找到“ALD2721PB”相关的规格书共6,145个
| 型号 | 厂商 | 描述 | 数据手册 | 替代料 | 参考价格 |
|---|---|---|---|---|---|
| M368L6523DUS-CB3 | SAMSUNG[Samsungsemiconductor] | M368L6523DUS-CB3 - DDR SDRAM Unbuffered Module 184pin Unbuffered Module based on 512Mb D-die with 64/72-bit Non ECC/ECC 66 TSOP-II with Pb-Free (RoHS compliant) - Samsung semiconductor | 获取价格 | ||
| 78065-8101 | MOLEX9[MolexElectronicsLtd.] | 78065-8101 - 1.00mm (.039") Pitch DDR2 DIMM Socket, Very Low Profile, Vertical, Press-fit, 1.8VCenter Keys, 3.30mm (.130") Tail Length, Black Latches, 240 Circuits, 0.76μm (30μmGold(Au) Plating, Soldertail: Tin/Lead (Pb/Sn) over Nickel Underplate version - Molex Electronics Ltd. | 获取价格 | ||
| 44914-0203 | MOLEX6[MolexElectronicsLtd.] | 44914-0203 - 3.00mm (.118") Pitch Micro-Fit 3.0 CPI™ Header, Dual Row, Vertical, Compliant Pin Interface, 2 Circuits, LCP, Glass-Filled, UL 94V-0, 0.76μm (30μ") Gold (Au) Selective Contact Plating, Tin/Lead (Sn/Pb) Plated Tails, Glow Wire Compatible - Molex Electronics Ltd. | 获取价格 | ||
| 0449140203 | MOLEX6[MolexElectronicsLtd.] | 0449140203 - 3.00mm (.118") Pitch Micro-Fit 3.0 CPIâ„¢ Header, Dual Row, Vertical, Compliant Pin Interface, 2 Circuits, LCP, Glass-Filled, UL 94V-0, 0.76μm (30μ") Gold (Au) Selective Contact Plating, Tin/Lead (Sn/Pb) Plated Tails, Glow Wire Compatible - Molex Electronics Ltd. | 获取价格 | ||
| 0780658101 | MOLEX9[MolexElectronicsLtd.] | 0780658101 - 1.00mm (.039") Pitch DDR2 DIMM Socket, Very Low Profile, Vertical, Press-fit, 1.8VCenter Keys, 3.30mm (.130") Tail Length, Black Latches, 240 Circuits, 0.76μm (30μmGold(Au) Plating, Soldertail: Tin/Lead (Pb/Sn) over Nickel Underplate version - Molex Electronics Ltd. | 获取价格 |
