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NVHL055N60S5F

NVHL055N60S5F

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    TO-247-3

  • 描述:

    通孔 N 通道 600 V 45A(Tc) 278W(Tc) TO-247-3

  • 数据手册
  • 价格&库存
NVHL055N60S5F 数据手册
DATA SHEET www.onsemi.com MOSFET – Power, Single N-Channel, SUPERFET) V, FRFET), TO247-3L VDSS RDS(ON) MAX ID MAX 600 V 55 mW @ 10 V 45 A D 600 V, 55 mW, 45 A NVHL055N60S5F Description G The SUPERFET V MOSFET FRFET series has optimized body diode performance characteristics. This can allow for the removal of components in the application and improve application performance and reliability, particularly when soft switching topologies are used. S POWER MOSFET Features • 650 V @ TJ = 150°C / Typ. RDS(on) = 44 mW • 100% Avalanche Tested • Pb−Free, Halogen Free/BFR Free and are RoHS Compliant Applications • Electric Vehicle On Board Chargers • EV Main Battery DC/DC Converters G Parameter Gate−to−Source Voltage DC Symbol Value Unit VDSS 600 V VGS ±30 V AC (f > 1 Hz) Continuous Drain Current TC = 25°C ID A 45 28 PD 278 W IDM 159 A ISM 159 TJ, Tstg −55 to +150 °C IS 45 A EAS 417 mJ Avalanche Current IAS 7 A Repetitive Avalanche Energy (Note 1) EAR 2.78 mJ MOSFET dv/dt dvdt 120 V/ns Pulsed Drain Current Pulsed Source Current (Body Diode) TC = 25°C TC = 25°C, tP = 10 ms Operating Junction and Storage Temperature Range Source Current (Body Diode) Single Pulse Avalanche Energy (IL = 7 A, RG = 25 W) Peak Diode Recovery dv/dt (Note 2) Lead Temperature for Soldering Purposes (1/8” from case for 10 s) MARKING DIAGRAM ±30 TC = 100°C Power Dissipation S TO−247 Long Leads CASE 340CX MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Drain−to−Source Voltage D V055N60S5F A YWW ZZ 260 = Specific Device Code = Assembly Location = Data Code (Year & Week) = Assembly Lot ORDERING INFORMATION Device NVHL055N60S5F 70 TL V055N 60S5F AYWWZZ Package Shipping TO−247 30 Units / Tube °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Repetitive rating: pulse−width limited by maximum junction temperature. 2. ISD ≤ 22.5 A, di/dt ≤ 200 A/ms, VDD ≤ 400 V, starting TJ = 25°C. © Semiconductor Components Industries, LLC, 2021 May, 2022 − Rev. 1 1 Publication Order Number: NVHL055N60S5F/D NVHL055N60S5F THERMAL RESISTANCE Parameter Symbol Value Unit Thermal Resistance, Junction−to−Case, Max. RqJC 0.45 °C/W Thermal Resistance, Junction−to−Ambient, Max. RqJA 40 ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted) Symbol Test Conditions Min Typ Max Unit Drain−to−Source Breakdown Voltage V(BR)DSS VGS = 0 V, ID = 1 mA, TJ = 25_C 600 − − V Drain−to−Source Breakdown Voltage Temperature Coefficient DV(BR)DSS/ DTJ ID = 10 mA, Referenced to 25_C − 581 − mV/_C Zero Gate Voltage Drain Current IDSS VGS = 0 V, VDS = 600 V, TJ = 25_C − − 10 mA Gate−to−Source