TLE5014C16DXUMA1

TLE5014D Preface This document is an addendum to the TLE5014 datasheet and describes the TLE5014D dual die angle sensor. For all parameters which are not specified here, the TLE5014 datasheet is valid. Features • Giant Magneto Resistance (GMR)-based principle • Two identical dies in one package (providing channel 1 and channel 2 output) • Fully redundant 2-channel solution for highest functional safety requirements • High voltage and reverse polarity capability • EEPROM for storage of configuration (e.g. zero angle) and customer specific ID • 12 bit representation of absolute angle value on the output • Max. 1° angle error over lifetime and temperature range • Developed according to ISO26262 with process complying to ASIL-D • Internal safety mechanisms with diagnostic coverage >97% for each channel • Interfaces: PWM, SPC, SENT (based on SAE J2716-2010) • 32 point look-up table to correct for systematic angle errors (e.g. magnetic circuit) • 112 bit customer ID (programmable) • Automotive qualified Q100, Grade 1: -40°C to 125°C (ambient temperature) Functional Safety • Safety Manual and Safety Analysis Summary Report available on request Applications The TLE5014 GMR-based angle sensor is designed for angular position sensing in automotive applications. Fully redundancy of two chips in one package supporting highest functional safety requirements. Description Table 0-1 Derivative Ordering codes (see Chapter 4 for description of derivatives) Product Type Marking Ordering Code Package Comment TLE5014S16D 014SD SP001410046 PG-TDSO-16 SENT Interface TLE5014C16D 014CD SP001410042 PG-TDSO-16 SPC Interface TLE5014P16D 014PD SP001673472 PG-TDSO-16 PWM Interface Final Datasheet www.infineon.com 1 Rev. 1.0 2018-04-04 TLE5014D Table of Contents 1 1.1 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin Description 3 2 Dual Sensor Angle Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 4.1 4.2 4.3 Pre-Configured Derivatives . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 TLE5014C16D 6 TLE5014S16D 6 TLE5014P16D 7 5 5.1 5.2 5.3 5.4 5.5 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Package Parameters 8 Package Outline 9 Footprint 10 Packing 10 Marking 11 6 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Final Datasheet 2 Rev. 1.0 2018-04-04 TLE5014D Pin Configuration 1 Pin Configuration 16 15 14 13 12 11 10 9 Center of Sensitive area 1 2 3 Figure 1-1 Pin configuration (top view) 1.1 Pin Description 4 5 6 7 8 The following table describes the pin-out of the chip. Pins 1-8 correspond to channel 1 of the sensor (top IC in the package). Pins 9-16 correspond to channel 2 (bottom IC in the package). The two sensors are galvanically decoupled. Table 1-1 Pin Description Pin No. Symbol In/Out Function 1 IF1-1 I address coding for programming in bus mode, channel 1 (see TLE5014 datasheet) connect to GND for SENT / PWM interface 2 IF2-1 I address coding for programming in bus mode, channel 1 (see TLE5014 datasheet) connect to GND for SENT / PWM interface 3 IF3-1 I connect to IFC 4 VDD-1 - supply voltage, positive for channel 1 5 GND-1 - supply voltage, ground for channel 1 6 IFA-1 - connect to GND 7 IFB-1 I/O SENT / SPC / PWM / SICI interface for channel 1 8 IFC-1 O address coding for programming in bus mode, channel 1 (see TLE5014 datasheet) connect to IF3 Final Datasheet 3 Rev. 1.0 2018-04-04 TLE5014D Dual Sensor Angle Output Table 1-1 Pin Description (cont’d) Pin No. Symbol In/Out Function 9 IFC-2 O address coding for programming in bus mode, channel 2 (see TLE5014 datasheet) connect to IF3 10 IFB-2 I/O SENT / SPC / PWM / SICI interface for channel 2 11 IFA-2 - connect to GND 12 GND-2 - supply voltage, ground for channel 