TR0636E-10026

IT3 Th er m al Cy c l i n g Tes t TR0636E-10026 IT3 Th er m al Cy c l i n g Tes t Rep o r t (So l d er t y p e: Sn 63 Pb 37) Approved. TY. ARAI June/23rd/2008 Checked . TM. MATSUO June/23rd /2008 Prepared. TY. TAKADA June/23rd /2008 Hi r o s e El ec t r i c Co ., L td . -1- IT3 Th er m al Cy c l i n g Tes t TR0636E-10026 CONTENTS 1 OVERVIEW ................................................................................................................................. 3 2 TEST OBJECTIVES ....................................................................................................................... 3 3 THERMAL CYCLING TEST PROCEDURE .......................................................................................... 4 4 TEST VEHICLES .......................................................................................................................... 5 4.1 Connector Type................................................................................................................... 5 4.2 Test Vehicle Configuration ................................................................................................... 5 4.3 Virgin or Reworked .............................................................................................................. 9 4.4 Test Variations ................................................................................................................... 9 4.5 Number of Test Vehicles and Connectors ............................................................................ 9 5 ASSEMBLY CONDITIONS ............................................................................................................. 10 5.1 Test Board Design Detail ................................................................................................... 10 5.2 Test Vehicle Assembly ....................................................................................................... 12 5.3 Rework ............................................................................................................................. 13 5.4 X-ray Inspection ................................................................................................................ 14 5.5 Continuity Check ............................................................................................................... 15 6 THERMAL CYCLING TEST PROCESS............................................................................................. 16 6.1 Preconditioning by Isothermal Aging.................................................................................. 16 6.2 Thermal Cycle Temperature Profile Requirement .............................................................. 16 6.3 Thermal Cycling Test Execution......................................................................................... 17 6.4 Measurement .................................................................................................................... 18 6.5 Failure Criteria .................................................................................................................. 18 6.6 Identif ying f or Failure Connector(s) and Failure Point(s) .................................................... 18 6.7 Rerouting with Jumper W ire .............................................................................................. 18 6.8 Test Duration..................................................................................................................... 18 6.9 Test Result ........................................................................................................................ 19 7 SOLDER BALL SHEAR TEST ........................................................................................................ 