MP34DT04
MEMS audio sensor omnidirectional digital microphone
Datasheet - production data
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Gaming and virtual reality input devices
Digital still and video cameras
Antitheft systems
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Description
The MP34DT04 is an ultra-compact, low-power,
omnidirectional, digital MEMS microphone built
with a capacitive sensing element and an IC
interface.
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The sensing element, capable of detecting
acoustic waves, is manufactured using a
specialized silicon micromachining process
dedicated to produce audio sensors.
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Features
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Single supply voltage
Low power consumption
120 dBSPL acoustic overload point
64 dB signal-to-noise ratio
Omnidirectional sensitivity
–26 dBFS sensitivity
PDM output
HCLGA package
−
Top-port design
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SMD-compliant
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EMI-shielded
−
ECOPACK®, RoHS, and “Green”
compliant
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The IC interface is manufactured using a CMOS
process that allows designing a dedicated circuit
able to provide a digital signal externally in PDM
format.
The MP34DT04 has an acoustic overload point of
120 dBSPL with a 64 dB signal-to-noise ratio and
–26 dBFS sensitivity.
The MP34DT04 is available in a top-port, SMDcompliant, EMI-shielded package and is
guaranteed to operate over an extended
temperature range from -40 °C to +85 °C.
Table 1: Device summary
Order codes
Temp.
range [°C]
Package
Packing
MP34DT04
-40 to +85
HCLGA
(3x4 x1.095 mm)
4LD
Tray
MP34DT04TR
-40 to +85
HCLGA
(3x4x1.095 mm)
4LD
Tape and
reel
Applications
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Mobile terminals
Laptop and notebook computers
Portable media players
VoIP
Speech recognition
A/V eLearning devices
November 2016
DocID027586 Rev 3
This is information on a product in full production.
1/21
www.st.com
Contents
MP34DT04
Contents
1
Pin description ................................................................................ 5
2
Acoustic and electrical specifications ........................................... 6
2.1
Acoustic and electrical characteristics............................................... 6
2.2
Timing characteristics ....................................................................... 7
2.3
Frequency response ......................................................................... 8
3
Application recommendations ....................................................... 9
4
5
Carrier tape mechanical specifications ....................................... 11
Process recommendations ........................................................... 12
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Absolute maximum ratings...........................................................
15
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Functionality ..................................................................................
16
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Package information .....................................................................
17
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Revision history ............................................................................
20
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6
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9
10
Sensing element ............................................................................ 14
8.1
L/R channel selection ...................................................................... 16
9.1
Soldering information ...................................................................... 17
9.2
HCLGA package information........................................................... 18
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MP34DT04
List of tables
List of tables
Table 1: Device summary ........................................................................................................................... 1
Table 2: Pin description .............................................................................................................................. 5
Table 3: Acoustic and electrical characteristics .......................................................................................... 6
Table 4: Distortion specifications ................................................................................................................ 6
Table 5: Timing characteristics ................................................................................................................... 7
Table 6: Frequency response mask for digital microphones ...................................................................... 8
Table 7: Absolute maximum ratings ......................................................................................................... 15
Table 8: L/R channel selection ................................................................................................................. 16
Table 9: Recommended soldering profile limits ........................................................................................ 17
Table 10: Document revision history ........................................................................................................ 20
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List of figures
MP34DT04
List of figures
Figure 1: Pin connections ........................................................................................................................... 5
Figure 2: Timing waveforms ....................................................................................................................... 7
Figure 3: Frequency response and mask ................................................................................................... 8
Figure 4: MP34DT04 electrical connections for stereo configuration ......................................................... 9
Figure 5: MP34DT04 electrical connections for stereo configuration (top view ....................................... 10
Figure 6: Carrier tape without microphone (top view) ............................................................................... 11
Figure 7: Carrier tape with microphone (top view) .................................................................................... 11
Figure 8: Recommended picking area ...................................................................................................... 12
Figure 9: Recommended picker design .................................................................................................... 13
Figure 10: Recommended soldering profile limits .................................................................................... 17
Figure 11: HCLGA (3x4x1.095) 4-lead package outline and mechanical data ........................................ 18
Figure 12: Land pattern............................................................................................................................. 19
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MP34DT04
1
Pin description
Pin description
Figure 1: Pin connections
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Table 2: Pin description
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Pin #
Pin name
1
Vdd
Power supply
2
LR
Left/Right channel selection
3
CLK
4
DOUT
5 (ground ring)
GND
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Function
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-
Synchronization input clock
Left/Right PDM data output
0 V supply
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Acoustic and electrical specifications
MP34DT04
2
Acoustic and electrical specifications
2.1
Acoustic and electrical characteristics
The values listed in the table below are specified for Vdd = 1.8 V, Clock = 2.4 MHz,
T = 25 °C, unless otherwise noted.
