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FGH15T120SMD-F155

FGH15T120SMD-F155

  • 厂商:

    MURATA-PS(村田)

  • 封装:

    TO-247-3

  • 描述:

    安森美半导体的新型场截止沟槽 IGBT 系列采用创新的场截止沟槽 IGBT 技术,为太阳能逆变器、UPS、焊接机和 PFC 等硬开关应用提供最佳性能。

  • 数据手册
  • 价格&库存
FGH15T120SMD-F155 数据手册
1200 V, 15 A 场截止沟道 IGBT 概述 通过采用创新的场截止沟道 IGBT 技术,飞兆半导体新型系列的 场截止沟道 IGBT 可为光伏逆变器、 UPS、焊机和 PFC 等硬开 关应用提供最佳性能。 特性 • FS 沟道技术,正温度系数 • 高速开关 • 低饱和电压:VCE(sat) =1.8 V @ IC=15 A 应用 • ILM(1) 部件 100% 检测 • 光伏逆变器、焊机、 UPS 和 PFC 应用 • 高输入阻抗 • 符合 RoHS 标准 E C C G G 集电极 (FLANGE) E 绝对最大额定值 T =25°C 除非另有说明 C 符号 额定值 单位 集电极 - 发射极之间电压 1200 V VGES 栅极-发射极间电压 ±25 V ±30 V IC 集电极电流 @ TC=25°C 30 A 集电极电流 @ TC=100°C 15 A ILM (1) 箝位感性负载电流 @ TC=25°C ICM (2) 集电极脉冲电流 IF 二极管正向连续电流 二极管正向连续电流 VCES 说明 瞬态栅极-发射极间电压 60 A 60 A @ TC=25°C 30 A @ TC=100°C 15 A IFM 二极管最大正向电流 100 A PD 最大功耗 @ TC=25°C 333 W 最大功耗 @ TC=100°C 167 W TJ 工作结温 -55 至 +175 °C Tstg 存储温度范围 -55 至 +175 °C TL 用于焊接的最大引脚温度,距离外壳 1/8",持续 5 秒 300 °C 热性能 符号 典型值 最大值 单位 结点 - 壳体的热阻 -- 0.45 °C/W RθJC(二极管) 结点 - 壳体的热阻 -- 2.0 °C/W RθJA -- 40 °C/W RθJC(IGBT) 参数 结至环境热阻 注意: 1. Vcc=600 V, VGE=15 V, IC=60 A, RG=34 Ω, 感性负载 2. 受限于 Tjmax ©2013 飞兆半导体公司 December-2017, 修订版 3 Publication Order Number: FGH15T120SMDCN/D FGH15T120SMD — 1200 V、 15 A 场截止沟道 IGBT FGH15T120SMD 器件标识 器件 封装 卷尺寸 带宽 数量 FGH15T120SMD FGH15T120SMD-F155 TO-247G03 - - 30 IGBT 的电气特性 T =25°C 除非另有说明 C 符号 参数 测试条件 最小值 典型值 最大值 单位 关断特性 BVCES 集电极 - 发射极击穿电压 VGE=0 V, IC=250 μA ICES 集电极切断电流 VCE=VCES, VGE=0 V - IGES G-E 漏电流 VGE=VGES, VCE=0 V - G-E 阈值电压 IC=15 mA, VCE=VGE 4.9 IC =15 A, VGE=15 V TC=25°C IC =15 A, VGE=15 V, TC=175°C 1200 - - V - 250 μA - ±400 nA 6.2 7.5 V - 1.8 2.4 V - 1.9 - V - 1460 - pF - 65 - pF 反向传输电容 - 37 - pF 导通特性 VGE(th) VCE(sat) 集电极 - 发射极间饱和电压 动态特性 Cies 输入电容 Coes 输出电容 Cres VCE =30 V, VGE=0 V, f=1 MHz 开关特性 导通延迟时间 - 32 - ns tr 上升时间 - 47 - ns td(off) 关断延迟时间 - 490 - ns - 12 - ns - 1.15 - mJ - 0.46 - mJ td(on) tf 下降时间 Eon 导通开关损耗 Eoff 关断开关损耗 Ets VCC=600 V, IC=15 A, RG=34 Ω, VGE = 15 V, 感性负载, TC =25°C 总开关损耗 - 1.61 - mJ td(on) 导通延迟时间 - 32 - ns tr 上升时间 - 42 - ns td(off) 关断延迟时间 - 510 - ns tf 下降时间 Eon 导通开关损耗 Eoff VCC=600 V, IC=15 A, RG=34 Ω, VGE = 15 V, 感性负载, TC =175°C - 24 - ns - 1.86 - mJ 关断开关损耗 - 0.70 - mJ Ets 总开关损耗 - 2.56 - mJ Qg 总栅极电荷 Qge 栅极-发射极间电荷 Qgc 栅极-发射极间电荷 VCE=600 V, IC=15 A, VGE=15 V www.onsemi.com 2 - 128 - nC - 11 - nC - 70 - nC FGH15T120SMD — 1200 V、 15 A 场截止沟道 IGBT 封装标识与定购信息 C 符号 VFM 参数 二极管正向电压 trr 二极管反向恢复时间 Irr 二极管反向恢复峰值电流 Qrr 二极管反向恢复电荷 Erec 反向恢复电能 测试条件 最小值 典型值 最大值 单位 IF =15 A, TC=25°C - 2.8 3.7 IF =15 A, TC=175°C - 2.3 - V VR=600 V, IF=15 A, diF/dt=200 A/μs, TC =25°C - 72 - ns VR=600 V, IF=15 A, diF/dt=200 A/μs, TC =175°C V - 7.4 - A - 270 - nC - 120 - μJ - 183 - ns trr 二极管反向恢复时间 Irr 二极管反向恢复峰值电流 - 12 - A 二极管反向恢复电荷 - 1085 - nC Qrr www.onsemi.com 3 FGH15T120SMD — 1200 V、 15 A 场截止沟道 IGBT 二极管电气特性 T =25°C 除非另有说明 图 1. 