SRV05-4HTG-D

TVS Diode Arrays (SPA®® Diodes) SRV05-4HTG-D, 5V 10A TVS Diode Array RoHS Pb GREEN Description The SRV05-4HTG-D integrates low capacitance rail-torail diodes with an additional zener diode to protect each I/O pin against ESD and high surge events. This robust device can safely absorb 10A surge current per IEC61000-45 (tP=8/20μs) without performance degradation and a minimum ±30kV ESD per IEC 61000-4-2. Their very low loading capacitance also makes them ideal for protecting high speed signal pins. Features Pinout I/O 1 I/O 4 • Low leakage current of 0.5μA (MAX) at 5V • EFT, IEC61000-4-4, 40A (5/50ns) • Small SOT23-6 (JEDEC MO-178) packaging • Lightning, 10A (8/20μs as defined in IEC 61000-4-5 2nd edition) • Halogen free, lead free and RoHS compliant • Low capacitance of 1pF (TYP) per I/O VCC GND • ESD, IEC 61000-4-2, ±30kV contact, ±30kV air • Moisture Sensitivity Level (MSL -1) Applications Top View • Monitors • Set Top Boxes • Notebooks • Flat Panel Displays TX + SP3003-04J/XTG 5 • Firewire Ethernet Differential Protection • Portable Medical • 10/100/100010/100 Ethernet Functional Block Diagram 6 • LCD/PDP TVs 4 Application Examples Unused TX + SP3003-04ATG USB Dual Port Protection 10 10/100 Ethernet 9 PHY 8 7 6 RT TX - USB Controller RX + RT TX - VBUS 1 6 2 5 VBUS 3 4 D+ DGND SRV05-4HTG-D SRV05-4HTG CT 75 75 75 V GND RT CT 1 2 3 1 2 3 D+ D- 5 4 5 SP3003-08ATG 8 910/100/1000 Ethernet PHY 7 TX - Unused TX + 6 TX - 1 6 2 5 3 4 SRV05-4HTG-D SRV05-4HTG RX + RJ45 Unused TX + 10 USB Port GND 10/100/1000 Ethernet Protection SP3003-02J/XTG 75 VBUS CT 4 Unused BUS VCC RT RX - Unused RX VCC USB Port RX + SRV05-4HTG VBUS CT RJ45 Unused RX + RX Unused Unused Life Support Note: Not Intended for Use in Life Support or Life Saving Applications RX VCC The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. VCC GND ©2019 Littelfuse, Inc. 1 2 Specifications are subject to change without notice. Revision: 03/18/19 3 1 2 3 4 To Twisted-Pair Network I/O 3 5 To Twisted-Pair Network I/O 2 TVS Diode Arrays (SPA®® Diodes) Low Capacitance ESD Protection - SRV05-4HTG-D Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Current (tp=8/20μs) 10 A PPk Peak Pulse Power (tp=8/20μs) 150 W TOP Operating Temperature -40 to 125 °C TSTOR Storage Temperature -55 to 150 °C Notes: CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Reverse Standoff Voltage VRWM IR = 1μA, I/O to GND Breakdown Voltage VBR IR = 1mA, I/O to GND Reverse Leakage Current ILEAK VR=5V, I/O to GND 0.1 0.5 μA IPP=5A, tp=8/20μs, I/O to GND 11.7 13 V Clamp Voltage Dynamic Resistance2 RDYN ESD Withstand Voltage1 VESD Diode Capacitance1 6 Typ Max Units 6 V 8.5 V IPP=8A, tp=8/20μs, I/O to GND 12.5 14 V IPP=10A, tp=8/20μs, I/O to GND 13.2 15 V TLP, tp=100ns, I/O to GND 0.28 VC 1 Min Ω IEC 61000-4-2 (Contact Discharge) ±30 kV IEC 61000-4-2 (Air Discharge) ±30 kV CI/O-GND Reverse Bias=0V, f=1MHz, I/O to GND 1 CI/O-I/O Reverse Bias=0V, f=1MHz, I/O to I/O 0.5 3 pF pF Notes: 1Parameter is guaranteed by design and/or component characterization. 