1200 V, 15 A 场截止沟道 IGBT
概述
通过采用创新的场截止沟道 IGBT 技术,飞兆半导体新型系列的
场截止沟道 IGBT 可为光伏逆变器、 UPS、焊机和 PFC 等硬开
关应用提供最佳性能。
特性
• FS 沟道技术,正温度系数
• 高速开关
• 低饱和电压:VCE(sat) =1.8 V @ IC=15 A
应用
• ILM(1) 部件 100% 检测
• 光伏逆变器、焊机、 UPS 和 PFC 应用
• 高输入阻抗
• 符合 RoHS 标准
E
C
C
G
G
集电极
(FLANGE)
E
绝对最大额定值 T =25°C 除非另有说明
C
符号
额定值
单位
集电极 - 发射极之间电压
1200
V
VGES
栅极-发射极间电压
±25
V
±30
V
IC
集电极电流
@ TC=25°C
30
A
集电极电流
@ TC=100°C
15
A
ILM (1)
箝位感性负载电流
@ TC=25°C
ICM (2)
集电极脉冲电流
IF
二极管正向连续电流
二极管正向连续电流
VCES
说明
瞬态栅极-发射极间电压
60
A
60
A
@ TC=25°C
30
A
@ TC=100°C
15
A
IFM
二极管最大正向电流
100
A
PD
最大功耗
@ TC=25°C
333
W
最大功耗
@ TC=100°C
167
W
TJ
工作结温
-55 至 +175
°C
Tstg
存储温度范围
-55 至 +175
°C
TL
用于焊接的最大引脚温度,距离外壳 1/8",持续 5 秒
300
°C
热性能
符号
典型值
最大值
单位
结点 - 壳体的热阻
--
0.45
°C/W
RθJC(二极管) 结点 - 壳体的热阻
--
2.0
°C/W
RθJA
--
40
°C/W
RθJC(IGBT)
参数
结至环境热阻
注意:
1. Vcc=600 V, VGE=15 V, IC=60 A, RG=34 Ω, 感性负载
2. 受限于 Tjmax
©2013 飞兆半导体公司
December-2017, 修订版 3
Publication Order Number:
FGH15T120SMDCN/D
FGH15T120SMD — 1200 V、 15 A 场截止沟道 IGBT
FGH15T120SMD
器件标识
器件
封装
卷尺寸
带宽
数量
FGH15T120SMD
FGH15T120SMD-F155
TO-247G03
-
-
30
IGBT 的电气特性 T =25°C 除非另有说明
C
符号
参数
测试条件
最小值 典型值 最大值
单位
关断特性
BVCES
集电极 - 发射极击穿电压
VGE=0 V, IC=250 μA
ICES
集电极切断电流
VCE=VCES, VGE=0 V
-
IGES
G-E 漏电流
VGE=VGES, VCE=0 V
-
G-E 阈值电压
IC=15 mA, VCE=VGE
4.9
IC =15 A, VGE=15 V
TC=25°C
IC =15 A, VGE=15 V,
TC=175°C
1200
-
-
V
-
250
μA
-
±400
nA
6.2
7.5
V
-
1.8
2.4
V
-
1.9
-
V
-
1460
-
pF
-
65
-
pF
反向传输电容
-
37
-
pF
导通特性
VGE(th)
VCE(sat)
集电极 - 发射极间饱和电压
动态特性
Cies
输入电容
Coes
输出电容
Cres
VCE =30 V, VGE=0 V,
f=1 MHz
开关特性
导通延迟时间
-
32
-
ns
tr
上升时间
-
47
-
ns
td(off)
关断延迟时间
-
490
-
ns
-
12
-
ns
-
1.15
-
mJ
-
0.46
-
mJ
td(on)
tf
下降时间
Eon
导通开关损耗
Eoff
关断开关损耗
Ets
VCC=600 V, IC=15 A,
RG=34 Ω, VGE = 15 V,
感性负载, TC =25°C
总开关损耗
-
1.61
-
mJ
td(on)
导通延迟时间
-
32
-
ns
tr
上升时间
-
42
-
ns
td(off)
关断延迟时间
-
510
-
ns
tf
下降时间
Eon
导通开关损耗
Eoff
VCC=600 V, IC=15 A,
RG=34 Ω, VGE = 15 V,
感性负载, TC =175°C
-
24
-
ns
-
1.86
-
mJ
关断开关损耗
-
0.70
-
mJ
Ets
总开关损耗
-
2.56
-
mJ
Qg
总栅极电荷
Qge
栅极-发射极间电荷
Qgc
栅极-发射极间电荷
VCE=600 V, IC=15 A,
VGE=15 V
www.onsemi.com
2
-
128
-
nC
-
11
-
nC
-
70
-
nC
FGH15T120SMD — 1200 V、 15 A 场截止沟道 IGBT
封装标识与定购信息
C
符号
VFM
参数
二极管正向电压
trr
二极管反向恢复时间
Irr
二极管反向恢复峰值电流
Qrr
二极管反向恢复电荷
Erec
反向恢复电能
测试条件
最小值 典型值 最大值
单位
IF =15 A, TC=25°C
-
2.8
3.7
IF =15 A, TC=175°C
-
2.3
-
V
VR=600 V, IF=15 A,
diF/dt=200 A/μs, TC =25°C
-
72
-
ns
VR=600 V, IF=15 A,
diF/dt=200 A/μs, TC =175°C
V
-
7.4
-
A
-
270
-
nC
-
120
-
