CLA80MT1200NHB
High Efficiency Thyristor
VRRM
=
1200 V
I TAV
=
40 A
VT
=
1,26 V
Three Quadrants operation: QI - QIII
1~ Triac
Part number
CLA80MT1200NHB
Backside: Terminal 2
Three Quadrants Operation
T2
Positive Half Cycle
+
(-) IGT
T2
(+) IGT
T1
REF
IGT -
2
T2
T1
QII QI
QIII QIV
REF
+ IGT
(-) IGT
3
1
T1
REF
Negative Half Cycle
Note: All Polarities are referenced to T1
Features / Advantages:
Applications:
Package: TO-247
● Triac for line frequency
● Three Quadrants Operation
- QI - QIII
● Planar passivated chip
● Long-term stability
of blocking currents and voltages
● Line rectifying 50/60 Hz
● Softstart AC motor control
● DC Motor control
● Power converter
● AC power control
● Lighting and temperature control
● Industry standard outline
● RoHS compliant
● Epoxy meets UL 94V-0
Terms Conditions of usage:
The data contained in this product data sheet is exclusively intended for technically trained staff. The user will have to evaluate the suitability of the product for the intended application and
the completeness of the product data with respect to his application. The specifications of our components may not be considered as an assurance of component characteristics. The
information in the valid application- and assembly notes must be considered. Should you require product information in excess of the data given in this product data sheet or which concerns
the specific application of your product, please contact the sales office, which is responsible for you.
Due to technical requirements our product may contain dangerous substances. For information on the types in question please contact the sales office, which is responsible for you.
Should you intend to use the product in aviation, in health or live endangering or life support applications, please notify. For any such application we urgently recommend
- to perform joint risk and quality assessments;
- the conclusion of quality agreements;
- to establish joint measures of an ongoing product survey, and that we may make delivery dependent on the realization of any such measures.
IXYS reserves the right to change limits, conditions and dimensions.
© 2015 IXYS all rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
20150827c
CLA80MT1200NHB
Ratings
Rectifier
Conditions
Symbol
VRSM/DSM
Definition
max. non-repetitive reverse/forward blocking voltage
TVJ = 25°C
VRRM/DRM
max. repetitive reverse/forward blocking voltage
TVJ = 25°C
1200
I R/D
reverse current, drain current
VT
forward voltage drop
TVJ = 25°C
10
µA
2
mA
TVJ = 25°C
1,30
V
1,59
V
1,26
V
IT =
40 A
IT =
80 A
IT =
40 A
IT =
80 A
I RMS
RMS forward current per phase
180° sine
VT0
threshold voltage
rT
slope resistance
R thJC
thermal resistance junction to case
TVJ = 125 °C
for power loss calculation only
thermal resistance case to heatsink
total power dissipation
I TSM
max. forward surge current
value for fusing
V
TVJ = 125°C
TC = 120 °C
RthCH
max. Unit
1300
V
VR/D = 1200 V
average forward current
Ptot
typ.
VR/D = 1200 V
I TAV
I²t
min.
1,64
V
T VJ = 150 °C
40
A
88
A
TVJ = 150 °C
0,88
V
10
mΩ
0,4 K/W
K/W
0,25
TC = 25°C
310
W
t = 10 ms; (50 Hz), sine
TVJ = 45°C
520
A
t = 8,3 ms; (60 Hz), sine
VR = 0 V
560
A
t = 10 ms; (50 Hz), sine
TVJ = 150 °C
440
A
t = 8,3 ms; (60 Hz), sine
VR = 0 V
475
A
t = 10 ms; (50 Hz), sine
TVJ = 45°C
1,35 kA²s
t = 8,3 ms; (60 Hz), sine
VR = 0 V
1,31 kA²s
t = 10 ms; (50 Hz), sine
TVJ = 150 °C
970
A²s
940
A²s
t = 8,3 ms; (60 Hz), sine
VR = 0 V
CJ
junction capacitance
VR = 400 V f = 1 MHz
TVJ = 25°C
PGM
max. gate power dissipation
t P = 30 µs
T C = 150 °C
25
t P = 300 µs
PGAV
average gate power dissipation
(di/dt) cr
critical rate of rise of current
TVJ = 150 °C; f = 50 Hz
repetitive, IT = 120 A
t P = 200 µs; di G /dt = 0,3 A/µs;
(dv/dt)cr
critical rate of rise of voltage
V = ⅔ VDRM
VGT
gate trigger voltage
I GT
gate trigger current
VGD
gate non-trigger voltage
I GD
gate non-trigger current
IL
latching current
IG =
0,3 A; V = ⅔ VDRM
non-repet., I T =
pF
10
W
5
W
0,5
W
150 A/µs
40 A
500 A/µs
TVJ = 150°C
500 V/µs
VD = 6 V
TVJ = 25 °C
1,7
TVJ = -40 °C
1,9
V
VD = 6 V
TVJ = 25 °C
± 70
mA
TVJ = -40 °C
± 90
mA
TVJ = 150°C
0,2
V
±1
mA
TVJ = 25 °C
100
mA
R GK = ∞; method 1 (linear voltage rise)
VD = ⅔ VDRM
tp =
10 µs
IG =
0,3 A; di G /dt =
V
0,3 A/µs
IH
holding current
VD = 6 V R GK = ∞
TVJ = 25 °C
70
mA
t gd
gate controlled delay time
VD = ½ VDRM
TVJ = 25 °C
2
µs
tq
turn-off time
IG =
0,3 A; di G /dt =
0,3 A/µs
VR = 100 V; I T = 40 A; V = ⅔ VDRM TVJ =125 °C
di/dt = 10 A/µs dv/dt =
IXYS reserves the right to change limits, conditions and dimensions.