2 13 VDD-2 - supply voltage, positive for channel 2 14 IF3-2 I connect to IFC 15 IF2-2 I address coding for programming in bus mode, channel 2 (see TLE5014 datasheet) connect to GND for SENT / PWM interface 16 IF1-2 I address coding for programming in bus mode, channel 2 (see TLE5014 datasheet) connect to GND for SENT / PWM interface 2 Dual Sensor Angle Output The bottom sensor element of the Product_Short is flipped relative to the orientation of the top sensor element Therefore the rotation direction sensed by the bottom element is opposite to the top element. This is advantageous for safety critical applications, as the two sensor elements do generally not output the same angle. Figure 2-1 shows the output of the two sensor ICs for a given external magnetic field orientation. 360° top sensor output bottom sensor output sensor output angle 270° 180° 90° 0° Figure 2-1 90° 180° 270° external magnetic field angle 360° Dual die angle output For applications where an identical angle output of both ICs is desired, the rotation direction and angle offset of one sensor IC can be reconfigured by changing the settings in the ANG_BASE register of the EEPROM. Final Datasheet 4 Rev. 1.0 2018-04-04 TLE5014D Absolute Maximum Ratings 3 Absolute Maximum Ratings Attention: Stresses above the max. values listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the device. Table 3-1 ESD protection Parameter Symbol Values Min. Unit Notes Max. Electro-Static-Discharge VHBM voltage (HBM), according to ANSI/ESDA/JEDEC JS-001 V HBM ±4.0 kV HBM contact discharge for pins VDD, GND, IFB; ground pins connected ±2.0 kV HBM contact discharge for all pins, ground pins not connected Electro-Static-Discharge voltage (CDM), according to JESD22-C101 ±0.5 kV for all pins except corner pins Final Datasheet VCDM ±0.75 kV 5 for corner pins only Rev. 1.0 2018-04-04 TLE5014D Pre-Configured Derivatives 4 Pre-Configured Derivatives Derivatives of the TLE5014D are available with different pre-configured register settings for specific application (“settings”). For each derivative with such settings, the interface type is locked and cannot be changed. Only the derivatives with such settings have been released for production by Infineon. Other settings/parameters for other applications could be adjusted but such adjusted settings would not have been released for production by Infineon. Furthermore, the available safety analysis and safety manual does only include these preconfigured derivatives. 4.1 TLE5014C16D The sensor has SPC as predefined interface which is locked and cannot be changed. The predefined SPC configuration of TLE5014C16D is shown below: Table 4-1 SPC Derivative Configuration TLE5014C16D Interface SPC unit time SPC low time SPC Trigger Short Serial Message SPC 2.5µs 5UT constant 90UT enabled Table 4-2 SPC Derivative Configuration TLE5014C16D Rolling Counter Rolling Counter in CRC Look-up Table SPC ID Output driver enabled disabled 00B open drain w/ controlled slope enabled, preconfigured Following parameters and values are allowed to modify: • • • • SPC unit time: 1.5µs / 2.5µs Short serial message: enable / disable Rolling counter in CRC: enable /disable SPC ID: 0 / 1 / 2 / 3 4.2 TLE5014S16D The sensor has SENT as predefined interface which is locked and cannot be changed. The predefined SENT configuration of TLE5014S16D is shown below: Table 4-3 SENT Derivative Configuration TLE5014S16D Interface SENT unit time SENT low time SENT Protocol Type Short Serial Message SENT 3.0µs 5UT single secure sensor enabled Table 4-4 SENT Derivative Configuration TLE5014S16D SENT Error Indication SENT Data Range Pause Pulse Look-up Table error code 4091 enabled 1 ... 