20 7.1 Measurement Method ...................................................................................................... 20 7.2 Failure Mode ..................................................................................................................... 20 7.3 Test Result ........................................................................................................................ 20 8 REVISION RECORD .................................................................................................................... 21 9 Attachment _1 : 10 Attachment _2 : 11 Attachment _3: 07-29834-R1 Thermal Cycling Test Report (Trace Laboratories,Inc.) TR0636E-20027 BGA SHEARING TEST REPORT TR0636E-20033 CROSS SECTIONING REPORT -2- IT3 Th er m al Cy c l i n g Tes t TR0636E-10026 1 OVERVIEW The f ollowing test report is to be considered official documentation f or results f ound during thermal cycle testing of the IT3 series BGA connector system. BGA connection is becoming a key technology f or current and next generation high-speed transmission. It is crucial to perf orm accelerated lif e time testing to both simulate actual applications and prov e BGA attachment reliability. All processes described herein, including test board design and thermal cycling test conditions, are based on and conf orm to IPC-9701. All assembly and re-work processes were perf ormed by Jabil Circuit, Inc. (San Jose, Ca., hereafter ‘Jabil’), and thermal cycling was perf ormed by Trace Laboratories, Inc.(Chicago, Il.). This document includes all processes and test procedures f ollowed, along with who and where they were perf ormed. 2 T EST OBJ ECTIVES The test samples and processes were prepared to simulate various applications that included: Both virgin and rework assemblies, connector configurations, and both single and multiple connector mounts. -3- IT3 Th er m al Cy c l i n g Tes t TR0636E-10026 3 T HERM AL CYCL ING T EST PROCEDURE Virgin assembly (5.2) T est samples (4.5) Eutectic X- ray inspection (5.4) Continuity check (5.5) Rework (5.3) Jabil Test samples (4.5) Eutectic X-r ay inspection (5.4) Continuity check (5.5) T wo combinations of assembled test samples [1 vir gin, 1 r ewor ked] Thermal cycling test ( 6) T hermal cycling test start ( 6.3) Monitor the resistance increase to initial resistance (6.4) 20 % or more incr ease to the initial r esistance is detected for five consecutive r eading scans (6.5) Yes (Fail u r e): Fi v e c o n s ec u t i v e r ead i n g sc an s o r m o r e Trace Labs No ( Pass ) Suspend thermal cycling test. Detect failure points. ( 6.6) Rer outing to skip the failure points with jumper wire ( 6.7) Resume T est Thermal Cycling Test Report (9) NO ( Fai l u r e): Mo r e t h an 50 % o f al l s o l d er j o i n t s Failure points =< 50% (6.5) YES (Pas s) T est duration (6.8) 3500 cycles Terminate test Hir ose & Jabil Cross Section at BG A joints Jabil Solder ball sheer test (7) Hirose Solder Ball Sheer Test Report (1 0) Cross Section in g Report (11) -4- IT3 Th er m al Cy c l i n g Tes t TR0636E-10026 4 T EST VEHICL ES The f ollowing parameters were applied to simulate various manuf acturing and connector usage situations. 4.1 Co n n ec t o r Ty p e Mezzanine Connector: Hirose IT3 series Receptacle IT3M-300S-BGA(57)…Mounted on Mother Board IT3D-300S-BGA(57)…Mounted on Daughter Card Interposer Assembly Interposer assembly IT3-300P-17H(03)…17 mm Stacking Height IT3-300P-32H(03)…32 mm Stacking Height Receptacle IT3 Connector 4.2 Tes t Veh i c l e Co n f i g u r at i o n Boards were designed to a thickness of 3.3 mm (125 mils) per IPC-9701 4.2.1 Mu l t i p l e Co n n ec t o r Mo u n t In many applications, multiple connectors are mounted on one daughter card which can create potential alignment issues and diff erent stresses on solder joints. This test covers multiple connector mounting in various configurations. Config. 