ESDARF02-1BU2CK

ESDARF02-1BU2CK Single-line bidirectional ESD protection for high speed interface Datasheet  production data Features  Bidirectional device  Extra low diode capacitance: 0.2 pF  Very high bandwidth: 30 GHz  Low leakage current  0201 SMD package size compatible  Ultra small PCB area: 0.18 mm2  ECOPACK®2 and RoHS compliant component Pin1 available in different shapes ST0201 package Complies with the following standards: Figure 1. Functional diagram (top view) Pin1  IEC 61000-4-2 level 4 – 15 kV (air discharge) – 8 kV (contact discharge) Applications Where transient overvoltage protection in ESD sensitive equipment is required, such as:  Smartphones, mobile phone and accessories  Tablet PCs, netbooks and notebooks  Portable multimedia devices and accessories  Digital cameras and camcorders  Communication and highly integrated systems Description The ESDARF02-1BU2CK is a bidirectional single line TVS diode designed to protect the data lines or other I/O ports against ESD transients. The device is ideal for applications where both reduced line capacitance and board space saving are required. January 2017 This is information on a product in full production. DocID025014 Rev 3 1/9 www.st.com Characteristics 1 ESDARF02-1BU2CK Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value Unit VPP Peak pulse voltage: IEC 61000-4-2 contact discharge IEC 61000-4-2 air discharge 8 20 kV PPP Peak pulse power (8/20 µs) 20 W IPP Peak pulse current (8/20 µs) 1.5 A Tj Operating junction temperature range -40 to +150 °C Tstg Storage temperature range -65 to +150 °C TL Maximum lead temperature for soldering during 10 s 260 °C Note: For a surge greater than the maximum values, the diode will fail in short-circuit Figure 2. Electrical characteristics (definitions) Symbol VBR VRM IRM IPP = = = = Parameter Breakdown voltage Stand-off voltage Leakage current @ VRM Peak pulse current Rd aT C = = = Dynamic impedance Voltage temperature coefficient Parasite capacitance Table 2. Electrical characteristics (values, Tamb = 25 °C) Symbol Min. Typ. 5 6.6 Max. Unit VBR IR = 1 mA IRM VRM = 3.6 V 5 100 nA VCL IPP = 1 A, 8/20 µA 10 12 V Rd Dynamic resistance, pulse duration 100 ns 1.3 F = (200 MHz- 3000 MHz), VR = 0 V 0.2 -3 dB 30 Cline fc 2/9 Test Condition DocID025014 Rev 3 V Ω 0.3 pF GHz ESDARF02-1BU2CK Characteristics Figure 3. Leakage current versus junction temperature (typical values) 100 IR(nA) Figure 4. Junction capacitance versus frequency (typical values) 0,5 VR = VRM = 3.6 V I/O / GND C(pF) Tj = 25 °C Vosc = 30mV Direct Reverse 0,4 0,3 10 0,2 0,1 Tj(°C) 1 25 50 75 100 125 F(MHz) 150 Figure 5. ESD response to IEC 61000-4-2 (+8 kV contact discharge) 0,0 1,00 10,00 100,00 1000,00 Figure 6. JESD response to IEC 61000-4-2 (-8 kV contact discharge) 50 V/div 50 V/div 242 V 1 -12 V4 VPP: ESD peak voltage VCL :clamping voltage at 30 ns 3 V :clamping voltage at 60 ns CL 4 VCL :clamping voltage at 100 ns 1 2 19 V 2 17 V 3 15 V -16 V 3 -20 V 2 VPP: ESD peak voltage VCL :clamping voltage at 30 ns VCL :clamping voltage at 60 ns 4 VCL :clamping voltage at 100 ns 1 2 3 4 -241 V 1 20 ns/div 20 ns/div Figure 7. S21 attenuation measurement results  G% Figure 8. TLP measurements 25 IPP(A)  20   Positive polarity Negative polarity 15   10  5  )+] VCL(V)  0 0 (6'$5)%8&. * * * 0 0 5 DocID025014 Rev 3 10 15 20 25 30 35 40 45 50 55 60 3/9 9 Package information 2 ESDARF02-1BU2CK Package information  Epoxy meets UL94, V0  Bar indicates pin 1 In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 ST0201 package information Figure 9. ST0201 package outline D E Top A Side b1 b2 L1 L2 Bottom Pin 1 b1 e b2 L1 L2 Bottom e Pin 1 available in different shapes Table 3. 