找到“SN54136W”相关的规格书共13,308个
| 型号 | 厂商 | 描述 | 数据手册 | 替代料 | 参考价格 |
|---|---|---|---|---|---|
| 0022288151 | MOLEX3[MolexElectronicsLtd.] | 0022288151 - 2.54mm (.100") Pitch KK® Header, Breakaway, Right Angle Surface Mount Compatible, 15 Circuits, Tin (Sn) Plating, Mating Pin Length 8.23mm (.324") - Molex Electronics Ltd. | 获取价格 | ||
| 0009065049 | MOLEX1[MolexElectronicsLtd.] | 0009065049 - 3.96mm (.156") KK® IDT Trifurconâ„¢ Contact, 4 Circuits, Tin (Sn), Feed-Through, 24 and 22 Solid or Fused Stranded, and 22 Stranded, Black ID Strip - Molex Electronics Ltd. | 获取价格 | ||
| A-70568-0097 | MOLEX2[MolexElectronicsLtd.] | A-70568-0097 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 62 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70568-0059 | MOLEX2[MolexElectronicsLtd.] | A-70568-0059 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 54 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70568-0052 | MOLEX2[MolexElectronicsLtd.] | A-70568-0052 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 40 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70568-0031 | MOLEX2[MolexElectronicsLtd.] | A-70568-0031 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 66 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70568-0028 | MOLEX2[MolexElectronicsLtd.] | A-70568-0028 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 60 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70568-0023 | MOLEX2[MolexElectronicsLtd.] | A-70568-0023 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 50 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70568-0018 | MOLEX2[MolexElectronicsLtd.] | A-70568-0018 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 40 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70568-0007 | MOLEX2[MolexElectronicsLtd.] | A-70568-0007 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 18 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70568-0005 | MOLEX2[MolexElectronicsLtd.] | A-70568-0005 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 14 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0145 | MOLEX2[MolexElectronicsLtd.] | A-70567-0145 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0023 | MOLEX2[MolexElectronicsLtd.] | A-70567-0023 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0011 | MOLEX2[MolexElectronicsLtd.] | A-70567-0011 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0004 | MOLEX2[MolexElectronicsLtd.] | A-70567-0004 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70555-0002 | MOLEX8[MolexElectronicsLtd.] | A-70555-0002 - 2.54mm (.100") Pitch SL™ Header, Single Row, Right Angle, .120" Pocket, Shrouded, with Press-fit Plastic Peg, 3 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70551-OO01-0012 | MOLEX8[MolexElectronicsLtd.] | A-70551-OO01-0012 - 2.54mm (.100") Pitch SL™ Header, Single Row, Right Angle, .120" Pocket, Shroudedwith Beveled Plastic Peg, 13 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70475-0444 | MOLEX1[MolexElectronicsLtd.] | A-70475-0444 - 2.54mm (.100") Pitch SL™ Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 28, 3.81μm (150μ") Tin (Sn), 25 Circuits - Molex Electronics Ltd. | 获取价格 | ||
| A-70475-0435 | MOLEX1[MolexElectronicsLtd.] | A-70475-0435 - 2.54mm (.100") Pitch SL™ Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 28, 3.81μm (150μ") Tin (Sn), 16 Circuits - Molex Electronics Ltd. | 获取价格 | ||
| A-70475-0431 | MOLEX1[MolexElectronicsLtd.] | A-70475-0431 - 2.54mm (.100") Pitch SL™ Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 28, 3.81μm (150μ") Tin (Sn), 12 Circuits - Molex Electronics Ltd. | 获取价格 |