Leakage Current IGSS VGS = ±30 V, VDS = 0 V − − ±100 nA Parameter OFF CHARACTERISTICS ON CHARACTERISTICS Drain−to−Source On Resistance RDS(on) VGS = 10 V, ID = 22.5 A, TJ = 25_C − 44 55 mW Gate Threshold Voltage VGS(th) VGS = VDS, ID = 5.2 mA, TJ = 25_C 3.2 − 4.8 V gFS VDS = 20 V, ID = 22.5 A − 44.8 − S VDS = 400 V, VGS = 0 V, f = 250 kHz − 4603 − pF − 72.9 − Forward Trans−conductance CHARGES, CAPACITANCES & GATE RESISTANCE Input Capacitance CISS Output Capacitance COSS Time Related Output Capacitance COSS(tr.) ID = Constant, VDS = 0 V to 400 V, VGS = 0 V − 1114 − Energy Related Output Capacitance COSS(er.) VDS = 0 V to 400 V, VGS = 0 V − 125 − QG(tot) VDD = 400 V, ID = 22.5 A, VGS = 10 V − 85.2 − Total Gate Charge Gate−to−Source Charge QGS − 26.2 − Gate−to−Drain Charge QGD − 24.9 − Gate Resistance nC RG f = 1 MHz − 4.32 − W td(on) VGS = 0/10 V, VDD = 400 V, ID = 22.5 A, RG = 4.7 W − 44 − ns − 26.2 − td(off) − 108 − tf − 2.6 − SWITCHING CHARACTERISTICS Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time tr SOURCE-TO−DRAIN DIODE CHARACTERISTICS Forward Diode Voltage VSD VGS = 0 V, ISD = 22.5 A, TJ = 25_C − − 1.2 V Reverse Recovery Time tRR − 128 − ns Reverse Recovery Charge QRR VGS = 0 V, ISD = 22.5 A, dI/dt = 100 A/ms, VDD = 400 V − 758 − nC Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 2 NVHL055N60S5F TYPICAL CHARACTERISTICS 60 40 VGS=4.5V VGS=5V VGS=5.5V VGS=6V VGS=7V VGS=10V 20 0 5 0.12 10 15 10 1 20 1000 0.04 0.02 VGS=10V VGS=20V 10 20 30 40 50 60 70 80 VGS=0V 10 1 TJ=150°C TJ=25°C TJ=−55°C 0 0.2 0.4 0.6 0.8 1 1.2 VSD, DIODE FORWARD VOLTAGE (V) Figure 3. On−Resistance Variation vs. Drain Current and Gate Voltage Figure 4. Diode Forward Voltage vs. Source Current 102 101 CISS COSS CRSS 0 7 ID, DRAIN CURRENT (A) 103 10−1 6 100 0.1 90 VGS=0V TJ=25°C f=250KHz 100 5 Figure 2. Transfer Characteristics 0.06 104 4 Figure 1. On−Region Characteristics 0.08 105 3 VGS, GATE−TO−SOURCE VOLTAGE (V) TJ=25°C 0 TJ=−55°C TJ=25°C TJ=150°C VDS, DRAIN−TO−SOURCE VOLTAGE (V) 0.10 0 VDS=20V 100 IS, SOURCE CURRENT (A) RDS(on), DRAIN−TO−SOURCE ON−RESISTANCE (W) ID, DRAIN CURRENT (A) 80 0 CAPACITANCE (pF) 1000 TJ=25°C VGS, GATE−TO−SOURCE VOLTAGE (V) ID, DRAIN CURRENT (A) 100 100 200 300 400 500 600 10 ID=22.5A 8 6 4 2 0 VDD=120V VDD=360V VDD=400V 0 10 20 30 40 50 60 70 80 VDS, DRAIN−TO−SOURCE VOLTAGE (V) QG, TOTAL GATE CHARGE (nC) Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics www.onsemi.com 3 90 NVHL055N60S5F 1.2 1.15 3 VGS=0V ID=10mA RDS(on), DRAIN−TO−SOURCE ON−RESISTANCE (Normalized) BVDSS, DRAIN−TO−SOURCE BREAKDOWN VOLTAGE (Normalized) TYPICAL CHARACTERISTICS 1.1 1.05 1 0.95 0.9 0.85 0.8 −75 −50 −25 0 25 50 75 100 125 150 ID=22.5A VGS=10V 2.5 2 1.5 1 0.5 0 −75 175 −50 −25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) Figure 7. Breakdown