from VSWH node and shielded
by inner ground layer
S21-1151-Rev. H, 06-Dec-2021
Document Number: 76044
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Step 7: Adding Thermal Relief Vias and Duplicate Power
Path Plane
Vishay Siliconix
Step 8: Ground Layer
AGND plane
VIN plane
PGND plane
PGND plane
VSWH
Fig. 61
Fig. 62
1. Thermal relief vias can be added on the VIN and PGND
pads to utilize inner layers for high current and thermal
dissipation
1. It is recommended to make the entire inner layer (next to
top layer) ground plane
2. To achieve better thermal performance, additional vias
can be put on VIN and PGND plane. Also, it is necessary
to duplicate the VIN and ground planes at bottom layer to
maximize the power dissipation capability from PCB.
2. This ground plane provides shielding between noise
source on top layer and signal trace within inner layer.
3. The ground plane can be broken into two sections as
PGND and AGND
3. VSWH pad is a noise source and not recommended to put
vias on this pad.
4. 8 mil drill for pads and 10 mils drill for plane are optional
via sizes. The vias on pads may drain solder during
assembly and cause assembly issues. Please consult
with the assembly house for guidelines
S21-1151-Rev. H, 06-Dec-2021
Document Number: 76044
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SiC466, SiC467, SiC468, SiC469
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Vishay Siliconix
PRODUCT SUMMARY
Part number
Description
SiC466
SiC467
SiC468
SiC469
10 A, 4.5 V to 60 V input, 6 A, 4.5 V to 60 V input,
2 A, 4.5 V to 60 V input,
4 A, 4.5 V to 60 V input,
100 kHz to 2 MHz,
100 kHz to 2 MHz,
100 kHz to 2 MHz,
100 kHz to 2 MHz,
synchronous microBUCK synchronous microBUCK synchronous microBUCK synchronous microBUCK
regulator
regulator
regulator
regulator
Input voltage min. (V)
4.5
4.5
4.5
Input voltage max. (V)
60
60
60
60
Output voltage min. (V)
0.8
0.8
0.8
0.8
Output voltage max. (V)
15
15
15
15
Continuous current (A)
10
6
4
2
Switch frequency min. (kHz)
100
100
100
100
Switch frequency max. (kHz)
2000
2000
2000
2000
Pre-bias operation (yes / no)
Yes
Yes
Yes
Yes
Internal bias reg. (yes / no)
4.5
Yes
Yes
Yes
Yes
Internal
Internal
Internal
Internal
Enable (yes / no)
Yes
Yes
Yes
Yes
PGOOD (yes / no)
Yes
Yes
Yes
Yes
Overcurrent protection
Yes
Yes
Yes
Yes
Protection
OVP, OCP, UVP/SCP,
OTP, UVLO
OVP, OCP, UVP/SCP,
OTP, UVLO
OVP, OCP, UVP/SCP,
OTP, UVLO
OVP, OCP, UVP/SCP,
OTP, UVLO
Light load mode
Selectable powersave
Selectable powersave
Selectable powersave
Selectable powersave
97
98
98
98
PowerPAK MLP55-27L
PowerPAK MLP55-27L
PowerPAK MLP55-27L
PowerPAK MLP55-27L
5 x 5 x 0.75
Compensation
Peak efficiency (%)
Package type
Package size (W, L, H) (mm)
5 x 5 x 0.75
5 x 5 x 0.75
5 x 5 x 0.75
Status code
1
1
1
1
Product type
microBUCK (step down
regulator)
microBUCK (step down
regulator)
microBUCK (step down
regulator)
microBUCK (step down
regulator)
Applications
Computing, consumer,
industrial, healthcare,
networking
Computing, consumer,
industrial, healthcare,
networking
Computing, consumer,
industrial, healthcare,
networking
Computing, consumer,
industrial, healthcare,
networking
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package / tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?76044.
S21-1151-Rev. H, 06-Dec-2021
Document Number: 76044
23
For technical questions, contact: powerictechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
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requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer's responsibility to validate that a particular product
with the properties described in the product specification is suitable for use in a particular application. Parameters provided in
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parameters, including typical parameters, must be validated for each customer application by the customer's technical experts.
Product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited
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Revision: 09-Jul-2021
1
Document Number: 91000