2Z19200001-Q

No. 68 Huangjiang Donghuan Road, Huangjiang Town, Dongguan City, Guangdong Province, China TEL :+86(0)769-38879888 Fax :+86(0)769-38879889 E-mail : yl@dgylec.com PRODUCT SPECIFICATION SHEET CUSTOMER : PRODUCT TYPE : SMD TSX 2.52.0 NOMINAL FREQ. : 19.200000 MHz FL P/N : 2Z19200001-Q REVISION : S1 CUSTOMER P/N : CUSTOMER'S APPROVAL & DATE FL CORPORATION APPROVED CHECKED DESIGNED Jay Lee Kuro Peng Chen XuanRu MSL 1 RoHS Compliant FL P/N REV. CONTENTS 2Z19200001-Q S1 PAGE PAGE ‧ SPECIFICATION REVISION RECORD SHEET 2 ‧ ELECTRICAL SPECIFICATIONS 3 to 4 ‧ CONNECTION DIAGRAM, DIMENSIONS & MARKING 5 ‧ MARKING 6 ‧ SUGGESTED REFLOW PROFILE 6 ‧ STRUCTURE ILLUSTRATION 7 ‧ RELIABILITY TEST SPECIFICATIONS 8 ‧ PACKING 9 to 10 ‧ SPECIFICATION OF THE ENVIRONMENT-RELATED SUBSTANCES 11 ATTACHMENT (optional) ‧ ELECTRICAL CHARACTERISTICS TEST A YES NO ‧ TEMPERATURE CHARACTERISTICS TEST B YES NO 1/11 FL P/N REV. 2Z19200001-Q S1 PAGE 2/11 SPECIFICATION REVISION RECORD SHEET Rev. Revise Page S0 N/A S1 P.6 Revise Contents Date Ref. No. Reviser Initial released. 1-Jul-20 N/A Chen XuanRu Change MARKING 1-Dec-21 N/A May Zhang FL P/N REV. 2Z19200001-Q S1 PAGE PRODUCT DESCRIPION Standard atmospheric conditions Unless otherwise specified, the standard range of atmospheric conditions for making measurement and tests are as follow: 30±10°C Ambient temperature : 40% to 70% Relative humidity : If there is no doubt the results, measurement shall be made within the following limits: 30±3℃ Ambient temperature : 40% to 70% Relative humidity : Measure equipment Electrical characteristics are measured by S&A250B or equivalent. Crystal cutting type The crystal is using AT CUT (thickness shear mode). ELECTRICAL SPECIFICATIONS # 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Parameters Nominal frequency Oscillation mode Load capacitance Frequency tolerance Tolerance over temperature (reference 30°C) Aging Frequency drift after reflow Operating temperature Storage temperature Equivalent series resistance Quality factor Spurious mode series resistance Insulation resistance Drive level Shunt Capaitance Motional Capacitance First-order curve fitting parameter Symbol FL CL - Electrical Spec. 19.200000 AT-cut Fundamental 7 -10 +10 Units MHz NA pF ppm (Note 1) At 30±3°C - -12 - +12 ppm at -30～+85℃(Note 2) ESR Q -0.7 -2 -30 -40 75000 - +0.7 +2 +105 +105 70 - ppm/year ppm °C °C W - 1100 - - W IR DL C0 C1 500 10 0.3 1.8 - 100 1.3 3.1 MW mW pF fF - -0.4 - -0.1 ppm/°C 18 Second-order curve fitting parameter - -4.5 0 +4.5 19 Third-order curve fitting parameter - 8.5 10 11.5 10-4 ppm/°C2 10-5 ppm/°C3 Notes after two reflows (Note 3) ±1MHz At DC 100V (Note 4) (Note 4) (Note 4) 3/11 FL P/N REV. 2Z19200001-Q S1 PAGE 4/11 ELECTRICAL SPECIFICATIONS (CONT.) # 20 21 22 23 24 25 26 Parameters Residual frequency stability slope 5°C small orbit hysteresis 1 5°C small orbit hysteresis 2 DLD Freq. (Max-Min) DLD Freq. (Repeatability) DLD ESR (Max-Min) DLD ESR (Repeatability) Symbol Electrical Spec. Units - ppb/℃ (Note 5) ppb/℃ ppb pk-pk ppm ppm % % (Note 6) (Note 7) (Note 8) (Note 8) (Note 8) (Note 8) - -50 +50 - -50 +50 100 (magnitude) 3.0 0.7 20 10 Notes Note 1 Note 2 Note 3 Note 4 The load capacitance is measured according to IEC Standard #60444-7. Above 85°C tolerance over temperature bound by third-order coefficient range. Minimum Q value calculated from ESR and L is