VS-GT75YF120NT
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IGBT 4 Pack Module, 75 A
FEATURES
• Trench gate field stop IGBT
• Square RBSOA
• HEXFRED® low Qrr, low switching energy
• Positive VCE(on) temperature coefficient
• Copper baseplate
• Low stray inductance design
• Designed and qualified for industrial market
ECONO 2
(Package example)
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
BENEFITS
• Benchmark efficiency for SMPS appreciation in particular
HF welding
PRIMARY CHARACTERISTICS
VCES
1200 V
IC at TC = 87 °C
75 A
VCE(on) (typical)
2.20 V
Speed
8 kHz to 30 kHz
Package
ECONO 2
Circuit configuration
4 pack
• Rugged transient performance
• Low EMI, requires less snubbing
• Direct mounting to heatsink space saving
• PCB solderable terminals
• Low junction to case thermal resistance
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Collector to emitter voltage
Continuous collector current
SYMBOL
IC
Pulsed collector current, see fig. C.T.5
ICM
Clamped inductive load current
ILM
Diode continuous forward current
IF
Diode maximum forward current
IFM
Gate to emitter voltage
VGE
Maximum power dissipation (IGBT)
Isolation voltage
TEST CONDITIONS
VCES
PD
VISOL
MAX.
UNITS
1200
V
TC = 25 °C
118
TC = 80 °C
81
TJ = 150 °C, tp = 6 ms, VGE = 15 V
270
250
TC = 25 °C
TC = 80 °C
A
40
25
150
± 20
TC = 25 °C
431
TC = 80 °C
241
AC 2500 (min)
V
W
V
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ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
Collector to emitter breakdown voltage
VBR(CES)
Collector to emitter voltage
VCE(ON)
Gate threshold voltage
Threshold voltage temperature coefficient
VGE(th)
ΔVGE(th)/ΔTJ
Zero gate voltage collector current
ICES
Diode forward voltage drop
VFM
Gate to emitter leakage current
IGES
MIN.
TYP.
MAX.
VGE = 0 V, IC = 4 mA
TEST CONDITIONS
1200
-
-
IC = 75 A, VGE = 15 V
-
2.20
2.60
IC = 75 A, VGE = 15 V, TJ = 125 °C
-
2.44
7.6
VCE = VGE, IC = 4 mA
UNITS
V
4.6
5.9
VCE = VGE, IC = 4 mA (25 °C to 125 °C)
-
-13
-
VGE = 0 V, VCE = 1200 V
-
1.4
100
VGE = 0 V, VCE = 1200 V, TJ = 125 °C
-
1130
-
IF = 75 A
-
3.9
5
IF = 75 A, TJ = 125 °C
-
4.37
-
VGE = ± 20 V
-
-
± 200
nA
MIN.
TYP.
MAX.
UNITS
IC = 75 A
VCC = 960 V
VGE = 15 V
-
333
-
mV/°C
μA
V
SWITCHING CHARACTERISTICS (TJ = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
Total gate charge (turn-on)
QG
Gate to emitter charge (turn-on)
QGE
Gate to collector charge (turn-on)
QGC
Turn-on switching loss
Eon
Turn-off switching loss
Eoff
Total switching loss
Etot
Turn-on switching loss
Eon
Turn-off switching loss
Eoff
Total switching loss
Etot
Turn-on delay time
td(on)
Rise time
Turn-off delay time
Fall time
tr
td(off)
TEST CONDITIONS
-
36
-
-
173
-
IC = 75 A, VCC = 600 V
VGE = 15 V, Rg = 4.7 Ω, L = 500 μH
TJ = 25 °C (1)
-
2.08
-
-
2.56
-
-
4.64
-
IC = 75 A, VCC = 600 V
VGE = 15 V, Rg = 4.7 Ω, L = 500 μH
TJ = 125 °C (1)
-
3.35
-
-
4.28
-
-
7.63
-
-
94
-
-
21
-
-
157
-
-
179
-
IC = 75 A, VCC = 600 V
VGE = 15 V, Rg = 4.7 Ω, L = 500 μH
TJ = 125 °C
tf
Reverse bias safe operating area
RBSOA
TJ = 150 °C, IC = 250 A, VCC = 700 V,
VP = 1200 V, Rg = 10 Ω,
VGE = 15 V to 0 V
Short circuit safe operating area
SCSOA
TJ = 150 °C
VCC = 600 V, VP = 1200 V
Rg = 10 Ω, VGE = 15 V to 0 V
Diode peak reverse recovery current
Irr
Diode reverse recovery time
trr
Total reverse recovery charge
Qrr
-
-
TJ = 25 °C
-
1.45
-
TJ = 125 °C
-
2.35
-
-
0.401
-
-
0.655
-
TJ = 25 °C
-
0.181
-
TJ = 125 °C
-
0.54
-
TJ = 125 °C
VCC = 600 V
IF = 75 A
dI/dt = 10 A/μs
mJ
ns
Fullsquare
10
TJ = 25 °C
nC
μs
A
μs
μC
Note
(1) Energy losses include “tail” and diode reverse recovery
INTERNAL NTC - THERMISTOR SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
TYP.
