VBUS054DD-HS4

VBUS054DD-HS4 www.vishay.com Vishay Semiconductors 4-Line BUS-Port ESD Protection FEATURES • Ultra compact LLP1010-5L package 5 6 4 • Low package height < 0.4 mm • 4-line USB ESD-protection • Low leakage current • Low load capacitance CD = 0.8 pF 1 2 3 20897 20896 • ESD-protection acc. IEC 61000-4-2 ± 15 kV contact discharge ± 15 kV air discharge • Pin plating NiPdAu (e4) no whisker growth • Compliant to RoHS Directive 2002/95/EC and in accordance to WEEE 2002/96/EC Note ** Please see document “Vishay Material Category Policy”: www.vishay.com/doc?99902 20932 MARKING (example only) XY Dot = pin 1 marking X = date code Y = type code (see table below) ORDERING INFORMATION DEVICE NAME VBUS054DD-HS4 ORDERING CODE VBUS54DD-HS4-G4-08 TAPED UNITS PER REEL (8 mm TAPE ON 7" REEL) 5000 MINIMUM ORDER QUANTITY 5000 PACKAGE DATA DEVICE NAME VBUS054DD-HS4 PACKAGE NAME LLP1010-6M TYPE CODE C WEIGHT 1.07 mg MOLDING COMPOUND FLAMMABILITY RATING UL 94 V-0 MOISTURE SENSITIVITY LEVEL MSL level 1 (according J-STD-020) SOLDERING CONDITIONS 260 °C/10 s at terminals ABSOLUTE MAXIMUM RATINGS PARAMETER Peak pulse current Peak pulse power ESD immunity Operating temperature Storage temperature TEST CONDITIONS Pin 1, 3, 4 or 5 to pin 2 or 6 acc. IEC 61000-4-5; tp = 8/20 µs; single shot Pin 1, 3, 4 or 5 to pin 2 or 6 acc. IEC 61000-4-5; tp = 8/20 µs; single shot Contact discharge acc. IEC 61000-4-2; 10 pulses Air discharge acc. IEC 61000-4-2; 10 pulses Junction temperature SYMBOL IPPM PPP VESD TJ TSTG VALUE 3 57 ± 15 ± 15 - 40 to + 125 - 55 to + 150 UNIT A W kV kV °C °C Rev. 1.0. 19-Sep-11 1 For technical questions, contact: ESDprotection@vishay.com Document Number: 83384 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VBUS054DD-HS4 www.vishay.com Vishay Semiconductors ELECTRICAL CHARACTERISTICS (Pin 1, 3, 4, or 5 to pin 2 or 6) PARAMETER Protection paths Reverse stand-off voltage Reverse current Reverse breakdown voltage Reverse clamping voltage Forward clamping voltage Capacitance at VIN = VRWM = 5.5 V at IR = 1 mA at IPP = 3 A acc. IEC 61000-4-5 at IF = 3 A acc. IEC 61000-4-5 VIN = 0 V; any other I/O pin at 3.3 V VIN = 2.5 V; any other I/O pin at 3.3 V TEST CONDITIONS/REMARKS Number of lines which can be protected SYMBOL Nchannel VRWM IR VBR VC VF CD MIN. 6.9 TYP. < 0.01 8 16 3.5 0.8 0.5 MAX. 4 5.5 0.1 8.7 19 4.5 1 0.8 UNIT lines V μA V V V pF pF Note • Ratings at 25 °C, ambient temperature unless otherwise specified. APPLICATION NOTE With the VBUS54DD-HS4 a double, high speed USB-port or up to 4 other high speed signal or data lines can be protected against transient voltage signals. Negative transients will be clamped close below the ground level while positive transients will be clamped close above the working range. The high speed data lines, D1+, D2+, D1- and D2-, are connected to pin 1, 3, 4, and 5, pin 2 or 6 are connected to ground. As long as the signal voltage on the data lines is between the ground- and the break down level, the low input capacitance of each channel offers a very high isolation to ground and to the other data lines. But as soon as any transient signal exceeds this working range, the VBUS054DD-HS4 clamps the transient to ground or to the avalanche break down voltage