P1
TAI-TECH
Power Inductor
HPC3012TF-SERIES
ECN HISTORY LIST
REV
DATE
1.0
14/04/14
DESCRIPTION
新 發 行
備
註
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APPROVED
CHECKED
DRAWN
楊祥忠
詹偉特
羅文鍵
P2
TAI-TECH
Power Inductor
HPC3012TF-SERIES
1. Features
1. This specification applies Low Profile Power Inductors.
2. 100% Lead(Pb) & Halogen-Free and RoHS compliant.
2. Dimension
Series
A(mm)
B(mm)
C(mm)
D(mm)
E(mm)
HPC3012TF
3.0±0.2
3.0±0.2
1.2 max.
1.0 ref.
1.0 ref.
Halogen
Pb
Halogen-free
Pb-free
Units: mm
3. Part Numbering
HPC
3012
TF
A
B
C
-
4R7
M
D
E
A: Series
B: Dimension
C: Lead Free
D: Inductance
4R7=4.7uH
E: Inductance Tolerance
M=±20% ;Y=±30%
4. Specification
TAI-TECH
Part Number
Inductance
(uH)
Tolerance
(%)
Test Frequency
(Hz)
DCR
(Ω) ±20%
I sat
(A) typ.
I rms
(A) typ.
HPC3012TF-1R0Y
1.0
±30%
0.1V/1M
0.042
2.15
2.00
HPC3012TF -1R5Y
1.5
±30%
0.1V/1M
0.056
1.70
1.85
HPC3012TF -2R2M
2.2
±20%
0.1V/1M
0.080
1.50
1.70
HPC3012TF -3R3M
3.3
±20%
0.1V/1M
0.100
1.20
1.55
HPC3012TF -4R7M
4.7
±20%
0.1V/1M
0.130
1.05
1.30
HPC3012TF -6R8M
6.8
±20%
0.1V/1M
0.180
0.90
1.05
HPC3012TF -100M
10
±20%
0.1V/1M
0.245
0.76
0.89
HPC3012TF -150M
15
±20%
0.1V/1M
0.386
0.62
0.74
HPC3012TF -220M
22
±20%
0.1V/1M
0.580
0.49
0.61
Note:
Isat:Based on inductance change (△L/L0:≦-30%)@ ambient temp. 25℃
Irms:Based on temperature rise (△T:40℃.)Max
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P3
TAI-TECH
HPC3012TF-1R5
HPC3012F-1R5
2.5
1.6
2
Inductance(uH)
Inductance(uH)
HPC3012TF-1R0
HPC3012F-1R0
2
1.2
0.8
0.4
1.5
1
0.5
0
0
0
0.48
0.96
1.44
1.92
2.4
0
0.44
DCcurrent(A)
6
3.2
4.8
Inductance(uH)
Inductance(uH)
1.76
2.2
1.12
1.4
0.8
1
0.56
0.7
HPC3012TF-3R3
HPC3012F-3R3
4
2.4
1.6
0.8
3.6
2.4
1.2
0
0
0
0.32
0.64
0.96
1.28
1.6
0
0.28
DCcurrent(A)
0.56
0.84
DCcurrent(A)
HPC3012TF-4R7
HPC3012F-4R7
HPC3012TF-6R8
HPC3012F-6R8
8
12
6.4
9.6
Inductance(uH)
Inductance(uH)
1.32
DCcurrent(A)
HPC3012TF-2R2
HPC3012F-2R2
4.8
3.2
1.6
7.2
4.8
2.4
0
0
0
0.24
0.48
0.72
0.96
1.2
0
0.2
DCcurrent(A)
0.4
0.6
DCcurrent(A)
HPC3012TF-100
HPC3012F-100
HPC3012TF-150
HPC3012F-150
20
30
16
24
Inductance(uH)
Inductance(uH)
0.88
12
8
4
18
12
6
0
0
0
0.16
0.32
0.48
0.64
0.8
0
DCcurrent(A)
0.14
0.28
0.42
DCcurrent(A)
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P4
TAI-TECH
HPC3012TF-220
40
Inductance(uH)
32
24
16
8
0
0
0.11
0.22
0.33
0.44
0.55
DCcurrent(A)
Void appearance tolerance Limit
Size of voids occurring to coating resin is specified below.
Exposed wire tolerance limit of coating resin part on product side.
Size of exposed wire occurring to coating resin is specified below.
1. Width direction(dimension a)
:Acceptable when a≦w/2
Nonconforming when a>w/2
2. Length direction(dimension b):Dimension b is not specified.
3. The total area of exposed wire occurring to each sides is
not greater than 50% of coating resin area, and is acceptable.
External appearance criterion for exposed wire
Exposed end of the winding wire at the secondary side should be 2mm and below.
5. Material
No.
Description
Specification
a.
Core
Ferrite Core
b.
Coating
Epoxy
c
Termination
Tin (Pb Free)
d
Wire
Enameled Copper Wire
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P5
TAI-TECH
6. Reliability and Test Condition
Item
Operating Temperature
Performance
Test Condition
-55~+125℃(For products in unopened tape package, less than 40℃)
Electrical Performance Test
Inductance L
Agilent-4291, Agilent-4287
Refer to standard electrical characteristic list
DC Resistance
Agilent-4338
Rated Current
Base on temp. rise & △L/L0A≦30%.