smaller than this specification. The curve fitting parameter is obtained from the Qualcomm crystal curve fitting algorithm, t0=30 °C (Refer to Curve Fitting Calculation Table: 80-V9690-23) Note 5 Condition 1A – Test condition (continuous temperature rate change of ~1.0°C/min): - Measure FT points every 1°C, heating up from -30 to +85°C, subtract a fifth-order polynomial best fit and then calculate the slope of the residual. - The residual slope should be within ±50 ppb/°C. Note 6 Condition 1B – Hysteresis 1 test condition (continuous temperature rate change of ~1.0°C/min): - Measure FT points every 0.5°C while cycling temperature over a 5°C small temperature orbit;an example 5°C small orbit temperature cycle is +30°C to +35°C to +30°C. - During every individual heating/cooling cycle there should be 11 points; discard the first point of each heating and cooling cycle; this leaves 10 points for the fifth-order polynomial best fit from 1A for each of the 10 points, and then calculate the slope each heating and cooling cycle. Subtract of the residual for each of these heating and cooling 10 point curves. Note 7 Hysteresis 2 test condition (continuous temperature rate change of ~1.0°C/min): - Measure FT points every 0.5°C while cycling temperature over a 5°C small temperature orbit; an example 5°C small orbit temperature cycle is +30°C to +35°C to +30°C. - During every individual heating/cooling cycle there should be 11 points; discard the first and last point of each heating and cooling cycle, which results in 9 temperature points. Calculate the average measured peak-to-peak frequency difference for these 9 temperature points. - The average difference is the magnitude of the small orbit hysteresis 2. Note 8 0.01 uW to 100 uW to 0.01 uW, number of points: 15 points up and 15 points down = 29 total data points. Note 9 This crystal specification complies to Qualcomm Mini-Specification 80-V9690-24 Rev. D. NTC THERMISTOR SPECIFICATIONS TABLE # 1 2 3 4 5 Parameters Operating Temperature Storage Temperature Resistance B-constant Tolerance Symbol - Electrical Spec. -30 +105 -40 +105 100 4250 1 Units °C °C kW K % Notes At 25°C At 25°C - 50°C FL P/N REV. 2Z19200001-Q S1 CONNECTION DIAGRAM DIMENSIONS (Unit : mm) Unit : mm Pad #1 #2 #3 #4 Function Xtal terminal (Input) Thermistor + GND terminal Xtal terminal (Output) Thermistor terminal SUGGESTED LAYOUT PAGE 5/11 FL P/N REV. 2Z19200001-Q S1 MARKING Frequency EX: 19.200MHz = 192 YL lot (2 digits) year month Administrative Symbo 2017 2018 2019 2020 2021 2022 2023 2024 SUGGESTED REFLOW PROFILE Total time : 360 sec. Max. Solder melting point :225 oC Temp. (℃) 10 sec. Max. 260 5 220 60 sec. Max. 180 150 120 sec. Max. Time (sec.) PAGE 6/11 FL P/N REV. 2Z19200001-Q S1 PAGE 7/11 STRUCTURE ILLUSTRATION # COMPONENTS MATERIALS QTY 1 Cap (Lid) Kovar (Fe+Co+Ni) 1 2 Base (Package) Alumina Ceramics (Al2O3) + Kovar (Fe+Co+Ni) 1 3 Pad (Package) Ni + Au 4 4 Crystal Blank SiO2 1 5 Electrode Cr + Nobel material 2 6 Conductive Adhesive Ag 2 7 Thermistor Alumina Ceramics (Al2O3), Ni + Ag+ Sn 1 8 Solder Sn + Ag + Cu 2 FINISH/SPECIFICATIONS Ni plating Silicone resin FL P/N REV. 2Z19200001-Q S1 PAGE 8/11 RELIABILITY SPECIFICATIONS 1. MECHANICAL ENDURANCE Test Item No. 1 Drop test 2 Shock test 3 Mechanical shock 4 Vibration 5 Gross leak 6 Fine leak 7 Solderability 8 Resistance to soldering heat Test Methods 150 cm height, fall freely onto stainless plate 3 times. 