μJ
-
183
-
ns
trr
二极管反向恢复时间
Irr
二极管反向恢复峰值电流
-
12
-
A
二极管反向恢复电荷
-
1085
-
nC
Qrr
www.onsemi.com
3
FGH15T120SMD — 1200 V、 15 A 场截止沟道 IGBT
二极管电气特性 T =25°C 除非另有说明
图 1. 典型输出特性
图 2. 典型输出特性
60
60
o
o
TC = 175 C
48
20V
15V
20V
12V
36
10V
24
12
2.0
4.0
6.0
8.0
Collector-Emitter Voltage, VCE [V]
24
VGE = 8V
12
0
0.0
2.0
4.0
6.0
8.0
Collector-Emitter Voltage, VCE [V]
3.0
o
48
TC = 25 C
Collector-Emitter Voltage, VCE [V]
Common Emitter
VGE = 15V
--------
o
TC = 175 C
36
24
12
0
0.0
1.0
2.0
3.0
4.0
Collector-Emitter Voltage, VCE [V]
5.0
图 5. 饱和电压与 VGE 的关系
Common Emitter
VGE = 15 V
30 A
2.5
2.0
15 A
IC = 8 A
1.5
1.0
25
50
75
100
125
150
o
Case Temperature, TC [ C]
175
图 6. 饱和电压与 VGE 的关系
20
20
Common Emitter
Common Emitter
o
o
Collector-Emitter Voltage, VCE [V]
TC = 25 C
15
15A
10
IC=8A
30A
5
0
10.0
图 4. 饱和电压与壳温的关系 (在可变电流强度下)
60
Collector Current, IC [A]
10V
10.0
图 3. 典型饱和电压特性
Collector-Emitter Voltage, VCE [V]
36
VGE = 8V
0
0.0
12V
15V
48
Collector Current, IC [A]
Collector Current, IC [A]
TC = 25 C
TC = 175 C
16
15A
12
IC=8A
30A
8
4
0
4
8
12
16
Gate-Emitter Voltage, VGE [V]
20
www.onsemi.com
4
4
8
12
16
Gate-Emitter Voltage, VGE [V]
20
FGH15T120SMD — 1200 V、 15 A 场截止沟道 IGBT
典型性能特征
图 7. 电容特性
图 8. 栅极电荷特性
15
10000
Common Emitter
Gate-Emitter Voltage, VGE [V]
o
Capacitance [pF]
Cies
1000
Coes
100
Common Emitter
VGE = 0V, f = 1MHz
Cres
TC = 25 C
12
400V
VCC = 200V
9
600V
6
3
o
TC = 25 C
0
20
1
10
Collector-Emitter Voltage, VCE [V]
0
30
图 9. 导通特性与栅极电阻的关系
26
52
78
Gate Charge, Qg [nC]
104
130
图 10. 关断特性与栅极电阻的关系
10000
Common Emitter
VCC = 600V, VGE = 15V
IC = 15A
100
1000
td(off)
o
Switching Time [ns]
Switching Time [ns]
TC = 25 C
o
TC = 175 C
tr
td(on)
100
tf
10
Common Emitter
VCC = 600V, VGE = 15V
IC = 15A
1
o
TC = 25 C
o
TC = 175 C
10
0
14
28
42
Gate Resistance, RG [Ω]
56
0.1
70
图 11. 开关损耗与栅极电阻的关系
28
42
Gate Resistance, RG [Ω]
56
70
24
30
300
10
Common Emitter
VCC = 600V, VGE = 15V
Common Emitter
VGE = 15V, RG = 34Ω
IC = 15A
TC = 25 C
o
o
o
TC = 25 C
o
TC = 175 C
Switching Time [ns]
Switching Loss [mJ]
14
图 12. 导通特性与集电极电流的关系
20
Eon
1
Eoff
0.1
0
TC = 175 C
100
tr
td(on)
10
0
14
28
42
56
Gate Resistance, RG [Ω]
70
0
6
12
18
Collector Current, IC [A]
www.onsemi.com
5
FGH15T120SMD — 1200 V、 15 A 场截止沟道 IGBT
典型性能特征
图 13. 关断特性与集电极电流的关系
图 14. 开关损耗与集电极电流的关系
10
1000
Common Emitter
VGE = 15V, RG = 34Ω
o
TC = 25 C
100
tf
10
Common Emitter
VGE = 15V, RG = 34Ω