R25
TC= 25 °C
5000
R100
TC= 100 °C
493 ± 5 %
B25/50
R2 = R25 exp. [B25/50 (1/T2 - 1/(298.15K))]
3375 ± 5 %
K
220
°C
Dissipation constant
2
mW/°C
Thermal time constant
8
s
Resistance
B-value
Maximum operating temperature
UNITS
Ω
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THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNITS
TJ, TStg
-40
-
150
°C
Junction to case IGBT
RthJC
-
-
0.29
Junction to case DIODE
RthJC
-
-
1
Case to sink per module
RthCS
Junction and storage temperature range
TEST CONDITIONS
Mounting torque (M5)
Weight
-
0.05
-
2.7
-
3.3
Nm
-
170
-
g
180
Allowable Case Temperature (°C)
200
175
150
TJ = 125 °C
125
IC (A)
°C/W
100
TJ = 25 °C
75
TJ = 150 °C
50
25
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
160
140
120
DC
100
80
60
40
20
0
0
4.0
20
40
60
80
100
120
VCE (V)
IC - Continuous Collector Current (A)
Fig. 1 - Typical Trench IGBT Output Characteristics, VGE = 15 V
Fig. 3 - Maximum Trench IGBT Continuous Collector Current vs.
Case Temperature
200
100
180
160
140
80
70
120
60
IC (A)
IC (A)
VCE = 20 V
90
VGE = 12 V
VGE = 15 V
VGE = 18 V
100
80
50
40
60
VGE = 9 V
30
40
20
20
10
0
0
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
VCE (V)
Fig. 2 - Typical Trench IGBT Output Characteristics, TJ = 125 °C
TJ = 125 °C
TJ = 25 °C
5
5.5
6
6.5
7
7.5
8
8.5
9
VGE (V)
Fig. 4 - Typical Trench IGBT Transfer Characteristics
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1000
6.5
TJ = 25 °C
tf
Switching Time (ns)
6.0
VGEth (V)
5.5
5.0
4.5
TJ = 125 °C
4.0
td(off)
td(on)
100
10
tr
3.5
3.0
1
0
0.5
1
1.5
2
2.5
3
3.5
4
20
30
40
50
IC (mA)
60
70
80
IC (A)
Fig. 5 - Typical Trench IGBT Gate Threshold Voltage
Fig. 8 - Typical Trench IGBT Switching Time vs. IC
(with Antiparallel Diode)
TJ = 125 °C, VCC = 600 V, Rg = 4.7 Ω, VGE = +15 V/-15 V, L = 500 μH
16
10
TJ = 150 °C
12
0.1
Energy (mJ)
ICES (mA)
14
TJ = 125 °C
1
0.01
8
Eon
6
4
TJ = 25 °C
0.001
10
Eoff
2
0.0001
0
200
400
600
800
1000
1200
0
5
10
15
20
VCES (V)
Fig. 6 - Typical Trench IGBT Zero Gate Voltage Collector Current
25
30
35
40
45
50
Rg (:)
Fig. 9 - Typical Trench IGBT Energy Loss vs. Rg
(with Antiparallel Diode)
TJ = 125 °C, VCC = 600 V, IC = 75 A, VGE = +15 V/-15 V, L = 500 μH
1000
5
4.5
Switching Time (ns)
4
Energy (mJ)
3.5
3
2.5
Eoff
2
1.5
Eon
1
tf
100
td(off) td(on)
tr
0.5
10
0
20 25 30 35 40 45 50 55 60 65 70 75 80
IC (A)
Fig. 7 - Typical Trench IGBT Energy Loss vs. IC
(with Antiparallel Diode)
TJ = 125 °C, VCC = 600 V, Rg = 4.7 Ω, VGE = +15 V/-15 V, L = 500 μH
0
5
10
15
20
25
30
35
40
45
50
Rg (Ω)
Fig. 10 - Typical Trench IGBT Switching Time vs. Rg
(with Antiparallel Diode)
TJ = 125 °C, VCC = 600 V, IC = 75 A, VGE = +15 V/-15 V, L = 500 μH
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12
18
16
10
14
TJ =125 °C
8
10
Irr (A)
VGE (V)
12
8
4
6
TJ = 25 °C
4
TJ = 25 °C
VCE= 960 V
IC = 75 A
2
2
0
0
0
50
100
150
200
250
300
350
0
400
20
40
60
80
100
QG (nC)
dIF/dt (A/μs)
Fig. 11 - Typical Trench IGBT Gate Charge vs.