Table 3: Acoustic and electrical characteristics
Symbol
Parameter
Test condition
Vdd
Supply voltage
Idd
Current consumption in normal
mode
IddPdn
Current consumption in powerdown mode (2)
Scc
Short-circuit current
AOP
Acoustic overload point
So
Power supply rejection
Input clock frequency
1.8
3.6
V
600
700
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Turn-on time
Top
Operating temperature range
VIOL
Low-level logic input/output
voltage
VIOH
High-level logic input/output
voltage
so
100 mVpp sine 1 kHz
(4)
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1
-23
cycle: min = 40% max = 60%.
(4)Time
from the first clock edge to valid output data.
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-70
dBFS
ms
-40
+85
°C
Iout = 1 mA
-0.3
0.35xVdd
V
Iout = 1 mA
0.65xVdd
Vdd+0.3
V
100
pF
)
(s
2.4
Table 4: Distortion specifications
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dBFS
dB (A)
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clock in static mode.
dBSPL
64
specifications are not guaranteed.
(3)Duty
mA
10
ct
(2)Input
µA
MHz
Pr
Capacitive load
-26
10
μA
3.25
Guaranteed by design
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120
(3)
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1.6
10
A-weighted at 1 kHz,
94 dB SPL
PSR
(1)Typical
Unit
-29
Signal-to-noise ratio
Notes:
Max.
1
SNR
CLOAD
Typ. (1)
Mean value
Sensitivity
fCLK
Min.
Parameter
Test condition
Value
Distortion
100 dBSPL (50 Hz - 4 kHz)
< 1% THD + N
Distortion
115 dBSPL (1 kHz)
< 5% THD + N
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MP34DT04
2.2
Acoustic and electrical specifications
Timing characteristics
Table 5: Timing characteristics
Parameter
Description
fCLK
Clock frequency for normal mode
fPD
Clock frequency for power-down mode
TCLK
Min.
Max.
Unit
1
3.25
MHz
0.23
MHz
1000
ns
TR,EN
Clock period for normal mode
308
18
TR,DIS
Data enabled on DATA line, L/R pin = 1
(1)
ns
16(1)
TL,EN
Data disabled on DATA line, L/R pin = 1
18
TL,DIS
Data enabled on DATA line, L/R pin = 0
ns
(1)
ns
16(1)
Data disabled on DATA line, L/R pin = 0
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Notes:
(1)From
TCLK
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CLK
TR,EN
PDM R
Pr
PDM L
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TL,DIS
TR,DIS
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design simulations
Figure 2: Timing waveforms
ns
High Z
High Z
TL,EN
High Z
High Z
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Acoustic and electrical specifications
2.3
MP34DT04
Frequency response
Figure 3: Frequency response and mask
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Table 6: Frequency response mask for digital microphones
Frequency / Hz (1)
100...4000
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4000...10000
Upper limit
Unit
-2
+2
dBr 1 kHz
-2
+4
dBr 1 kHz
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Notes:
(1)At
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Lower limit
T = 20 °C and acoustic stimulus = 1 Pa (94 dB SPL)
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3
Application recommendations
Application recommendations
Figure 4: MP34DT04 electrical connections for stereo configuration
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Application recommendations
MP34DT04
Figure 5: MP34DT04 electrical connections for stereo configuration (top view
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Power supply decoupling capacitors (100 nF ceramic, 1 µF ceramic) should be placed as
near as possible to pin 1 of the device (common design practice).
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The L/R pin must be connected to Vdd or GND (refer to Table 8: "L/R channel selection").
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4
Carrier tape mechanical specifications
Carrier tape mechanical specifications
Figure 6: Carrier tape without microphone (top view)
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Figure 7: Carrier tape with microphone (top view)
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Process recommendations
5
MP34DT04
Process recommendations
To ensure a consistent manufacturing process it is strongly advised to comply with the
following recommendations:
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The recommended pick-up area for the MP34DT04 package must be defined using
the worst case (ie. no device alignment during the picking process). This area has
been defined considering all the tolerances of the components involved (reel,
package, sound inlet). The picker tolerance shall be considered as well.
To prevent damage to the MEMS membrane or incorrect pick-up and placement, do
not pick up the component on the inlet area.