1 Numbers of connectors / Daughter card Remarks 1 Individual Config. 2 2 X Direction(2 CN) Config. 3 2 Y Direction(2CN) Config. 4 4 Quad(4 CN) -5- IT3 Th er m al Cy c l i n g Tes t TR0636E-10026 4.2.2 Tes t B o ar d Ex am p l es IT3 mezzanine connectors were assembled to the board and tested . Each test board has f our IT3 connectors 300 mm IT3M-300S-BGA (57) 300 mm Mo t h er B o ar d 300 mm IT3D-300S-BGA (57) 300 mm Dau g h t er Car d （Co n f i g .4） -6- IT3 Th er m al Cy c l i n g Tes t TR0636E-10026 4.2.3 Tes t B o ar d Co n f i g u r at i o n s Config. 1 ---One connector per daughter card Spacer Position Config. 2 ---Two connectors per daughter card (X direction) Spacer Position -7- IT3 Th er m al Cy c l i n g Tes t TR0636E-10026 Config. 3 ---Two connectors per daughter card (Y direction) Spacer Position Config. 4 --- Four connectors per daughter card Spacer Position -8- IT3 Th er m al Cy c l i n g Tes t TR0636E-10026 4.3 Vi r g i n o r Rew o r k ed To simulate the actual assembly process, both “Virgin” and “Reworked” board samples were tested. Assembly was done by Jabil, using industry standard assembly /rework equipment and processes. Virgin Test Board Connector Virgin Virgin Reworked Reuse after connector removal Virgin 4.4 Typ e o f So l d er Virgin Solder Ball on Connector Solder Paste Eutectic Eutectic Reworked Eutectic Eutectic 4.5 Nu m b er o f Tes t Veh i cl es an d Co n n ec t o r s For 3.3mm (125 mil) thick test boards, the f ollowing number of connectors were used. Height IT3-300S Totals 17H 32H Config 1 6/2 6/2 12/4 Config 2 6/2 6/2 12/4 Config 3 6/2 6/2 12/4 Config 4 6/2 6/2 12/4 Total # of Connectors 24/8 24/8 48/16 Note: 12/4 represents 12 Virgin and 4 Reworked -9- IT3 Th er m al Cy c l i n g Tes t TR0636E-10026 5 ASSEM BLY CONDITIONS 5.1 Tes t B o ar d Des i g n Det ai l Test Board Design Details per IPC-9701 Item 1 2 3 4 5 Thickness # of Metal Layers Layer Structure PCB Material Ground Layer Requirement 3.3mm (125 mils) per IPC-9701 16 layers See Fig. 1 on the next page High Tg FR-4 Remaining 70% copper mesh Remarks − − − IS-410/NP-150TL Ground plane on even # layers 6 7 Signal Layer Daisy Chain Remaining 30% copper weav e On top layer only Signal traces on odd # layers − For f ailure analysis purposes, pads are connected by jumper cable to continue rest of the cycles if any f ailure is f ound. Simulate mechanical strength of actual PCBs with vias. Passed 8 Pad and Via Pads f or probing on the bottom layer through via 9 Surf ace Finish High Tg OSP (Organic solderability preserv ative) IPC-S-804B solderability test IPC-TM-650 insulation resistance test IPC-6012(0.75%) warp and twist test 10 Pad Type Copper Thickness NSMD (Non-solder mask def ined) Outer layer: 35 microns − 11 Inner ground: 35 microns Inner signal: 18 microns − 12 13 Trace W idth # of Connectors 200 microns (8 mils) 10 connectors per board maximum 150 microns (6 mils) minimum (IPC-9701) − Note: Test boards were designed to measure electrical continuity using the daisy chain circuit only. Vias were not connected to any specific signal or ground layers. Neither ground contacts nor ground layers are connected anywhere. - 10 - IT3 Th er m al Cy c l i n g Tes t TR0636E-10026 Top layer (dais y c hained) Ground (meshed. 70% copper) Signal (weaved 30% c opper) Layer Top 2nd 3rd 4th 5th 6th 7th 8th 9th 10th 11th 12th 13th 14th 15th Bottom Footprint type Daisy chain Ground layer Signal layer Type A Ground layer Signal layer Type B Ground layer Signal layer Type A Ground layer Signal layer Type B Ground layer Signal layer Type A Ground layer Signal layer Type B Ground layer Signal layer Type A Via test points Bottom layer (Probing pads f or f ailure analys is and jumper c able) * 16 Layers in Total Fi g . 1 PCB L ay er St r u c t u r e IT3* – 300S-BGA Foot Pattern 270- 0.65+/-.05 φ 0 (Solder Mask) Fi g . 