典型输出特性 图 2. 典型输出特性 60 60 o o TC = 175 C 48 20V 15V 20V 12V 36 10V 24 12 2.0 4.0 6.0 8.0 Collector-Emitter Voltage, VCE [V] 24 VGE = 8V 12 0 0.0 2.0 4.0 6.0 8.0 Collector-Emitter Voltage, VCE [V] 3.0 o 48 TC = 25 C Collector-Emitter Voltage, VCE [V] Common Emitter VGE = 15V -------- o TC = 175 C 36 24 12 0 0.0 1.0 2.0 3.0 4.0 Collector-Emitter Voltage, VCE [V] 5.0 图 5. 饱和电压与 VGE 的关系 Common Emitter VGE = 15 V 30 A 2.5 2.0 15 A IC = 8 A 1.5 1.0 25 50 75 100 125 150 o Case Temperature, TC [ C] 175 图 6. 饱和电压与 VGE 的关系 20 20 Common Emitter Common Emitter o o Collector-Emitter Voltage, VCE [V] TC = 25 C 15 15A 10 IC=8A 30A 5 0 10.0 图 4. 饱和电压与壳温的关系 (在可变电流强度下) 60 Collector Current, IC [A] 10V 10.0 图 3. 典型饱和电压特性 Collector-Emitter Voltage, VCE [V] 36 VGE = 8V 0 0.0 12V 15V 48 Collector Current, IC [A] Collector Current, IC [A] TC = 25 C TC = 175 C 16 15A 12 IC=8A 30A 8 4 0 4 8 12 16 Gate-Emitter Voltage, VGE [V] 20 www.onsemi.com 4 4 8 12 16 Gate-Emitter Voltage, VGE [V] 20 FGH15T120SMD — 1200 V、 15 A 场截止沟道 IGBT 典型性能特征 图 7. 电容特性 图 8. 栅极电荷特性 15 10000 Common Emitter Gate-Emitter Voltage, VGE [V] o Capacitance [pF] Cies 1000 Coes 100 Common Emitter VGE = 0V, f = 1MHz Cres TC = 25 C 12 400V VCC = 200V 9 600V 6 3 o TC = 25 C 0 20 1 10 Collector-Emitter Voltage, VCE [V] 0 30 图 9. 导通特性与栅极电阻的关系 26 52 78 Gate Charge, Qg [nC] 104 130 图 10. 关断特性与栅极电阻的关系 10000 Common Emitter VCC = 600V, VGE = 15V IC = 15A 100 1000 td(off) o Switching Time [ns] Switching Time [ns] TC = 25 C o TC = 175 C tr td(on) 100 tf 10 Common Emitter VCC = 600V, VGE = 15V IC = 15A 1 o TC = 25 C o TC = 175 C 10 0 14 28 42 Gate Resistance, RG [Ω] 56 0.1 70 图 11. 开关损耗与栅极电阻的关系 28 42 Gate Resistance, RG [Ω] 56 70 24 30 300 10 Common Emitter VCC = 600V, VGE = 15V Common Emitter VGE = 15V, RG = 34Ω IC = 15A TC = 25 C o o o TC = 25 C o TC = 175 C Switching Time [ns] Switching Loss [mJ] 14 图 12. 导通特性与集电极电流的关系 20 Eon 1 Eoff 0.1 0 TC = 175 C 100 tr td(on) 10 0 14 28 42 56 Gate Resistance, RG [Ω] 70 0 6 12 18 Collector Current, IC [A] www.onsemi.com 5 FGH15T120SMD — 1200 V、 15 A 场截止沟道 IGBT 典型性能特征 图 13. 