4088 enabled Output driver enabled, preconfigured push/pull Following parameters and values are allowed to modify: • • • Short serial message: enable / disable Pause pulse: enable /disable SENT Protocol Type: Standard / Single Secure Sensor Final Datasheet 6 Rev. 1.0 2018-04-04 TLE5014D Pre-Configured Derivatives • SENT Error Indication: enable (data range: 1 ... 4088 , error code: 4091) / disable (data range: 0 ... 4095, no error code) 4.3 TLE5014P16D The sensor has PWM as predefined interface which is locked and cannot be changed. Table 4-5 PWM Derivative Configuration TLE5014P16D Interface PWM Frequency PWM Data Range PWM Fault indication PWM BIST Error or Reset Indication PWM 200Hz 12.5% ... 87.5% 5% 95% Table 4-6 PWM Derivative Configuration TLE5014P16D PWM Starting Level Look-up Table Output driver high (rising edge) enabled, preconfigured push/pull • To be compliant with the existing safety analysis no change of above parameters is allowed unless authorized by Infineon Final Datasheet 7 Rev. 1.0 2018-04-04 TLE5014D Package Information 5 Package Information The device is qualified with a MSL level of 3. It is halogen free, lead free and RoHS compliant. 5.1 Package Parameters Table 5-1 Package Parameters Parameter Symbol Limit Values Unit Notes 120 K/W Junction to air1), only one chip is active 100 K/W Junction to air1), both chips are active RthJC 45 K/W Junction to case RthJL 70 K/W Junction to lead Min. Thermal resistance Typ. Max. RthJA 260°C2) Moisture Sensitively Level MSL 3 Lead Frame Cu Plating Sn 100% > 7 μm 1) according to Jedec JESD51-7 2) suitable for reflow soldering with soldering profiles according to JEDEC J-STD-020E (December 2014) Table 5-2 Position of the die in the package Parameter Symbol Limit Values Min. Unit Notes Typ. Max. Tilt ±3 ° in respect to the z-axis and reference plane (see Figure 5-1), Rotational displacement ±3 ° in respect to the reference axis (see Figure 5-1) Placement tolerance in package ±100 µm in x and y direction, for each die in the package z y Chip Package Tilt angle Reference plane x Figure 5-1 Die pad Rotational displacement Chip x Tolerance of the die in the package Final Datasheet 8 Rev. 1.0 2018-04-04 TLE5014D Package Information 5.2 Package Outline Figure 5-2 PG-TDSO-16 package dimension 0.2 0.2 Figure 5-3 Position of sensing element Final Datasheet 9 Rev. 1.0 2018-04-04 TLE5014D Package Information 5.3 Footprint Figure 5-4 Footprint of PG TDSO-16 5.4 Packing Figure 5-5 Tape and Reel Final Datasheet 10 Rev. 1.0 2018-04-04 TLE5014D Package Information 5.5 Marking Position Marking Description 1st Line Gxxxx G..green, 4-digit..date code 2nd Line xxxxxxxx Interface type and version ( see Table 0-1, Marking) 3rd Line xxx Lot code Figure 5-6 Marking of PG-TDSO-16 Final Datasheet 11 Rev. 1.0 2018-04-04 TLE5014D Revision History 6 Revision History Revision Date Changes 1.0 2018-03-26 initial version Final Datasheet 12 Rev. 1.0 2018-04-04 Please read the Important Notice and Warnings at the end of this document Trademarks of Infineon Technologies AG µHVIC™, µIPM™, µPFC™, AU-ConvertIR™, AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, CoolDP™, CoolGaN™, COOLiR™, CoolMOS™, CoolSET™, CoolSiC™, DAVE™, DI-POL™, DirectFET™, DrBlade™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, GaNpowIR™, HEXFET™, HITFET™, HybridPACK™, iMOTION™, IRAM™, ISOFACE™, IsoPACK™, LEDrivIR™, LITIX™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OPTIGA™, OptiMOS™, ORIGA™, PowIRaudio™, PowIRStage™, PrimePACK™, PrimeSTACK™, PROFET™, PRO-SIL™, RASIC™, REAL3™, SmartLEWIS™, SOLID FLASH™, SPOC™, StrongIRFET™, SupIRBuck™, TEMPFET™, TRENCHSTOP™, TriCore™, UHVIC™, XHP™, XMC™. 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