Temperature Rise Test
ΔT 40℃Max
Saturation DC Current (Isat) will cause L0
to drop approximately △L(%).
Heat Rated Current (Irms) will cause the coil temperature rise
approximately △T(℃) without core loss.
1.Applied the allowed DC current.
2.Temperature measured by digital surface thermometer
Mechanical Performance Test
Appearance:No damage.
Inductance:within±10% of initial value
Solder Heat Resistance
Temperature
(°C)
Time
(s)
Temperature
ramp/immersion
and
emersion
rate
260 ±5
(solder temp)
10 ±1
25mm/s±6 mm/s
RDC:within ±15% of initial value and shall not exceed the specification value
Number
of heat
cycles
1
Depth: completely cover the termination
Solderability Test
More than 95% of terminal electrode should be covered with solder.
Preheat: 150℃,60sec.。
Solder: Sn99.5%-Cu0. 5%。
Temperature: 245±5℃。
Flux for lead free: Rosin. 9.5%。
Dip time: 4±1sec。
Depth: completely cover the termination
Reliability Test
Preconditioning:Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Temperature:125±2℃(Bead)
Life Test
Temperature: 85±2℃(Inductor)
Applied current:rated current
Duration:1000±12hrs
Measured at room temperature after placing for 24±2 hrs
Preconditioning:Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Step1:-40±2℃ 30±5min
Step2:25±2℃ ≦0.5min
Thermal shock
Appearance:No damage.
Step3:105±2℃ 30±5min
Inductance:within±10% of initial value
Number of cycles: 500
Measured at room fempraturc after placing for 24±2 hrs
RDC:within ±15% of initial value and shall not exceed the specification value
Preconditioning:Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Humidity:85±2﹪R.H,
Humidity Resistance Test
Temperature:85℃±2℃
Duration:1000hrs Min. with 100% rated current
Measured at room temperature after placing for 24±2 hrs
Preconditioning:Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Oscillation Frequency: 10〜2K〜10Hz for 20 minutes
Equipment: Vibration checker
Total Amplitude:1.52mm±10%
Testing Time : 12 hours(20 minutes, 12 cycles each of 3
orientations)。
Vibration Test
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P6
TAI-TECH
7. Soldering and Mounting
7-1. Soldering
Mildly activated rosin fluxes are preferred. TAI-TECH terminations are suitable for all wave and re-flow soldering systems.
If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools.
7-1.1 Solder re-flow:
Recommended temperature profiles for re-flow soldering in Figure 1.
7-1.2 Soldering Iron(Figure 2):
Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
•Preheat circuit and products to 150℃
•Never contact the ceramic with the iron tip
•Use a 20 watt soldering iron with tip diameter of 1.0mm
•355℃ tip temperature (max)
•1.0mm tip diameter (max)
•Limit soldering time to 4~5 sec.
Iron Soldering
Reflow Soldering
PRE-HEATING
SOLDER ING
20~40s
PR E-HEATING
NATURAL
CO OLING
TEMPERATURE( C)
TEMPERATURE( C)
TP(260 C / 40s max.)
217
60~150s
200
150
SOLDERING
within 4~5s
60~180s
NATU RAL
COO LING
350
150
Gradual cooling
Over 60s
480s max.
25
TIME(sec.)
TIME( sec.)
Reflow times: 3 times max.
Iron Soldering times: 1 times max.
Fig.1
Fig.2
7-2. Recommended PC Board Pattern
H
L
L(mm)
G(mm)
H(mm)
3.2
1.0
3.2
G
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P7
TAI-TECH
8. Packaging Information
8-1. Reel Dimension
C
B
D
A
Type
A(mm)
B(mm)
C(mm)
D(mm)
7”x8mm
8.4±1.0
50 min.
13±0.8
178±2
7"x8mm
8-2. Tape Dimension / 8mm
t
P
Ao
Bo
Po:4∮0.1
W:8.0∮
0.1
P2:2∮
0.05
Series
Size
Bo(mm) Ao(mm) Ko(mm) P(mm)
HPC
3012
3.2±0.05
3.2±0.05
1.40±0.2
4.0±0.05 0.23±0.05
Ko
8-3. Packaging Quantity
Chip size
3012
Chip / Reel
2000
8-4. Tearing Off Force
F
Top cover tape
The force for tearing off cover tape is 15 to 80 grams
in the arrow direction under the following conditions.
165 to180
Base tape
Room Temp.
Room Humidity
Room atm
Tearing Speed
(℃)
(%)
(hPa)
mm/min
5~35
45~85
860~1060
300
Application Notice
•Storage Conditions
To maintain the solderability of terminal electrodes:
1. TAI-TECH products meet IPC/JEDEC J-STD-020D standard-MSL, level 1.
2. Temperature and humidity conditions: Less than 40℃ and 60% RH.
3. Recommended products should be used within 12months form the time of delivery.
4. The packaging material should be kept where no chlorine or sulfur exists in the air.
•Transportation
1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
2. The use of tweezers or vacuum pick up is strongly recommended for individual components.
3. Bulk handling should ensure that abrasion and mechanical shock are minimized.
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t(mm)
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