VBUS54CV-HSF
www.vishay.com
Vishay Semiconductors
4-Line BUS-Port ESD Protection
FEATURES
• Ultra compact LLP75-6L package
• 4-line USB ESD protection
6
5
4
• Low leakage current
• Low load capacitance CD = 1.2 pF
20397
1
2
• ESD immunity acc. IEC 61000-4-2
± 30 kV contact discharge
± 30 kV air discharge
3
• High surge current acc. IEC 61000-4-5 Ipp > 11 A
20453
• e4 - precious metal (e.g. Ag, Au, NiPd, NiPdAu),
(no Sn)
1
MARKING (example only)
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
XX
YY
21001
Dot = pin 1 marking
XX = date code
YY = type code (see table below)
DESIGN SUPPORT TOOLS
click logo to get started
Models
Available
ORDERING INFORMATION
DEVICE NAME
ORDERING CODE
TAPED UNITS PER REEL
(8 mm TAPE ON 7" REEL)
MINIMUM ORDER QUANTITY
VBUS54CV-HSF
VBUS54CV-HSF-G4-08
3000
15 000
PACKAGE DATA
DEVICE NAME
PACKAGE
NAME
TYPE
CODE
WEIGHT
MOLDING COMPOUND
FLAMMABILITY RATING
MOISTURE
SENSITIVITY LEVEL
SOLDERING CONDITIONS
VBUS54CV-HSF
LLP75-6L
UC
4.2 mg
UL 94 V-0
MSL level 1
(according J-STD-020)
Peak temperature max. 260 °C
ABSOLUTE MAXIMUM RATINGS VBUS54CV-HSF
PARAMETER
Peak pulse current
Peak pulse power
ESD immunity
Operating temperature
Storage temperature
Rev. 1.3, 04-Jan-2019
TEST CONDITIONS
Pin 1, 3, 4 or 6 to pin 2
acc. IEC 61000-4-5, tp = 8/20 μs/single shot
Pin 5 to pin 2
acc. IEC 61000-4-5; tp = 8/20 μs; single shot
Pin 1, 3, 4 or 6 to pin 2
acc. IEC 61000-4-5, tp = 8/20 μs/single shot
Pin 5 to pin 2
acc. IEC 61000-4-5; tp = 8/20 μs; single shot
Contact discharge acc. IEC 61000-4-2; 10 pulses
Air discharge acc. IEC 61000-4-2; 10 pulses
Junction temperature
SYMBOL
VALUE
UNIT
11
A
IPPM
13
242
W
PPP
246
VESD
± 30
± 30
kV
TJ
-40 to +125
°C
TSTG
-40 to +150
°C
Document Number: 84145
1
For technical questions, contact: ESDprotection@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VBUS54CV-HSF
www.vishay.com
Vishay Semiconductors
ELECTRICAL CHARACTERISTICS VBUS54CV-HSF (pin 1, 3, 4, or 6 to pin 2)
(Tamb = 25 °C, unless otherwise specified)
PARAMETER
Protection paths
Reverse stand-off voltage
TEST CONDITIONS/REMARKS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Number of lines which can be protected
Nchannel
-
-
4
lines
V
Max. reverse working voltage
VRWM
-
-
5.5
Reverse voltage
at IR = 0.1 μA
VR
5.5
-
-
V
Reverse current
at VRWM = 5.5 V
IR
-
0.01
0.1
μA
Reverse breakdown voltage
at IR = 1 mA
VBR
7
7.9
8.6
V
Reverse clamping voltage
at IPP = 11 A
VC
-
18
22
V
Forward clamping voltage
at IPP =11 A
VF
-
6.5
8
V
VR (at I/O pin) = 0 V
VR (at pin 5) = 5 V; f = 1 MHz
CD
-
1.2
2.5
pF
Difference of the line capacitances
dCD
-
-
0.2
pF
TEST CONDITIONS/REMARKS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Capacitance
Line symmetry
ELECTRICAL CHARACTERISTICS (pin 5 to pin 2)
(Tamb = 25 °C, unless otherwise specified)
PARAMETER
Max. reverse working voltage
VRWM
-
-
5.5
V
Reverse voltage
at IR = 0.1 μA; pin 2 to pin 1
VR
5.5
-
-
V
Reverse current
Reverse stand-off voltage
at VRWM = 5.5 V
IR
-
0.01
0.1
μA
Reverse breakdown voltage
at IR = 1 mA
VBR
6.3
7.1
8
V
Reverse clamping voltage
at IPP = 13 A
VC
-
18
22
V
at IPP =13 A
VF
-
-
7
V
VR (at pin 5) = 0 V; f = 1 MHz
CD
-
190
-
pF
Forward clamping voltage
Capacitance
APPLICATION NOTE
With the VBUS54CV-HSF a double, high speed USB-port can be protected against transient voltage signals. Negative
transients will be clamped close below the ground level while positive transients will be clamped close above the working range.