© 2015 IXYS all rights reserved
150
µs
20 V/µs t p = 200 µs
Data according to IEC 60747and per semiconductor unless otherwise specified
20150827c
CLA80MT1200NHB
Package
Ratings
TO-247
Symbol
I RMS
Definition
Conditions
RMS current
per terminal
min.
TVJ
virtual junction temperature
T op
operation temperature
Tstg
storage temperature
-40
typ.
max.
70
Unit
A
-40
150
°C
-40
125
°C
150
°C
6
Weight
MD
mounting torque
FC
mounting force with clip
Product Marking
C
L
A
80
MT
1200
N
HB
XXXXXXXXX
Assembly Line
0,8
1,2
Nm
20
120
N
Part description
IXYS
Logo
Part No.
g
=
=
=
=
=
=
=
=
Thyristor (SCR)
High Efficiency Thyristor
(up to 1200V)
Current Rating [A]
1~ Triac
Reverse Voltage [V]
Three Quadrants operation: QI - QIII
TO-247AD (3)
Zyyww
abcd
Assembly Code
Date Code
Ordering
Standard
Ordering Number
CLA80MT1200NHB
Similar Part
CLA80MT1200NHR
Equivalent Circuits for Simulation
I
V0
R0
Marking on Product
CLA80MT1200NHB
Package
ISO247 (3)
* on die level
Delivery Mode
Tube
Code No.
517024
Voltage class
1200
T VJ = 150 °C
Thyristor
V 0 max
threshold voltage
0,88
V
R0 max
slope resistance *
7,5
mΩ
IXYS reserves the right to change limits, conditions and dimensions.
© 2015 IXYS all rights reserved
Quantity
30
Data according to IEC 60747and per semiconductor unless otherwise specified
20150827c
CLA80MT1200NHB
Outlines TO-247
A
E
A2
Ø P1
ØP
D2
S
Q
D1
D
2x E2
4
1
2
3
L1
E1
L
2x b2
3x b
b4
C
A1
2x e
Sym.
Inches
min.
max.
Millimeter
min.
max.
A
A1
A2
D
E
E2
e
L
L1
ØP
Q
S
b
b2
b4
c
D1
D2
E1
Ø P1
0.185 0.209
0.087 0.102
0.059 0.098
0.819 0.845
0.610 0.640
0.170 0.216
0.215 BSC
0.780 0.800
0.177
0.140 0.144
0.212 0.244
0.242 BSC
0.039 0.055
0.065 0.094
0.102 0.135
0.015 0.035
0.515
0.020 0.053
0.530
0.29
4.70
5.30
2.21
2.59
1.50
2.49
20.79 21.45
15.48 16.24
4.31
5.48
5.46 BSC
19.80 20.30
4.49
3.55
3.65
5.38
6.19
6.14 BSC
0.99
1.40
1.65
2.39
2.59
3.43
0.38
0.89
13.07
0.51
1.35
13.45
7.39
2
3
1
IXYS reserves the right to change limits, conditions and dimensions.
© 2015 IXYS all rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
20150827c
CLA80MT1200NHB
Thyristor
80
500
10000
VR = 0 V
50 Hz, 80% VRRM
60
400
IT
ITSM
2
It
40
1000
[A]
[A]
[A s]
TVJ = 45°C
300
TVJ = 45°C
2
TVJ = 125°C
20
TVJ = 125°C
TVJ = 150°C
TVJ = 125°C
TVJ = 25°C
0
0,0
0,5
1,0
200
1,5
100
2,0
0,01
0,1
VT [V]
1
1
t [s]
Fig. 3 I t versus time (1-10 s)
80
1: IGD, TVJ = 150°C
1
56
1
4
60
TVJ = 125°C
100
23
tgd
IT(AV)M
[µs]
[A]
10
lim.
1000
10000
10
typ.
1
10
0,1
100
30
20
5: PGM = 5 W
6: PGM = 10 W
10
50
40
4: PGAV = 0.5 W
1
dc =
1
0.5
0.4
0.33
0.17
0.08
70
2: IGT, TVJ = 25°C
3: IGT, TVJ = -40°C
[V]
4 5 6 7 8 910
t [ms]
1000
10
3
2
Fig. 2 Surge overload current
ITSM: crest value, t: duration
Fig. 1 Forward characteristics
VG
2
0
100
1000
0
40
IG [mA]
IG [mA]
Fig. 4 Gate voltage & gate current
Fig. 5 Gate controlled delay time tgd
80
80
120
160
Tcase [°C]
Fig. 6 Max. forward current at
case temperature
0,5
RthHA
0.4
0.6
0.8
1.0
2.0
4.0
dc =
1
0.5
0.4
0.33
0.17
0.08
60
P(AV)
0,4
0,3
ZthJC
40
i Rthi (K/W)
1
0.060
2
0.040
3
0.155
4
0.055
5
0.090
0,2
[W]
[K/W]
20
0,1
0
ti (s)
0.0100
0.0001
0.0200
0.2000
0.1100
0,0
0
10
20
30
40
50
IT(AV) [A]
0
50
100
150
Fig. 7a Power dissipation versus direct output current
Fig. 7b and ambient temperature
IXYS reserves the right to change limits, conditions and dimensions.
© 2015 IXYS all rights reserved
1
10
100
1000
10000
t [ms]
Tamb [°C]
Fig. 7 Transient thermal impedance junction to case
Data according to IEC 60747and per semiconductor unless otherwise specified
20150827c