2 Transmission Line Pulse (TLP) test setting : Std.TDR(50Ω),tp=100ns, tr=0.2ns ITLP and VTLP averaging window: start t1=70ns to end t2=80ns 8/20μs Pulse Waveform Capacitance vs. Reverse Bias 110% 3.0 100% Capacitance (pF) 90% Percent of IPP 80% 70% 60% 50% 40% 2.0 1.5 1.0 0.5 30% 20% 0.0 10% 0% 2.5 0.0 5.0 10.0 15.0 Time (μs) ©2019 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 03/18/19 20.0 25.0 30.0 0.0 1.0 2.0 3.0 Bias Voltage (V) 4.0 5.0 TVS Diode Arrays (SPA®® Diodes) Low Capacitance ESD Protection - SRV05-4HTG-D Negative Transmission Line Pulsing (TLP) Plot 40 0 35 -5 30 -10 25 TLP Current (A) TLP Current (A) Positive Transmission Line Pulsing (TLP) Plot 20 15 -15 -20 -25 10 -30 5 -35 0 -40 0 5 10 15 20 25 -20 -15 -10 -5 0 TLP Voltage (V) TLP Voltage (V) Clamping Voltage vs. Peak Pulse Current 15.0 Clamp Voltage -VC (V) 12.0 9.0 6.0 3.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 Peak Pulse Current -I PP (A) IEC 61000-4-2 +8 kV Contact ESD Clamping Voltage ©2019 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 03/18/19 IEC 61000-4-2 -8 kV Contact ESD Clamping Voltage TVS Diode Arrays (SPA®® Diodes) Low Capacitance ESD Protection - SRV05-4HTG-D Soldering Parameters Pre Heat Pb – Free assembly 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow tP TP - Temperature Min (Ts(min)) - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Temperature Reflow Condition Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 tS time to peak temperature Time Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Lead Plating Matte TIn Do not exceed 260°C Lead Material Copper Alloy Lead Conpanarity 0.004 inches(0.102mm) Substrate Material Silicon Body Material Molded Compound Flammability UL Recognized compound meeting flammability rating V-0 Ordering Information Part Number Package Min. Order Qty. SRV05-4HTG-D SOT23-6 3000 Part Marking System Product Characteristics Part Numbering System SRV05 -4 H T G -D TVS Diode Arrays (SPA® Diodes) Series G= Green T= Tape & Reel Package SOT23-6 ©2019 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 03/18/19 TVS Diode Arrays (SPA®® Diodes) Low Capacitance ESD Protection - SRV05-4HTG-D Package Dimensions - SOT23-6 D Symbol Pin1 A2 b Bottom View bx6 e A1 A1 A A2 E E1 A b1 c c1 L1 D E b1 E1 L1 c Detail A c1 L2 (gauge plane) e1 Top View B θ L B Detail A Side View Section B-B Max Min 0.00 0.90 0.30 0.30 0.08 0.08 2.70 2.60 1.45 1.15 0.40 0.13 2.90 2.80 1.60 0.95 BSC 1.90 BSC 0.50 0.60 REF 0.25 BSC 4° 1.45 0.15 1.30 0.50 0.45 0.22 0.20 3.05 3.00 1.75 0.000 0.035 0.012 0.012 0.003 0.003 0.106 0.102 0.057 e L 0.30 L1 0.95 0.95 L2 0° 0.60 8° Nom 0.045 0.016 0.005 0.114 0.110 0.063 0.037 BSC 0.075 BSC 0.012 0.020 0.024 REF 0.010 BSC 0° 4° Max 0.057 0.006 0.051 0.020 0.018 0.009 0.008 0.120 0.118 0.069 0.024 8° 0.85 0.33 0.85 Ɵ Inches Nom e1 b L Millimeters Min 0.60 Recommended soldering pad layout (unit :mm) Drawing#: H02-B Embossed Carrier Tape & Reel Specification — SOT23-6 8mm TAPE AND REEL 1.5mm DIA. HOLE ACCESS HOLE 14.4mm 4.0mm 1.75mm 2.0mm CL 8mm 4.0mm 13mm 180mm GENERAL INFORMATION SOT-23 (8mm POCKET PITCH) 1. 3000 PIECES PER REEL. 2. ORDER IN MULTIPLES OF FULL REELS ONLY. 3. MEETS EIA-481 REVISION "A" SPECIFICATIONS. 60mm 8.4mm USER DIRECTION OF FEED PIN 1 Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics. ©2019 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 03/18/19