IXTA120N04T2
IXTP120N04T2
TrenchT2TM
Power MOSFET
VDSS
ID25
=
=
RDS(on)
N-Channel Enhancement Mode
Avalanche Rated
40V
120A
6.1m
TO-263 (IXTA)
G
S
D (Tab)
TO-220 (IXTP)
Symbol
Test Conditions
Maximum Ratings
VDSS
TJ = 25C to 175C
40
V
VDGR
TJ = 25C to 175C, RGS = 1M
40
V
VGSM
Transient
20
V
ID25
IDM
TC = 25C
TC = 25C, Pulse Width Limited by TJM
120
360
A
A
IA
TC = 25C
50
A
EAS
TC = 25C
400
mJ
PD
TC = 25C
200
W
-55 ... +175
C
TJM
175
C
Tstg
-55 ... +175
C
TJ
TL
TSOLD
Maximum Lead Temperature for Soldering
1.6 mm (0.062in.) from Case for 10s
300
260
°C
°C
FC
Md
Mounting Force (TO-263)
Mounting Torque (TO-220)
10..65 / 2.2..14.6
1.13 / 10
N/lb
Nm/lb.in
Weight
TO-263
TO-220
2.5
3.0
g
g
G
D
S
G = Gate
S = Source
D (Tab)
D
= Drain
Tab = Drain
Features
International Standard Packages
Avalanche Rated
Low Package Inductance
Fast Intrinsic Rectifier
175°C Operating Temperature
High Current Handling Capability
ROHS Compliant
High Performance Trench
Technology for extremely low RDS(on)
Advantages
High Power Density
Easy to Mount
Space Savings
Symbol
Test Conditions
(TJ = 25C Unless Otherwise Specified)
Characteristic Values
Min. Typ.
Max.
BVDSS
VGS = 0V, ID = 250A
40
VGS(th)
VDS = VGS, ID = 250A
2.0
IGSS
VGS = 20V, VDS = 0V
IDSS
VDS = VDSS, VGS = 0V
TJ = 150C
RDS(on)
VGS = 10V, ID = 25A, Notes 1 & 2
V
4.0
V
100
nA
2
A
Applications
Automotive Engine Control
Synchronous Buck Converter
(for Notebook SystemPower &
General Purpose Point & Load)
DC/DC Converters
High Current Switching Applications
Power Train Management
Distributed Power Architecture
50 A
6.1 m
© 2018 IXYS CORPORATION, All Rights Reserved
DS99973B(7/18)
IXTA120N04T2
IXTP120N04T2
Symbol
Test Conditions
(TJ = 25C Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
gfs
28
VDS = 10V, ID = 60A, Note 1
Ciss
Coss
VGS = 0V, VDS = 25V, f = 1MHz
Crss
td(on)
tr
td(off)
tf
Resistive Switching Times
VGS = 10V, VDS = 20V, ID = 60A
RG = 5 (External)
Qg(on)
Qgs
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • IDSS
Qgd
E
47
S
3240
pF
557
pF
140
pF
14
ns
8
ns
16
ns
11
ns
58
nC
17
nC
10
nC
C2
A
E1
L1
D1
D
1
2
L2
3
A1
b
b2
4
H
L3
e
c
0.43 [11.0]
e
0
0.34 [8.7]
0.66 [16.6]
A2
1 - Gate
2,4 - Drain
3 - Source
0.20 [5.0]
60.12 [3.0]
0.10 [2.5]
0.06 [1.6]
0.75 C/W
RthJC
RthCS
TO-263 Outline
TO-220
C/W
0.50
Source-Drain Diode
Symbol
Test Conditions
(TJ = 25C Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
IS
VGS = 0V
120
A
ISM
Repetitive, Pulse Width Limited by TJM
480
A
VSD
trr
IRM
QRM
IF = 60A, VGS = 0V, Note 1
1.2
IF = 60A, VGS = 0V,
-di/dt = 100A/s, VR = 20V
TO-220 Outline
E
A
oP
A1
V
35
ns
1.6
A
28
nC
H1
Q
D2
D
D1
E1
A2
EJECTOR
PIN
L1
L
ee
Notes: 1. Pulse test, t 300s; duty cycle, d 2%.
3X b
c
e1
e1
3X b2
1 - Gate
2,4 - Drain
3 - Source
2. On through-hole packages, RDS(on) Kelvin test contact
location must be 5mm or less from the package body.
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,860,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123B1
6,306,728B1
6,404,065B1
6,534,343
6,583,505
6,683,344
6,710,405B2
6,710,463
6,727,585
7,005,734B2
6,759,692
7,063,975B2
6,771,478B2 7,071,537
7,157,338B2
IXTA120N04T2
IXTP120N04T2
o
o
Fig. 1. Output Characteristics @ TJ = 25 C
Fig. 2. Extended Output Characteristics @ TJ = 25 C
120
350
VGS = 15V
10V
9V
8V
100
VGS = 15V
9V
250
80
7V
I D - Amperes
I D - Amperes
10V
300
60
6V
40
8V
200
150
7V
100
20
5V
6V
50
5V
0
0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0
0.8
1
2
3
120
6
7
8
2.0
VGS = 15V
10V
9V
8V
VGS = 10V
RDS(on) - Normalized
1.8
80
I D - Amperes
5
Fig. 4. RDS(on) Normalized to ID = 60A Value vs.