level. t w i n U S B P o r t 20897-1 VBUS D1+ D15 6 4 R E C E I V E R IC 1 2 3 D2+ D2GND TYPICAL CHARACTERISTICS Tamb = 25 °C, unless otherwise specified 120 % 100 % 80 % 60 % 20 µs to 50 % 40 % 20 % 0% 0 20548 8 µs to 100 % Rise time = 0.7 ns to 1 ns Discharge Current IESD 40 100 % 80 % 60 % 53 % IPPM 40 % 27 % 20 % 0% - 10 0 10 20 30 40 50 60 70 80 90 100 20557 10 20 30 Time (µs) Time (ns) Fig. 1 - 8/20 μs Peak Pulse Current Wave Form acc. IEC 61000-4-5 Fig. 2 - ESD Discharge Current Wave Form acc. IEC 61000-4-2 (330 /150 pF) Rev. 1.0. 19-Sep-11 2 For technical questions, contact: ESDprotection@vishay.com Document Number: 83384 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VBUS054DD-HS4 www.vishay.com Vishay Semiconductors 1.0 0.9 0.8 0.7 f = 1 MHz 20 Measured acc. IEC 61000-4-5 (8/20µs - wave form) 15 CD (pF) VC (V) 0.6 0.5 0.4 0.3 0.2 0.1 0 0 Pin 1, 3, 4 or 5 to pin 2 and 6 (one of pin 1, 3, 4 or 5 connected to 3.3 V) 10 VC 5 Pin 1, 3, 4 or 5 to pin 2 and 6 0 1 2 3 4 5 6 -5 0 1 2 3 4 VR (V) Fig. 3 - Typical Capacitance CD vs. Reverse Voltage VR IPP (A) Fig. 6 - Typical Peak Clamping Voltage VC vs. Peak Pulse Current IPP 100 120 100 Acc. IEC 61000-4-2 + 8 kV contact discharge 10 80 VC-ESD (V) IF (mA) 1 Pin 1, 3, 4 or 5 to pin 2 and 6 60 40 20 0.1 0.01 Pin 2 and 6 to pin 1, 3, 4, or 5 0.001 0.5 0.6 0.7 0.8 0.9 1.0 1.1 0 - 20 - 10 0 10 20 30 40 50 60 70 80 90 VF (V) Fig. 4 - Typical Forward Current IF vs. Forward Voltage VF t (ns) Fig. 7 - Typical Clamping Performance at + 8 kV Contact Discharge (acc. IEC 61000-4-2) 9 8 7 Pin 1, 3, 4 or 5 to pin 2 and 6 6 180 160 140 120 Acc. IEC 61000-4-2 - 8 kV contact discharge VC-ESD (V) VR (V) 5 4 3 2 1 0 0.01 0.1 1 101 102 103 104 100 80 60 40 20 0 - 20 - 10 0 Pin 1, 3, 4 or 5 to pin 2 and 6 10 20 30 40 50 60 70 80 90 IR (µA) Fig. 5 - Typical Reverse Voltage VR vs. Reverse Current IR t (ns) Fig. 8 - Typical Clamping Performance at - 8 kV Contact Discharge (acc. IEC 61000-4-2) Rev. 1.0. 19-Sep-11 3 For technical questions, contact: ESDprotection@vishay.com Document Number: 83384 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VBUS054DD-HS4 www.vishay.com PACKAGE DIMENSIONS in millimeters (inches): LLP1010-6M Vishay Semiconductors 0.22 (0.009) exp. DAP 0.35 (0.014) bsc 0.2 (0.008) 0.25 (0.010) 0.15 (0.006) 0.1 (0.004) 0.5 (0.020) exp. DAP 0.7 (0.028) ref. 0.4 (0.016) 0.33 (0.013) 0.03 (0.001) Pin 1 marking 1.05 (0.041) 0.95 (0.037) 1.05 (0.041) 0.95 (0.037) Foot print recommendation: 0.3 (0.012) 0.175 (0.007) 0.05 (0.002) 0 (0.000) 0.35 (0.014) 0.35 (0.014) 0.5 (0.020) 0.125 (0.005) ref. Solder resist mask Solder pad Soldermask opening ± 0.03 measured middle of the package Document no.:S8-V-3906.04-004 (4) Created - Date: 17.July.2007 Rev. 4 - Date: 09. Sep. 2008 20899 0.7 (0.028) 0.22 (0.009) Rev. 1.0. 19-Sep-11 4 For technical questions, contact: ESDprotection@vishay.com Document Number: 83384 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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Material Category Policy Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (EEE) - recast, unless otherwise specified as non-compliant. Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU. Revision: 12-Mar-12 1 Document Number: 91000