找到“2923”相关的规格书共79个
| 型号 | 厂商 | 描述 | 数据手册 | 替代料 | 参考价格 |
|---|---|---|---|---|---|
| 292352-1 | TE Connectivity Ltd | PLUG HOUSING FOR 2P HIGH CURRENT | 获取价格 | ||
| 292353-1 | TE Connectivity Ltd | 2（电源） 位置 用于母插口的体座 连接器 黑色 面板安装 | 获取价格 | ||
| 292336-2 | TE Connectivity Ltd | USB - A USB 2.0 插座 连接器 4 位 通孔，直角，垂直 | 获取价格 | ||
| 292323-5 | TE Connectivity Ltd | USB - A，层叠式 USB 2.0 插座 连接器 8 位 通孔，直角，水平 | 获取价格 | ||
| 292323-3 | TE Connectivity Ltd | USB - A，层叠式 USB 2.0 插座 连接器 8 位 通孔，直角，水平 | 获取价格 | ||
| 292303-1 | TE Connectivity Ltd | 标准USB 2.0 TYPE A连接器，母座，单口，弯插，镀金30uin | 获取价格 | ||
| 292303-5 | TE Connectivity Ltd | CONN USB TYPE A R/A PCB | 获取价格 | ||
| 292304-5 | TE Connectivity Ltd | USB-B（USB TYPE-B） USB 2.0 插座 连接器 4 位 通孔，直角 | 获取价格 | ||
| 292358-4 | TE Connectivity Ltd | 获取价格 | |||
| 14-44-2923 | MOLEX1[MolexElectronicsLtd.] | 14-44-2923 - 2.54mm (.100") Pitch SL™ Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 0.76μm (30μ") Gold (Au), 23 Circuits - Molex Electronics Ltd. | 获取价格 | ||
| M312L2923BTS-CAA | SAMSUNG[Samsungsemiconductor] | M312L2923BTS-CAA - DDR SDRAM Registered Module - Samsung semiconductor | 获取价格 | ||
| M381L2923CUM-CCC | SAMSUNG[Samsungsemiconductor] | M381L2923CUM-CCC - DDR SDRAM Unbuffered Module - Samsung semiconductor | 获取价格 | ||
| LPC2923FBD100 | NXP[NXPSemiconductors] | LPC2923FBD100 - ARM9 microcontroller with CAN, LIN, and USB - NXP Semiconductors | 获取价格 | ||
| LPC2923FBD100 | PHILIPS[NXPSemiconductors] | LPC2923FBD100 - ARM9 microcontroller with CAN, LIN, and USB device - NXP Semiconductors | 获取价格 | ||
| 292395-000 | TE Connectivity Ltd | Heat Shrink Molded Boot | 获取价格 | ||
| M381L2923BTM-LCC | SAMSUNG[Samsungsemiconductor] | M381L2923BTM-LCC - DDR SDRAM Unbuffered Module 184pin Unbuffered Module based on 512Mb B-die with 64/72-bit Non ECC/ECC 66 TSOP-II - Samsung semiconductor | 获取价格 | ||
| M368L2923DUN-CB3 | SAMSUNG[Samsungsemiconductor] | M368L2923DUN-CB3 - DDR SDRAM Unbuffered Module 184pin Unbuffered Module based on 512Mb D-die with 64/72-bit Non ECC/ECC 66 TSOP-II with Pb-Free (RoHS compliant) - Samsung semiconductor | 获取价格 | ||
| M381L2923BUM-LB3 | SAMSUNG[Samsungsemiconductor] | M381L2923BUM-LB3 - DDR SDRAM Unbuffered Module 184pin Unbuffered Module based on 512Mb B-die with 64/72-bit Non ECC/ECC 66 TSOP-II - Samsung semiconductor | 获取价格 | ||
| M381L2923BUM-CB3 | SAMSUNG[Samsungsemiconductor] | M381L2923BUM-CB3 - DDR SDRAM Unbuffered Module 184pin Unbuffered Module based on 512Mb B-die with 64/72-bit Non ECC/ECC 66 TSOP-II - Samsung semiconductor | 获取价格 | ||
| M381L2923DUM-LCC | SAMSUNG[Samsungsemiconductor] | M381L2923DUM-LCC - DDR SDRAM Unbuffered Module 184pin Unbuffered Module based on 512Mb D-die with 64/72-bit Non ECC/ECC 66 TSOP-II with Pb-Free (RoHS compliant) - Samsung semiconductor | 获取价格 |