关断特性与集电极电流的关系 图 14. 开关损耗与集电极电流的关系 10 1000 Common Emitter VGE = 15V, RG = 34Ω o TC = 25 C 100 tf 10 Common Emitter VGE = 15V, RG = 34Ω Eon o Switching Loss [mJ] Switching Time [ns] td(off) TC = 175 C 1 Eoff o TC = 25 C o TC = 175 C 0.1 1 0 6 12 18 24 Collector Current, IC [A] 0 30 图 15. 负载电流与频率的关系 6 12 18 Collector Current, IC [A] 24 图 16. SOA 特性 200 100 150 VCE = 600V ICMAX(Pulse) 10μs Collector Current, Ic [A] Collector Current, IC [A] Load current : peak of square Wave Duty cycle : 50% 100 o Tc= 100 C Power Dissipation =167 W 50 o TC = 100 C 0 1k 30 10 ICMAX(Continuous) 100μs DC Operation 1 1ms 10ms Single Nonrepetitive o Pulse TC = 25 C Curves must be derated linearly with increase in temperature 0.1 0.01 10k 100k Switching Frequency, f [Hz] 1 1M 图 17. 正向特性 10 100 Collector-Emitter Voltage, VCE [V] 1000 图 18. 反向恢复电流 20 300 Reverse Recovery Current, Irr [A] o 100 Forward Current, IF [A] o TC = 175 C 10 o TC = 25 C 1 TC = 25 C o TC = 175 C 15 diF/dt = 200A/μs 10 diF/dt = 100A/μs diF/dt = 200A/μs 5 diF/dt = 100A/μs 0 0.1 0 1 2 3 4 Forward Voltage, VF [V] 5 www.onsemi.com 6 5 10 15 20 Forward Current, IF [A] 25 30 FGH15T120SMD — 1200 V、 15 A 场截止沟道 IGBT 典型性能特征 图 19. 反向恢复时间 图 20. 存储电荷 300 1.4 o o Stored Recovery Charge, Qrr [uC] o TC = 175 C 250 diF/dt = 100A/μs 200 diF/dt = 200A/μs 150 100 diF/dt = 100A/μs 50 10 15 20 Forward Current, IF [A] o TC = 175 C diF/dt = 200A/μs 1.0 diF/dt = 100A/μs 0.8 0.6 0.4 diF/dt = 200A/μs 0.2 0.0 25 30 5 10 15 20 Forwad Current, IF [A] 图 21. IGBT 瞬态热阻抗 0.5 Thermal Response [Zthjc] 5 TC = 25 C 1.2 diF/dt = 100A/μs diF/dt = 200A/μs 0.5 0.1 0.3 0.1 0.05 0.02 0.01 single pulse 0.01 PDM t1 t2 Duty Factor, D = t1/t2 Peak Tj = Pdm x Zthjc + TC 1E-3 1E-5 1E-4 1E-3 0.01 0.1 1 Rectangular Pulse Duration [sec] 图 22. 二极管瞬态热阻抗 3 Thermal Response [Zthjc] Reverse Recovery Time, trr [ns] TC = 25 C 0.5 1 0.3 0.1 0.05 0.1 PDM 0.02 0.01 t1 0.01 -5 10 t2 Duty Factor, D = t1/t2 Peak Tj = Pdm x Zthjc + TC single pulse -4 10 -3 10 -2 10 Rectangular Pulse Duration [sec] www.onsemi.com 7 -1 10 0 10 25 30 FGH15T120SMD — 1200 V、 15 A 场截止沟道 IGBT 典型性能特征 FGH15T120SMD — 1200 V、 15 A 场截止沟道 IGBT 机械尺寸 图 23. TO-247,模塑, 3 引脚, JEDEC 变体 AB (有效) 封装图纸作为一项服务,提供给考虑飞兆半导体元件的客户。具体参数可能会有变化,且不会做出相应通知。请注意图纸上的版本和 / 或日期,并联系飞兆半导体代表核实或获得最新版本。封装规格并不扩大飞兆公司全球范围内的条款与条件,尤其是其中涉及飞兆公司 产品保修的部分。 尺寸单位为毫米 www.onsemi.com 8 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. 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