HPC4012TF-2R2M

P1 TAI-TECH Power Inductor HPC4012TF-SERIES ECN HISTORY LIST REV DATE 1.0 17/04/12 DESCRIPTION 新 發 行 備 註 www.tai-tech.com.tw APPROVED CHECKED DRAWN 羅宜春 梁周虎 張光 P2 TAI-TECH Power Inductor HPC4012TF-SERIES 1. Features 1. This specification applies Low Profile Power Inductors. 2. 100% Lead(Pb) & Halogen-Free and RoHS compliant. 2. Dimension Series A(mm) B(mm) C(mm) D(mm) E(mm) HPC4012TF 4.0±0.2 4.0±0.2 1.2 max. 1.2 ref. 1.6 ref. Halogen Pb Halogen-free Pb-free Units: mm 3. Part Numbering HPC 4012 TF A B C A: Series B: Dimension C: Lead Free D: Inductance E: Inductance Tolerance - 100 M D E 100=10uH M=±20% ; Y=±30% 4. Specification TAI-TECH Part Number Inductance Tolerance Test Frequency SRF DCR I sat I sat I rms I rms (uH) (%) (Hz) (MHz) typ. (Ω) ±20% (A)typ. (A)Max. (A)typ. (A)Max. 1.0 ±30% 1V100K 100 0.042 3.30 2.80 2.50 2.20 HPC4012TF -2R2M 2.2 ±20% 1V100K 70 0.060 1.95 1.65 2.20 1.90 HPC4012TF -3R3M 3.3 ±20% 1V100K 60 0.070 1.60 1.40 1.90 1.70 HPC4012TF -4R7M 4.7 ±20% 1V100K 45 0.095 1.40 1.20 1.70 1.50 HPC4012TF -6R8M 6.8 ±20% 1V100K 35 0.125 1.10 0.90 1.50 1.30 HPC4012TF -100M 10 ±20% 1V100K 30 0.180 1.00 0.80 1.30 1.10 HPC4012TF -150M 15 ±20% 1V100K 24 0.260 0.80 0.65 0.95 0.75 HPC4012TF -220M 22 ±20% 1V100K 18 0.400 0.60 0.50 0.72 0.62 HPC4012TF -1R0Y Note: Isat：Based on inductance change （△L/L0：≦30%）@ ambient temp. 25℃ Irms：Based on temperature rise （△T：40℃ typ.）max www.tai-tech.com.tw P3 TAI-TECH HPC4012TF-2R2 4 1.5 3 Inductance(uH) Inductance(uH) HPC4012TF-1R0 2 1 2 1 0.5 0 0 0 1 2 3 4 0 5 0.7 6 8 4.5 6 Inductance(uH) Inductance(uH) 2.1 2.8 HPC4012TF-4R7 HPC4012TF-3R3 3 4 2 1.5 0 0 0 0.5 1 1.5 2 0 0.5 1 1.5 2 0.9 1.2 DCcurrent(A) DCcurrent(A) HPC4012TF-6R8 HPC4012TF-100 12 20 9 15 Inductance(uH) Inductance(uH) 1.4 DCcurrent(A) DCcurrent(A) 6 10 3 5 0 0 0 0.4 0.8 1.2 1.6 0 0.3 DCcurrent(A) 0.6 DCcurrent(A) HPC4012TF-150 HPC4012TF-220 25 40 20 Inductance(uH) Inductance(uH) 30 15 10 20 10 5 0 0 0 0.2 0.4 0.6 0.8 1 0 DCcurrent(A) 0.2 0.4 0.6 DCcurrent(A) www.tai-tech.com.tw 0.8 1 P4 TAI-TECH Void appearance tolerance Limit Size of voids occurring to coating resin is specified below. Appearance of exposed wire tolerance limit : 1. Width direction（dimension a）：Acceptable when a≦w/2 Nonconforming when a＞w/2 2. Length direction（dimension b） ：Dimension b is not specified. 3. The total area of exposed wire occurring to each sides is not greater than 50% of coating resin area, and is acceptable. External appearance criterion for exposed wire Exposed end of the winding wire at the secondary side should be 2mm and below. 5. Material No. Description Specification a. Core Ferrite Core b. Wire Enameled Copper Wire c Glue Epoxy / Epoxy with magnetic powder d Terminal Ag/Ni/Sn www.tai-tech.com.tw P5 TAI-TECH 6. Reliability and Test Condition Item Performance Operating temperature -40~+125℃ (Including self - temperature rise) Storage temperature -40~+125℃ (on board) Test Condition Electrical Performance Test HP4284A,CH11025,CH3302,CH1320,CH1320S Inductance Refer to standard electrical characteristics list. DCR LCR Meter. CH16502,Agilent33420A Micro-Ohm Meter. Saturation DC Current (Isat) will cause L0 Saturation Current (Isat) △L≦30% typical. to drop △L(%)(keep quickly). Heat Rated Current (Irms) will cause the coil temperature rise △T(℃) without core loss. Heat Rated Current (Irms) Approximately △T≦40℃ 1.Applied the allowed DC current(keep 1 min.). 2.Temperature measured by digital surface thermometer Reliability Test Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles) Temperature： 125±2℃(Inductor) Applied current：rated current Duration：1000±12hrs Measured at room temperature after placing for 24±2 hrs Life Test Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Humidity：85±2﹪R.H, Temperature：85℃±2℃ Duration：1000hrs Min. with 100% rated current Measured at room temperature after placing for 24±2 hrs Load Humidity Moisture Resistance Appearance：No damage. Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles 1. Baked at50℃ for 25hrs, measured at room temperature after placing for 4 hrs. 2. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25℃ in 2.5hrs. 3. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25℃ in 2.5hrs,keep at 25℃ for 2 hrs then keep at -10℃ for 3 hrs 4. Keep at 25℃ 80-100%RH for 15min and vibrate at the frequency of 10 to 55 Hz to 10 Hz, measure at room temperature after placing for 1~2 hrs. Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Condition for 1 cycle Step1：-40±2℃ 30±5min Step2：25±2℃ ≦0.5min Step3：125±2℃ 30±5min Number of cycles： 500 Measured at room temperature after placing for 24±2 hrs Thermal shock Oscillation Frequency: 10～2K～10Hz for 20 minutes Equipment： Vibration checker Total Amplitude:1.52mm±10% Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations)。 Vibration www.tai-tech.com.tw P6 TAI-TECH Item Performance Shock Appearance：No damage. Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Bending Soderability More than 95% of the terminal electrode should be covered with solder。 Test Condition Type Peak value (g’s) Normal duration (D) (ms) Wave form Velocity change (Vi)ft/sec SMD 50 11 Half-sine 11.3 Lead 50 11 Half-sine 11.3 shocks in each direction along 3 perpendicular axes. Shall be mounted on a FR4 substrate of the following dimensions: >=0805:40x100x1.2mm =0805inch(2012mm):1.2mm 0805 inch(2012mm):1kg ,