Gate to Emitter Voltage
Fig. 14 - Typical Diode Reverse Recovery Current vs. dIF/dt
1600
150
140
130
120
110
100
90
80
70
60
50
40
30
20
10
0
TJ = 125 °C
1400
1200
1000
Qrr (nC)
IF (A)
6
TJ = 125 °C
TJ = 25 °C
800
600
400
TJ = 25 °C
200
0
0
1.0
2.0
3.0
4.0
5.0
6.0
0
7.0
20
40
60
80
100
VFM (V)
dIF/dt (A/μs)
Fig. 12 - Typical Diode Forward Characteristics
Fig. 15 - Typical Diode Reverse Recovery Charge vs. dIF/dt
1000
800
700
100
600
400
IC (A)
trr (ns)
500
TJ = 125 °C
10
300
1
200
TJ = 25 °C
100
0
0.1
0
20
40
60
80
100
dIF/dt (A/μs)
Fig. 13 - Typical Diode Reverse Recovery Time vs. dIF/dt
1
10
100
1000
VCE (V)
Fig. 16 - Trench IGBT Reverse BIAS SOA
TJ = 150 °C, IC = 250 A, Rg = 10 Ω, VGE = +15 V / 0 V, VCC = 700 V,
Vp = 1200 V
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ICE - Collector-Emitter Current (A)
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tp = 100 μs
TA = 25 °C
TJ = 150 °C
Single pulse
tp = 500 μs
tp = 1 ms
tp = 6 ms
100
10
BVCES limited
1
0.1
1
10
100
1000
VCE - Collector-Emitter Voltage (V)
Fig. 17 - Trench IGBT Safe Operating Area
ZthJC - Thermal Impedance
Junction to Case (°C/W)
1
0.1
0.50
0.20
0.10
0.05
0.02
0.01
DC
0.01
0.001
0.0001
0.00001
0.0001
0.001
0.01
0.1
1
10
t1 - Rectangular Pulse Duration (s)
Fig. 18 - Maximum Trench IGBT Thermal Impedance ZthJC Characteristics
ZthJC - Thermal Impedance
Junction to Case (°C/W)
10
1
0.1
0.50
0.20
0.10
0.05
0.02
0.01
DC
0.01
0.001
0.000001
0.00001
0.0001
0.001
t1 - Rectangular Pulse Duration (s)
Fig. 19 - Maximum Diode Thermal Impedance ZthJC Characteristics
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Driver
L
+ VCC
-
D.U.T.
0
D +
C -
900 V
1K
D.U.T.
Fig. 20 - Gate Charge Circuit (Turn-Off)
Fig. 22 - S.C. SOA Circuit
L
Diode clamp/
D.U.T.
+
-
+
-
80 V
L
D.U.T.
-5V
1000 V
D.U.T./
Driver
Rg
+
VCC
Rg
Fig. 21 - RBSOA Circuit
Fig. 23 - Switching Loss Circuit
R=
VCC
ICM
D.U.T.
+
VCC
Rg
Fig. 24 - Resistive Load Circuit
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ORDERING INFORMATION TABLE
Device code
VS-
G
T
75
Y
F
120
N
T
1
2
3
4
5
6
7
8
9
1
-
Vishay Semiconductors product
2
-
Insulated gate bipolar transistor (IGBT)
3
-
T = Trench gate field stop IGBT
4
-
Current rating (75 = 75 A)
5
-
Circuit configuration (Y = 4 pack)
6
-
Package indicator (F = ECONO 2)
7
-
Voltage rating (120 = 1200 V)
8
-
Speed/type (N = ultrafast with reduced diode, speed 8 kHz to 60 kHz)
9
-
NTC Thermistor
CIRCUIT CONFIGURATION
21 20
50 49
QB1
QB3
41
28
29
42
QB2
8
6
7
QB4
37
32
38
33
18
12
13
14
19
46 45
25 24
NTC
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7.4
17
15.9
20.5
3.5
DIMENSIONS in millimeters
Ø 6.1
69.36
73.17
54.12
57.93
35.07
38.88
0.8
19.83
23.64
4.3
0.85
1.25
A
45
46
5.5
20.95
38 37
33 32
29 28
25
24
15.24
11.43
0
11
49
21
20
80.79
18 19
76.98
61.74
38.88
57.93
12 13 14
54.12
6 7 8
31.26
35.07
6.8
0
50
11.43
15.24
20.95
86.2
32
38.4
45
Ø
42 41
6.5
Ø 2.1
1.5
Ø 2.5
0.8
A 2:1
72.7
75.7
82.1
93
107.5
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Revision: 01-Jan-2023
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