2 B GA L an d Des i g n - 11 - IT3 Th er m al Cy c l i n g Tes t TR0636E-10026 5.2 Tes t Veh i c l e As s em b l y Hirose provided assembly/rework process inf ormation, that was then adapted by Jabil to conf orm to industry standard practices. All connectors were assembled / reworked at Jabil. 5.2.1 Vi r g i n As s em b l y Par am et er s Process parameters f ollowed f or testing. Items Type of Reflow Equipment Pre Conditioning Requirements Mass-reflow conv eyor furnaces Dry package Thickness = 0.127 mm (0.005’’) Frame size X= 736.6 mm, Y= 736.6 mm (29’’ x 29’’) Open area ratio : 90% aperture size by area Sn63 : Pb37 Sn63 : Pb37 (Kester EP 256 no-clean Eutectic solder paste) DEK-265GSX Automatic screen printer Printing speed = 1’’/second Stencil snap off = 0 Stencil Solder Ball Composition Solder Paste Composition (Supplier Part Number) Process Parameters Reflow Temperature Profile Reflow Atmosphere See details on the next page. Nitrogen - 12 - IT3 Th er m al Cy c l i n g Tes t TR0636E-10026 5.3 Rew o r k “Rework” consi sts of a series of processes, such as removal of connector by using rework equipment (i.e., SRT), PCB cleaning and placement/reflow of a new connector using rework equipment. 5.3.1 Rew o r k Par am et er s Items Type of Reflow Equipment Stencil Solder Ball Composition Solder PasteComposition Rework Atomosphere Hot air rework station Thickness = 0.127 mm (0.005’’) Open area ratio : 90% aperture size by area Sn63 : Pb37 Sn63 : Pb37 (Kester EP 256 no-clean Eutectic solder paste) Nitrogen Requirements - 13 - IT3 Th er m al Cy c l i n g Tes t TR0636E-10026 5.4 X-r ay In sp ec t i o n Tes t Bo ar d Des i g n Det ai l X-ray inspection after assembly was conducted. All connectors passed the X-ray inspection bef ore thermal cycling. X r ay Ph o t o : IT3D-300S-B GA (57) - 14 - IT3 Th er m al Cy c l i n g Tes t TR0636E-10026 5.5 Co n t i n u i t y Ch ec k Final assembly, including mounting interposer assembly / daughter cards and board spacers, was perf ormed to complete the daisy-chain circuit prior to perf orming the continuity check. R A A Cr o s s s ec t i o n _ A A Resistance Per Connector Chain IT3 Interposer Height 17 mm height 32 mm height Resistance 25 to 29 38 to 42 Unit : Ohm * Resistance includes one connector assembly plus PCB trace. - 15 - IT3 Th er m al Cy c l i n g Tes t TR0636E-10026 6 T HERM AL CYCL ING T EST PROCESS Thermal cycling test perf ormed conf orms to IPC-9701 (JESD22-A-104-B). 6.1 Pr ec o n d i t i o n i n g b y Is o t h er m al Ag i n g Test specimens were subjected to an accelerated thermal aging (e.g. 24 hours at 100 C (-0/+5 C)) in air to simulate a reasonable use period and to accelerate such possible processes as solder gain, growth, intermetallic compound growth or oxidation. Test specimens were stored at room temperature f ollowing the artificial aging process and bef ore commencing the thermal cycling test. 6.2 Th er m al Cy c l e Ch am b er Pr o f i l e Dummy boards and connectors were employed to simulate expected thermal mass A minimum of 4 thermal couples near connectors on at least 2 boards Thermal cycle profile Tmax = 100 oC (+10 / 0 Tmin = 0 oC ( 0 / -10 oC) Ramp rate = Approximately 10 C/min (10% to 90% of test temperature range) Dwell time = 5 to 10 min (Holding time of maximum and minimum temperature) 5 successf ul cycles were perf ormed bef ore commencing test. o o C) w/Tolerance 100 Ts (max) Upper Dwell Time Nominal Ts (max) Tem p er at u r e ( C) Ts T Cyclic Range 0 Ts (min) Lower Dwell Time Nominal Ts (min) w/Tolerance Cycle Time Ti m e - 16 - IT3 Th er m al Cy c l i n g Tes t TR0636E-10026 6.3 Th er m al Cy c l i n g Tes t Ex ec u t i o n TC5 TC2 TC1 --- AIR TC6 TC3 Door TC4 IT3-assembled test board (Ref er to 4.2.2 Test board example f or test board details.) T h er mo c o u p l e L o c at i o n s Air temperature (Blue Line) Air temperature (Yellow Line) Ch am b er _1 TL 544 Ch am b er _2 TL 745 Meas u r ed Th er m al Cy c l e Pr o f i l e - 17 - IT3 Th er m al Cy c l i n g Tes t TR0636E-10026 6.4 Meas u r em en t Chamber temperature profile was continuously monitored and recorded during the test. Electrical resistance was monitored and recorded continuously. Maximum scan interval of all chains was one minute during test. 6.5 Fai l u r e Cr i t er i a Failure was claimed when a 20% resistance increase to initial resistance was monitored for fiv e consecutiv e reading scans. Failure points could not exceed 50 %. 6.6 Id en t i f y i n g Fai l ed Co n n ec t o r (s ) an d Fai l u r e Po i n t (s ) Failed connectors or f ailed points were identified by probing connector and specific test points and daisy chain test points located on the bottom of all test boards. Failure point(s) and number of cycles were recorded, when f ailure(s) occurred. 6.7 Rer o u t i n g w i t h J u mp er Wi r e Once f ailure and location was detected, rerouting of the effected area was required. Jumper wires (AW G32, 60mm in length, pre-stripped and tinned) provided by Hirose were inserted approximately 2 mm into the appropriate through-holes and then soldered to complete the bypass. 6.8 Tes t Du r at i o n 3500 cycles - 18 - IT3 Th er m al Cy c l i n g Tes t TR0636E-10026 6.9 Tes t Res u l t See attached document "07-29834-R1 PRINTED CIRCUIT BOARDS TEMPERATURE CYCLE" prepared by Trace Laboratories, Inc. f or more details. No f ailure was observ ed up to 3,500 temperature cycles. Board # MB-001 MB-002 MB-003 MB-004 MB-005 MB-006 MB-007 MB-008 MB-009 MB-010 MB-011 MB-012 MB-013 MB-014 MB-015 MB-016 Initial Resistance Final Resistance Failure cycle & Resistance Configuration Config-1 Config-1 Config-2 Config-2 Config-3 Config-3 Config-4 Config-4 Config-1 Config-1 Config-2 Config-2 Config-3 Config-3 Config-4 Config-4 Conn-1 Virgin Virgin Virgin Virgin Virgin Virgin Virgin Virgin Virgin Virgin Virgin Virgin R eworked R eworked R eworked R eworked Conn-2 Virgin Virgin Virgin Virgin Virgin Virgin Virgin Virgin Virgin Virgin Virgin Virgin Virgin Virgin Virgin Virgin Conn-3 Virgin Virgin Virgin Virgin Virgin Virgin Virgin Virgin R eworked R eworked R eworked R eworked Conn-4 Virgin Virgin Virgin Virgin Virgin Virgin Virgin Virgin R eworked R eworked R eworked R eworked R eworked R eworked R eworked R eworked 40.9 26.5 40.2 26.0 39.9 25.7 40.2 26.5 41.1 27.5 41.0 26.0 39.8 26.9 40.6 26.4 40.1 25.8 39.7 25.6 39.6 25.2 39.8 26.1 40.1 26.5 40.4 26.6 41.1 27.5 41.5 26.9 No f ailure No f ailure No f ailure No f ailure No f ailure No f ailure No f ailure No f ailure No f ailure No f ailure No f ailure No f ailure No f ailure No f ailure No f ailure No f ailure Virgin Virgin Virgin Virgin Unit：ohm Measurement Result - 19 - IT3 Th er m al Cy c l i n g Tes t TR0636E-10026 7 SOL DER B AL L SHEAR T EST Ball shear qualification conf orms to IPC-9701. The minimum shear f orce is def ined as the mean minus 3 sigma, f or a minimum of three connectors 7.1 Meas u r em en t Met h o d Force is applied to the edge of the connector so that the balls receive the shearing f orce. The height of shearing tool should exceed the height of the connector surf ace of 50μm minimum. Test speed: 500 micrometer / second 7.2 Fai l u r e Mo d e The f ailure mode f or the sheared balls is defined as either a bulk solder failure or copper pad lift-off. An intermetallic failure between contacts and balls is unacceptable. 7.3 Tes t Res u l t See the attachment "TR0636E-20027 : IT3D(M)-300S-BGA (57) BGA shearing f orce test report" No intermetallic f ailure between contacts and balls was observ ed in both Initial and Post 3500 cycles specimens. - 20 - IT3 Th er m al Cy c l i n g Tes t TR0636E-10026 8. REVISION RECORD Revision no. Description (Major changes) Initial release Date June. 23 , 2008 rd - 21 -