0201 package mechanical data Dimensions Ref. Millimeters Min. Typ. A 0.23 b1 0.20 Max. Min. Typ. Max. 0.28 0.33 0.25 0.30 0.0091 0.0110 0.0130 0.0079 0.0098 0.0118 b2 0.20 0.25 0.30 0.0079 0.0098 0.0118 D 0.55 0.60 0.65 0.0217 0.0236 0.0256 E 0.25 0.30 0.35 0.0099 0.0118 0.0138 e 4/9 Inches 0.35 0.0138 L1 0.13 0.18 0.23 0.0052 0.0071 0.0091 L2 0.14 0.19 0.24 0.0055 0.0075 0.0095 DocID025014 Rev 3 ESDARF02-1BU2CK Package information Figure 10. Footprint, dimensions in mm (inches) 0.656 (0.0258) 0.243 (0.0096) Figure 11. Marking 0.243 (0.0096) Z3 Pin2 0.300 (0.0118) Pin 1 0.170 (0.0067) Product marking may be rotated by 180° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. Figure 12. Tape and reel outline Bar indicates Pin 1 2.0 Ø 1.55 4.0 Z3 Z3 Z3 Z3 Z3 Z3 3.5 0.67 1.75 0.22 8.0 Note: 2.0 0.38 0.34 All dimensions are typical values in mm User direction of unreeling DocID025014 Rev 3 5/9 9 Recommendation on PCB assembly ESDARF02-1BU2CK 3 Recommendation on PCB assembly 3.1 Stencil opening design Figure 13. Recommended stencil windows-opening 90%/Thickness 80µm (all dimensions are in mm) 0.230 (0.0091) 0.643 (0.0253) 0.183 (0.0072) 0.285 (0.0112) 0.008 (0.0003) 0.300 (0.0118) 0.008 (0.0003) 0.656 (0.0258) 0.007 0.007 (0.00027) (0.00027) 0.170 (0.0067) 0.243 (0.0096) mm (inches) Footprint 3.2 6/9 Stencil window Solder paste 1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste is recommended. 3. Offers a high tack force to resist component displacement during PCB movement. 4. Use solder paste with fine particles: Type4 (powder particle size is 20-45 µm). DocID025014 Rev 3 ESDARF02-1BU2CK 3.3 3.4 3.5 Recommendation on PCB assembly Placement 1. Manual positioning is not recommended. 2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering 3. Standard tolerance of ±0.05 mm is recommended. 4. 1.0 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. PCB design preference 1. To control the solder paste amount, the closed via is recommended instead of open vias. 2. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. Reflow profile Figure 14. ST ECOPACK® recommended soldering reflow profile for PCB mounting 240-245 °C Temperature (°C) 250 -2 °C/s 2 - 3 °C/s 60 sec (90 max) 200 -3 °C/s 150 -6 °C/s 100 0.9 °C/s 50 Time (s) 0 Note: 30 60 90 120 150 180 210 240 270 300 Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020. DocID025014 Rev 3 7/9 9 Ordering information 4 ESDARF02-1BU2CK Ordering information Figure 15. Ordering information scheme ESDA RF 02 - 1B U2 CK ESDA array Application RF antenna Number of lines Direction B = Bidirectional Package U2 = ST0201 C = Low clamping ESD protection Table 4. Ordering information Order code Marking Weight Base qty. Delivery mode ESDARF02-1BU2CK Z3(1) 0.124 mg 15000 Tape and reel 1. The marking can be rotated by 180° to differentiate assembly location 5 Revision history Table 5. Document revision history 8/9 Date Revision Changes 25-Feb-2015 1 Initial release. 02-Jun-2016 2 Updated Features. Updated Table 2 and reformatted to current standard. 23-Jan-2017 3 Updated Table 3. DocID025014 Rev 3 ESDARF02-1BU2CK IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2017 STMicroelectronics – All rights reserved DocID025014 Rev 3 9/9 9