Junction Temperature
o
Fig. 3. Output Characteristics @ TJ = 150 C
100
4
VDS - Volts
VDS - Volts
7V
60
6V
40
5V
20
I D = 120A
1.6
I D = 60A
1.4
1.2
1.0
0.8
0
0.6
0.0
0.2
0.4
0.6
0.8
1.0
1.2
-50
-25
0
VDS - Volts
25
50
75
100
125
150
175
TJ - Degrees Centigrade
Fig. 5. RDS(on) Normalized to ID = 60A Value vs.
Drain Current
Fig. 6. Drain Current vs. Case Temperature
2.4
120
VGS = 10V
15V
2.2
o
TJ = 175 C
100
1.8
I D - Amperes
RDS(on) - Normalized
2.0
1.6
1.4
1.2
80
60
40
1.0
0.8
20
o
TJ = 25 C
0
0.6
0
40
80
120
160
I D - Amperes
© 2018 IXYS CORPORATION, All Rights Reserved
200
240
280
-50
-25
0
25
50
75
100
TC - Degrees Centigrade
125
150
175
IXTA120N04T2
IXTP120N04T2
Fig. 7. Input Admittance
Fig. 8. Transconductance
100
70
o
90
TJ = - 40 C
60
80
50
g f s - Siemens
I D - Amperes
70
60
50
40
o
TJ = 150 C
30
o
o
25 C
40
o
150 C
30
20
25 C
o
- 40 C
20
10
10
0
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
0
6.5
10
20
30
40
10
270
9
240
8
210
7
180
6
VGS - Volts
I S - Amperes
60
70
80
90
100
Fig. 10. Gate Charge
Fig. 9. Forward Voltage Drop of Intrinsic Diode
300
150
120
90
50
I D - Amperes
VGS - Volts
VDS = 20V
I D = 60A
I G = 10mA
5
4
3
o
TJ = 150 C
60
2
o
TJ = 25 C
30
1
0
0
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
0
1.5
10
20
30
40
50
60
QG - NanoCoulombs
VSD - Volts
Fig. 11. Capacitance
Fig. 12. Forward-Bias Safe Operating Area
10,000
1000
f = 1 MHz
RDS(on) Limit
I D - Amperes
Capacitance - PicoFarads
C iss
1,000
C oss
25μs
100
100μs
1ms
10
o
TJ = 175 C
o
TC = 25 C
Single Pulse
C rss
DC
10ms
100ms
1
100
0
5
10
15
20
25
30
35
40
VDS - Volts
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
1
10
VDS - Volts
100
IXTA120N04T2
IXTP120N04T2
Fig. 14. Resistive Turn-on
Rise Time vs. Drain Current
Fig. 13. Resistive Turn-on
Rise Time vs. Junction Temperature
11
11
RG = 5Ω, VGS = 10V
10
9
VDS = 20V
9
t r - Nanoseconds
8
t r - Nanoseconds
RG = 5Ω, VGS = 10V
10
VDS = 20V
7
I D = 60A
6
5
I D = 120A
4
o
TJ = 25 C
8
7
6
5
o
TJ = 125 C
4
3
3
2
2
1
25
35
45
55
65
75
85
95
105
115
20
125
30
40
50
TJ - Degrees Centigrade
Fig. 15. Resistive Turn-on
Switching Times vs. Gate Resistance
18
VDS = 20V
16
15
I D = 60A, 120A
14
6
13
4
12
2
11
0
8
10
12
14
16
18
td(off)
RG = 5Ω, VGS = 10V
15
13
11
12
7
25
20
35
45
55
VDS = 20V
28
90
26
80
16
20
14
18
o
o
TJ = 125 C, 25 C
16
10
8
60
105
115
8
125
70
80
I D - Amperes
© 2018 IXYS CORPORATION, All Rights Reserved
90
tf
td(off)
80
TJ = 125 C, VGS = 10V
70
VDS = 20V
60
60
50
50
40
40
I D = 60A
30
30
20
14
10
12
100
0
20
I D = 120A
10
0
4
6
8
10
12
RG - Ohms
14
16
18
20
t d(off) - Nanoseconds
22
50
95
90
70
24
18
40
85
o
t d(off) - Nanoseconds
t f - Nanoseconds
td(off)
RG = 5Ω, VGS = 10V
30
75
Fig. 18. Resistive Turn-off
Switching Times vs. Gate Resistance
t f - Nanoseconds
tf
20
65
TJ - Degrees Centigrade
24
12
16
I D = 120A
Fig. 17. Resistive Turn-off
Switching Times vs. Drain Current
20
20
I D = 60A
RG - Ohms
22
24
VDS = 20V
9
10
6
100
t d(off) - Nanoseconds
10
4
90
28
tf
17
o
TJ = 125 C, VGS = 10V
8
80
17
t d(on) - Nanoseconds
t r - Nanoseconds
td(on)
t f - Nanoseconds
tr
12
70
Fig. 16. Resistive Turn-off
Switching Times vs. Junction Temperature
16
14
60
I D - Amperes
IXTA120N04T2
IXTP120N04T2
Fig. 19. Maximum Transient Thermal Impedance
Z(th)JC - K / W
1
0.1
0.01
0.00001
0.0001
0.001
0.01
0.1
1
10
Pulse Width - Seconds
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS REF: T_120N04T2 (V3) 7-9-18-B
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