Eon
o
Switching Loss [mJ]
Switching Time [ns]
td(off)
TC = 175 C
1
Eoff
o
TC = 25 C
o
TC = 175 C
0.1
1
0
6
12
18
24
Collector Current, IC [A]
0
30
图 15. 负载电流与频率的关系
6
12
18
Collector Current, IC [A]
24
图 16. SOA 特性
200
100
150
VCE = 600V
ICMAX(Pulse)
10μs
Collector Current, Ic [A]
Collector Current, IC [A]
Load current : peak of square Wave
Duty cycle : 50%
100
o
Tc= 100 C
Power Dissipation =167 W
50
o
TC = 100 C
0
1k
30
10 ICMAX(Continuous)
100μs
DC Operation
1
1ms
10ms
Single Nonrepetitive
o
Pulse TC = 25 C
Curves must be derated
linearly with increase
in temperature
0.1
0.01
10k
100k
Switching Frequency, f [Hz]
1
1M
图 17. 正向特性
10
100
Collector-Emitter Voltage, VCE [V]
1000
图 18. 反向恢复电流
20
300
Reverse Recovery Current, Irr [A]
o
100
Forward Current, IF [A]
o
TC = 175 C
10
o
TC = 25 C
1
TC = 25 C
o
TC = 175 C
15
diF/dt = 200A/μs
10
diF/dt = 100A/μs
diF/dt = 200A/μs
5
diF/dt = 100A/μs
0
0.1
0
1
2
3
4
Forward Voltage, VF [V]
5
www.onsemi.com
6
5
10
15
20
Forward Current, IF [A]
25
30
FGH15T120SMD — 1200 V、 15 A 场截止沟道 IGBT
典型性能特征
图 19. 反向恢复时间
图 20. 存储电荷
300
1.4
o
o
Stored Recovery Charge, Qrr [uC]
o
TC = 175 C
250
diF/dt = 100A/μs
200
diF/dt = 200A/μs
150
100
diF/dt = 100A/μs
50
10
15
20
Forward Current, IF [A]
o
TC = 175 C
diF/dt = 200A/μs
1.0
diF/dt = 100A/μs
0.8
0.6
0.4
diF/dt = 200A/μs
0.2
0.0
25
30
5
10
15
20
Forwad Current, IF [A]
图 21. IGBT 瞬态热阻抗
0.5
Thermal Response [Zthjc]
5
TC = 25 C
1.2
diF/dt = 100A/μs
diF/dt = 200A/μs
0.5
0.1
0.3
0.1
0.05
0.02
0.01
single pulse
0.01
PDM
t1
t2
Duty Factor, D = t1/t2
Peak Tj = Pdm x Zthjc + TC
1E-3
1E-5
1E-4
1E-3
0.01
0.1
1
Rectangular Pulse Duration [sec]
图 22. 二极管瞬态热阻抗
3
Thermal Response [Zthjc]
Reverse Recovery Time, trr [ns]
TC = 25 C
0.5
1
0.3
0.1
0.05
0.1
PDM
0.02
0.01
t1
0.01
-5
10
t2
Duty Factor, D = t1/t2
Peak Tj = Pdm x Zthjc + TC
single pulse
-4
10
-3
10
-2
10
Rectangular Pulse Duration [sec]
www.onsemi.com
7
-1
10
0
10
25
30
FGH15T120SMD — 1200 V、 15 A 场截止沟道 IGBT
典型性能特征
FGH15T120SMD — 1200 V、 15 A 场截止沟道 IGBT
机械尺寸
图 23. TO-247,模塑, 3 引脚, JEDEC 变体 AB (有效)
封装图纸作为一项服务,提供给考虑飞兆半导体元件的客户。具体参数可能会有变化,且不会做出相应通知。请注意图纸上的版本和 /
或日期,并联系飞兆半导体代表核实或获得最新版本。封装规格并不扩大飞兆公司全球范围内的条款与条件,尤其是其中涉及飞兆公司
产品保修的部分。
尺寸单位为毫米
www.onsemi.com
8
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
❖
© Semiconductor Components Industries, LLC
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
www.onsemi.com