P1
TAI-TECH
Power Inductor
HPC4012TF-SERIES
ECN HISTORY LIST
REV
DATE
1.0
17/04/12
DESCRIPTION
新 發 行
備
註
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APPROVED
CHECKED
DRAWN
羅宜春
梁周虎
張光
P2
TAI-TECH
Power Inductor
HPC4012TF-SERIES
1. Features
1. This specification applies Low Profile Power Inductors.
2. 100% Lead(Pb) & Halogen-Free and RoHS compliant.
2. Dimension
Series
A(mm)
B(mm)
C(mm)
D(mm)
E(mm)
HPC4012TF
4.0±0.2
4.0±0.2
1.2 max.
1.2 ref.
1.6 ref.
Halogen
Pb
Halogen-free
Pb-free
Units: mm
3. Part Numbering
HPC
4012
TF
A
B
C
A: Series
B: Dimension
C: Lead Free
D: Inductance
E: Inductance Tolerance
-
100
M
D
E
100=10uH
M=±20% ; Y=±30%
4. Specification
TAI-TECH
Part Number
Inductance Tolerance Test Frequency
SRF
DCR
I sat
I sat
I rms I rms
(uH)
(%)
(Hz)
(MHz) typ. (Ω) ±20% (A)typ. (A)Max. (A)typ. (A)Max.
1.0
±30%
1V100K
100
0.042
3.30
2.80
2.50
2.20
HPC4012TF -2R2M
2.2
±20%
1V100K
70
0.060
1.95
1.65
2.20
1.90
HPC4012TF -3R3M
3.3
±20%
1V100K
60
0.070
1.60
1.40
1.90
1.70
HPC4012TF -4R7M
4.7
±20%
1V100K
45
0.095
1.40
1.20
1.70
1.50
HPC4012TF -6R8M
6.8
±20%
1V100K
35
0.125
1.10
0.90
1.50
1.30
HPC4012TF -100M
10
±20%
1V100K
30
0.180
1.00
0.80
1.30
1.10
HPC4012TF -150M
15
±20%
1V100K
24
0.260
0.80
0.65
0.95
0.75
HPC4012TF -220M
22
±20%
1V100K
18
0.400
0.60
0.50
0.72
0.62
HPC4012TF -1R0Y
Note:
Isat:Based on inductance change (△L/L0:≦30%)@ ambient temp. 25℃
Irms:Based on temperature rise (△T:40℃ typ.)max
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P3
TAI-TECH
HPC4012TF-2R2
4
1.5
3
Inductance(uH)
Inductance(uH)
HPC4012TF-1R0
2
1
2
1
0.5
0
0
0
1
2
3
4
0
5
0.7
6
8
4.5
6
Inductance(uH)
Inductance(uH)
2.1
2.8
HPC4012TF-4R7
HPC4012TF-3R3
3
4
2
1.5
0
0
0
0.5
1
1.5
2
0
0.5
1
1.5
2
0.9
1.2
DCcurrent(A)
DCcurrent(A)
HPC4012TF-6R8
HPC4012TF-100
12
20
9
15
Inductance(uH)
Inductance(uH)
1.4
DCcurrent(A)
DCcurrent(A)
6
10
3
5
0
0
0
0.4
0.8
1.2
1.6
0
0.3
DCcurrent(A)
0.6
DCcurrent(A)
HPC4012TF-150
HPC4012TF-220
25
40
20
Inductance(uH)
Inductance(uH)
30
15
10
20
10
5
0
0
0
0.2
0.4
0.6
0.8
1
0
DCcurrent(A)
0.2
0.4
0.6
DCcurrent(A)
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0.8
1
P4
TAI-TECH
Void appearance tolerance Limit
Size of voids occurring to coating resin is specified below.
Appearance of exposed wire tolerance limit :
1. Width direction(dimension a):Acceptable when a≦w/2
Nonconforming when a>w/2
2. Length direction(dimension b)
:Dimension b is not specified.
3. The total area of exposed wire occurring to each sides is
not greater than 50% of coating resin area, and is acceptable.
External appearance criterion for exposed wire
Exposed end of the winding wire at the secondary side should be 2mm and below.
5. Material
No.
Description Specification
a.
Core
Ferrite Core
b.
Wire
Enameled Copper Wire
c
Glue
Epoxy / Epoxy with magnetic powder
d
Terminal
Ag/Ni/Sn
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P5
TAI-TECH
6. Reliability and Test Condition
Item
Performance
Operating temperature
-40~+125℃ (Including self - temperature rise)
Storage temperature
-40~+125℃ (on board)
Test Condition
Electrical Performance Test
HP4284A,CH11025,CH3302,CH1320,CH1320S
Inductance
Refer to standard electrical characteristics list.
DCR
LCR Meter.
CH16502,Agilent33420A Micro-Ohm Meter.
Saturation DC Current (Isat) will cause L0
Saturation Current (Isat)
△L≦30% typical.
to drop △L(%)(keep quickly).
Heat Rated Current (Irms) will cause the coil temperature rise
△T(℃) without core loss.
Heat Rated Current (Irms)
Approximately △T≦40℃
1.Applied the allowed DC current(keep 1 min.).
2.Temperature measured by digital surface thermometer
Reliability Test
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles)
Temperature: 125±2℃(Inductor)
Applied current:rated current
Duration:1000±12hrs
Measured at room temperature after placing for 24±2 hrs
Life Test
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Humidity:85±2﹪R.H,
Temperature:85℃±2℃
Duration:1000hrs Min. with 100% rated current
Measured at room temperature after placing for 24±2 hrs
Load Humidity
Moisture Resistance
Appearance:No damage.
Inductance:within±10% of initial value
Q:Shall not exceed the specification value.
RDC:within ±15% of initial value and shall not
exceed the specification value
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow
Profiles
1. Baked at50℃ for 25hrs, measured at room temperature after
placing for 4 hrs.
2. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25℃ in 2.5hrs.
3. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25℃ in
2.5hrs,keep at 25℃ for 2 hrs then keep at -10℃ for 3 hrs
4. Keep at 25℃ 80-100%RH for 15min and vibrate at the
frequency of 10 to 55 Hz to 10 Hz, measure at
room temperature after placing for 1~2 hrs.
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification
Reflow Profiles
Condition for 1 cycle
Step1:-40±2℃ 30±5min
Step2:25±2℃ ≦0.5min
Step3:125±2℃ 30±5min
Number of cycles: 500
Measured at room temperature after placing for 24±2 hrs
Thermal
shock
Oscillation Frequency: 10~2K~10Hz for 20 minutes
Equipment: Vibration checker
Total Amplitude:1.52mm±10%
Testing Time : 12 hours(20 minutes, 12 cycles each of 3
orientations)。
Vibration
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P6
TAI-TECH
Item
Performance
Shock
Appearance:No damage.
Inductance:within±10% of initial value
Q:Shall not exceed the specification value.
RDC:within ±15% of initial value and shall not
exceed the specification value
Bending
Soderability
More than 95% of the terminal electrode should
be covered with solder。
Test Condition
Type
Peak value
(g’s)
Normal
duration
(D) (ms)
Wave form
Velocity
change
(Vi)ft/sec
SMD
50
11
Half-sine
11.3
Lead
50
11
Half-sine
11.3
shocks in each direction along 3 perpendicular axes.
Shall be mounted on a FR4 substrate of the
following dimensions: >=0805:40x100x1.2mm
=0805inch(2012mm):1.2mm
0805
inch(2012mm):1kg ,
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