150g/150cm height, 3times in the direction of ±x, ±y, ±z on concrete floor. Device are shocked to half sine wave (1000 G) three mutually perpendicular axes each 3 times. 1.0ms duration time. Frequency range Amplitude Perpendicular axes each test time 10 to 55 Hz 1.52 mm 2 hours (x, y, z axis) Total test time 6 hours Standard sample for automatic gross leak detector. Test pressure 2kg/cm2. Helium bombing 4.5kgf/cm2 for 2 hours. Temperature 215°C ± 5°C Immersing depth 0.5 mm minimum Immersion time 10 ± 0.5 seconds Flux Rosin resin methyl alcohol solvent ( 1 : 4 ) Pre-heat temperature 125°C Pre-heat time 60 to 120 sec. Test temperature 260 ± 5°C Test time 5 ± 1 sec. JIS C6701 IEC-68-02-27 MIL-STD-202F MIL-STD-883E MIL-STD-883E MIL-STD-883E MIL-STD-883E MIL-STD-202F 2. ENVIRONMENTAL ENDURANCE Test Item No. High Temp. storage 9 10 Low Temp. storage Test Methods + 125°C ± 3°C for 500 ± 12 hours - 40°C ± 3°C for 500 ± 12 hours Total 100 cycles of the following temperature cycle MIL-STD-883E 1 cycle 11 Thermal shock 125+/- 3 oC MIL-STD-883E 25 oC -55+/- 3 o C 30 min. 30 min. 10 min. max. 12 High Temp. & humidity 85°C±3℃, RH 85%, 500 hours JIS C5023 FL P/N REV. 2Z19200001-Q S1 PAGE 9/11 PACKING : (EIA-481-2) Direction of feed Index Mark Direction of products Dimension PKG Type A0 B0 2.25±0.1 2.70±0.1 2520 TSX (8mm) P1 P2 4±0.1 2±0.1 Standard Reel Quantity is 3,000 pcs per reel. THE INSPECTION FOR TAPE TENSION REMARK : NA K0 1.45±0.10 D1 1±0.1 Unit : mm T 0.25±0.05 D0 1.55±0.05 W 8±0.3 P0 4±0.1 E 1.75±0.1 F 3.50±0.1 FL P/N 2Z19200001-Q REV. S1 PAGE 10/11 SMD PRODUCT PACKING STANDARD Out-going packing instruction Reel Packing Inner Packing Name：Reel Name：Bubble Wrap Standard：Diameter 18cm Standard：430×330+20mm Material：Plastics Name： Material：HDPE (15 reels enter) Anti-Static Shielding Bag Standard：205 ×250mm Material：APET/CPP Carton Name：Carton Standard：400×400×280mm Material：AB corrugated paper (4 bags enter) L1 L2 The label instruction Label Drawing Mark Name of Article Spec. 1.Part No. L1 条码标签 Bar Code Label 2.Lot No. (Chintz Paper) 3.Q'ty 4.Freq L2 条码标签 Bar Code Label (Chintz Paper) 1.Part No. 2.Date Code 3.Q'ty 4.Freq Size 70x50mm Printing White 70x50mm White Remark Specifications on the label is for the use of templates with different product specifications may vary. If customer specified requirements for labels packaging, please provide the operation procedure. FL P/N REV. 2Z19200001-Q S1 PAGE 11/11 SPECIFICATION OF THE ENVIRONMENT-RELATED SUBSTANCES Range # Banned Substances Products Maximum concentration ppm (mg/kg) Packing Material Maximum concentration ppm (mg/kg) 1 镉及镉化合物 Cadmium and cadmium compounds 100 100 2 铅及铅化合物 Lead and lead compounds 1000 100 3 汞及汞化合物 Mercury and mercury compounds 1000 100 1000 100 1000 N/A 4 5 六价铬化合物 Hexavalent-Chromium VI (Cr+6) 聚溴联苯 PBB Polybrominated biphenyls 6 聚溴二苯醚 PBDE Polybrominated diphenyl ethers 1000 N/A 7 邻苯二甲酸二(2-乙基己基)酯 DEHP Di (2-ethylhexyl) phthalate 1000 N/A 8 邻苯二甲酸丁苄酯 BBP Butyl Benzyl Phthalate 1000 N/A 9 邻苯二甲酸二丁酯 DBP Dibutyl Phthalate 1000 N/A 10 邻苯二甲酸二异丁酯 DIBP Diisobutyl Phthalate 1000 N/A 11 氟(F)、氯(Cl)、溴(Br)、碘(I) Fluorine、Chlorine、 Bromine、 Iodine 900、900、900、900 注：Br+Cl＜1000 N/A 12 包装材料中重金属(汞、镉、六价 铬、铅、PBB、PBDE)之总量 Heavy metals (mercury, cadmium, lead, Cr+6,PBB and PBDE) in packing materials N/A 100 铅(Pb) + 镉(Cd) + 汞(Hg) + 六价铬 (Cr+6)