Voltage Variation vs. Temperature Figure 8. On−Resistance Variation vs. Temperature 175 45 1000 100 ID, DRAIN CURRENT (A) ID, DRAIN CURRENT (A) 40 10 ms 100 ms 10 1 ms Operation in this Area is Limited by RDS(on) 1 0.1 18 10 ms TC = 25°C TJ = 150°C Single Pulse DC 10 1 30 25 20 15 10 5 1000 100 35 0 25 EOSS (mJ) 125 Figure 10. Maximum Drain Current vs. Case Temperature 12 10 8 6 4 2 EOSS 0 100 Figure 9. Maximum Safe Operating Area 14 0 75 TC, CASE TEMPERATURE (°C) VGS=0V TJ=25°C f=250KHz 16 50 VDS, DRAIN−TO−SOURCE VOLTAGE (V) 100 200 300 400 500 600 VDS, DRAIN−TO−SOURCE VOLTAGE (V) Figure 11. EOSS vs. Drain−to−Source Voltage www.onsemi.com 4 150 NVHL055N60S5F r(t), EFFECTIVE TRANSIENT THERMAL RESISTANCE TYPICAL CHARACTERISTICS 1 D = 0.5 0.1 0.01 0.001 D = 0.2 D = 0.1 D = 0.05 D = 0.02 D = 0.01 Single Pulse PDM t1 0.00001 0.0001 0.001 0.01 t, RECTANGULAR PULSE DURATION (s) Figure 12. Transient Thermal Impedance www.onsemi.com 5 t2 ZqJC(t) = r(t) x RqJC RqJC = 0.45°C/W Peak TJ = PDM x ZqJC(t) + TC Duty Cycle, D = t1 / t2 0.1 1 NVHL055N60S5F VGS RL Qg VDD VGS Qgs Qgd DUT IG = Const. Charge Figure 13. Gate Charge Test Circuit & Waveform RL VDS VDS 90% 90% 90% VDD VGS RG VGS DUT VGS 10% td(on) 10% tr tf td(off) ton toff Figure 14. Resistive Switching Test Circuit & Waveforms L E AS + 1 @ LI AS 2 VDS BVDSS ID IAS RG VDD DUT VGS 2 ID(t) VDD VDS(t) tp tp Figure 15. Unclamped Inductive Switching Test Circuit & Waveforms www.onsemi.com 6 Time NVHL055N60S5F + DUT VSD − ISD L Driver RG Same Type as DUT VGS − dv/dt controlled by RG − ISD controlled by pulse period D+ VGS (Driver) VDD Gate Pulse Width Gate Pulse Period 10 V IFM, Body Diode Forward Current ISD (DUT) di/dt IRM Body Diode Reverse Current Body Diode Recovery dv/dt VDS (DUT) VDD VSD Body Diode Forward Voltage Drop Figure 16. Peak Diode Recovery dv/dt Test Circuit & Waveforms SUPERFET and FRFET are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. www.onsemi.com 7 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TO−247−3LD CASE 340CX ISSUE A DATE 06 JUL 2020 GENERIC MARKING DIAGRAM* XXXXXXXXX AYWWG DOCUMENT NUMBER: DESCRIPTION: XXXXX A Y WW G = Specific Device Code = Assembly Location = Year = Work Week = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Some products may not follow the Generic Marking. 98AON93302G TO−247−3LD Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2018 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. ADDITIONAL INFORMATION TECHNICAL PUBLICATIONS: Technical Library: www.onsemi.com/design/resources/technical−documentation onsemi Website: www.onsemi.com  ONLINE SUPPORT: www.onsemi.com/support For additional information, please contact your local Sales Representative at www.onsemi.com/support/sales
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