找到“H1266”相关的规格书共45个
| 型号 | 厂商 | 描述 | 数据手册 | 替代料 | 参考价格 |
|---|---|---|---|---|---|
| CY7C1266KV18 | CYPRESS[CypressSemiconductor] | CY7C1266KV18 - 36-Mbit DDR II SRAM 2-Word Burst Architecture (2.0 Cycle Read Latency) - Cypress Semiconductor | 获取价格 | ||
| 79109-1266 | MOLEX9[MolexElectronicsLtd.] | 79109-1266 - 2.00mm (.079") Pitch Milli-Grid™ Receptacle, Surface Mount, Vertical, Top/BottomEntry, with Press-fit Plastic Pegs, without Cap, Tube, 0.76μm (30μ") Gold (Au) - Molex Electronics Ltd. | 获取价格 | ||
| A-70400-1266 | MOLEX1[MolexElectronicsLtd.] | A-70400-1266 - 2.54mm (.100") Pitch SL™ Insulation Displacement Connector Assembly, Female, Single Row, Version C, Front Ribs, Wire Size 26, 0.76μm (30μ") Gold (Au), 7 Circuits - Molex Electronics Ltd. | 获取价格 | ||
| 87759-1266 | MOLEX10[MolexElectronicsLtd.] | 87759-1266 - 2.00mm (.079) Pitch Milli-Grid™ Header, Surface Mount, Vertical, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Pick-and-Place Cap - Molex Electronics Ltd. | 获取价格 | ||
| 70287-1266 | MOLEX8[MolexElectronicsLtd.] | 70287-1266 - 2.54mm (.100") Pitch C-Grid® Header, Breakaway, Dual Row, Vertical, with RetentionPin, 46 Circuits, 8.13mm (.320") Mating Pin Length, 0.76μm (30μ") Gold (Au) Selective - Molex Electronics Ltd. | 获取价格 |