An avalanche diode clamps the supply line (VBUS at pin 5) to ground (pin 2). The high speed data lines, D1+, D2+, D1- and D2-,
are connected to pin 1, 3, 4 and 6. As long as the signal voltage on the data lines is between the ground- and the VBUS -level,
the low capacitance PN-diodes offer a very high isolation to VBUS, ground and to the other data lines. But as soon as any
transient signal exceeds this working range, one of the PN-diodes gets in the forward mode and clamps the transient to ground
or the avalanche break through voltage level.
t
w VBUS
i D1+
n D1U
S
B
P
o D2+
r D2t G
ND
6
5
4
1
2
3
R
E
C
E
I
V
E
R
IC
20399
Rev. 1.3, 04-Jan-2019
Document Number: 84145
2
For technical questions, contact: ESDprotection@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VBUS54CV-HSF
www.vishay.com
Vishay Semiconductors
TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
200
120 %
100 %
Discharge Current IESD
f = 1 MHz
180
Rise time = 0.7 ns to 1 ns
160
140
CD (pF)
80 %
60 %
53 %
P in 5 to pin 2
120
100
80
40 %
60
27 %
40
20 %
20
0
0%
-10 0 10 20 30 40 50 60 70 80 90 100
0
1
2
3
21357
Time (ns)
20557
Fig. 1 - ESD Discharge Current Wave Form
acc. IEC 61000-4-2 (330 /150 pF)
4
5
6
VR (V)
Fig. 4 - Typical Capacitance CD vs. Reverse Voltage VR
100
8 µs to 100 %
100 %
10
80 %
IF (mA)
Pin 5 to pin 2
IPPM
60 %
20 µs to 50 %
40 %
1
0.1
Pin 1, 3, 4 or 6 to pin 2
0.01
20 %
0%
0
10
20
30
Time (µs)
20548
0.001
0.5
40
Fig. 2 - 8/20 μs Peak Pulse Current Wave Form
acc. IEC 61000-4-5
0.7
0.8
0.9
1
VF (V)
Fig. 5 - Typical Forward Current IF vs. Forward current IR
9
2.5
f = 1 MHz
8
2.0
Pin 1, 3, 4 or 6 to pin 2
7
Pin 1, 3, 4 or 6 to pin 2
6
1.5
VR (V)
CD (pF)
0.6
21358
VR at pin 5 = 5 V
1.0
Pin 5 to pin 2
5
4
3
2
0.5
1
0
0.01
0
0
21356
1
2
3
4
5
6
VR (V)
Fig. 3 - Typical Capacitance CD vs. Reverse Voltage VR
Rev. 1.3, 04-Jan-2019
21359
0.1
1
10
100
1000 10 000
IR (µA)
Fig. 6 - Typical Reverse Voltage VR vs. Reverse Current IR
Document Number: 84145
3
For technical questions, contact: ESDprotection@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VBUS54CV-HSF
www.vishay.com
Vishay Semiconductors
25
60
P in 1, 3, 4 o r 6 to pin 2
acc. IEC 61000-4-2
+ 8 kV
contact discharge
Pin 1, 3, 4 or 6 to pin 2
40
20
VC-ESD (V)
VC (V)
20
15
10
P in 5 to pin 2
VC
0
- 20
- 40
5
- 60
Measured acc. IEC 61000-4-5 (8/20µs - wave form)
0
0
21360
5
10
- 80
- 10 0 10 20 30 40 50 60 70 80 90
15
IPP (A)
Fig. 7 - Typical Peak Clamping Voltage vs.
Peak Pulse Current IPP
21362
Fig. 9 - Typical Clamping Performance at 8 kV
Contact Discharge (acc. IEC 61000-4-2)
300
80
60
acc. IEC 61000-4-2
+ 8 kV
contact discharge
Pin 1, 3, 4 or 6 to pin 2
100
VC-ESD (V)
20
- 100
- 20
- 200
21361
- 300
0
10 20 30 40 50 60 70 80 90
t (ns)
Fig. 8 - Typical Clamping Performance at 8 kV
Contact Discharge (acc. IEC 61000-4-2)
Rev. 1.3, 04-Jan-2019
VC-ESD
0
0
- 40
- 10 0
acc. IEC 61000-4-2
contact discharge
Pin 1, 3, 4 or 6 to pin 2
200
40
VC-ESD (V)
t (ns)
21363
5
10
15
20
25
30
VESD (kV)
Fig. 10 - Typical Peak Clamping Voltage at ESD
Contact Discharge (acc. IEC 61000-4-2)
Document Number: 84145
4
For technical questions, contact: ESDprotection@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VBUS54CV-HSF
www.vishay.com
Vishay Semiconductors
0.45 (0.018)
0.55 (0.022)
0.2 (0.008)
0.3 (0.012)
0.2 (0.008)
0.3 (0.012)
1 (0.039)
0.2 (0.008)
0.3 (0.012)
Heat sink
0.95 (0.037)
1.05 (0.041)
PACKAGE DIMENSIONS in millimeters (inches): LLP75-6L
0.5 (0.020)
0.6 (0.024)
0.54 (0.021)
0.60 (0.023)
0.05 (0.002)
0 (0.000)
0.15 (0.006)
0.25 (0.010)
1.65 (0.065)
1.55 (0.061)
1.55 (0.061)
1.65 (0.065)
Pin 1 marking
Foot print recommendation:
0.5 (0.020)
0.5 (0.020)
0.3 (0.012)
0.3 (0.012)
Document no.:S8-V-3906.02-010 (4)
Created - Date: 04. MAY 2005
Rev. 4 - Date: 21. March 2006
0.15 (0.006)
1 (0.039)
0.5 (0.020)
1 (0.039)
0.25 (0.010)
0.15 (0.006)
Solder resist mask
Solder pad
0.5 (0.020)
20454
Rev. 1.3, 04-Jan-2019
Document Number: 84145
5
For technical questions, contact: ESDprotection@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VBUS54CV-HSF
www.vishay.com
Vishay Semiconductors
LLP75-6x
S9
F5
Pad layout - view from top / seen at bottom side
S8-V-3906.02-004 (4)
10.01.2005
Rev. 1.3, 04-Jan-2019
Pin 1 - location
Document Number: 84145
6
For technical questions, contact: ESDprotection@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
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Disclaimer
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
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Revision: 01-Jan-2023
1
Document Number: 91000