For the package outline please refer to Figure 7: "Carrier tape with microphone (top
view)". Nozzle shape, size, and placement accuracy are the other key factors to
consider when deciding on the coordinates for picking.
Device alignment before picking is highly recommended.
A vacuum force greater than 7 psi must be avoided
1 kPa = 0.145 psi (lb/in2) = 0.0102 kgf/cm² = 0.0098 atm
MSL (moisture sensitivity level) Class 3
Maximum of 3 reflow cycles is recommended.
All recommended dimensions (device safe-picking area) do not include the pick-andplace equipment tolerances
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Figure 8: Recommended picking area
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To have a safe pick-up "by design", ST strongly advises an ad hoc nozzle.
The following picker ensures that the holes for the vacuum and the air stream are ALWAYS
away from the porthole of the device (4 vacuum ports located at each corner of the device).
The recommended nozzle also has a recess, in the form of a cross, which guarantees that
the porthole is always left at atmospheric pressure. By using the recommended nozzle, the
membrane will not suffer any sudden air disturbances during the picking or placing of the
devices in the tape and reel.
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Process recommendations
Figure 9: Recommended picker design
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Sensing element
6
MP34DT04
Sensing element
The sensing element shall mean the acoustic sensor consisting of a conductive movable
plate and a fixed plate placed in a tiny silicon chip. This sensor transduces the sound
pressure into the changes of coupled capacity between those two plates.
Omron Corporation supplies this element for STMicroelectronics.
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MP34DT04
7
Absolute maximum ratings
Absolute maximum ratings
Stresses above those listed as “absolute maximum ratings” may cause permanent damage
to the device. This is a stress rating only and functional operation of the device under these
conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Table 7: Absolute maximum ratings
Symbol
Ratings
Vdd
Supply voltage
Vin
Input voltage on any control pin
TSTG
Storage temperature range
Maximum value
Unit
-0.3 to 5
V
-0.3 to Vdd +0.3
V
±2000 (HBM)
ESD
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-40 to +125
Electrostatic discharge protection
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±200 (MM)
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°C
V
±750 (CBM)
ESD
Product standard EN 55024:2010 - 3 air
discharge
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±15000
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Functionality
MP34DT04
8
Functionality
8.1
L/R channel selection
The L/R digital pad lets the user select the DOUT signal pattern as shown in Table 8: "L/R
channel selection". The L/R pin must be connected to Vdd or GND.
Table 8: L/R channel selection
L/R
CLK low
CLK high
GND
Data valid
High impedance
Vdd
High impedance
Data valid
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MP34DT04
9
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
9.1
Soldering information
The HCLGA (3 x 4) 4LD package is also compliant with the RoHS and “Green” standards
and is qualified for soldering heat resistance according to JEDEC J-STD-020.
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Land pattern and soldering recommendations are available at www.st.com.
Figure 10: Recommended soldering profile limits
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tp
TP
CRITICAL ZONE
ro
RAMP-UP
TL to T P
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TL
TEMPERATURE
TSMAX
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TSMIN
ts
PREHEAT
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let
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-
RAMP-DOWN
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tL
T25° to PEAK
30 60 90 120 150 180
210
TIME
240
270
300
330
360 390
Table 9: Recommended soldering profile limits
Description
Average ramp rate
Preheat
Minimum temperature
Maximum temperature
Time (TSMIN to TSMAX)
Ramp-up rate
Parameter
Pb free
TL to TP
3 °C/sec max
TSMIN
TSMAX
tS
150 °C
200 °C
60 sec to 120 sec
TSMAX to TL
Time maintained above liquids temperature
Liquids temperature
tL
TL
Peak temperature
TP
Time within 5 °C of actual peak temperature
60 sec to 150 sec
217 °C
260 °C max
20 sec to 40 sec
Ramp-down rate
6 °C/sec max
Time 25 °C (t25 °C) to peak temperature
8 minutes max
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Package information
9.2
MP34DT04
HCLGA package information
Figure 11: HCLGA (3x4x1.095) 4-lead package outline and mechanical data
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Dimensions are in millimeter unless otherwise specified
General Tolerance is +/-0.15mm unless otherwise specified
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1.
2.
Pr
ITEM
Length [L]
Width [W]
Height [H]
AP
OUTER DIMENSIONS
DIMENSION [mm]
3
4
1.095
ɸ 0.4
TOLERANCE [mm]
±0.1
±0.1
±0.1
±0.1
8579626_B
The MEMS microphone plastic cap can exhibit some level of variation in color when
the device is subjected to thermal processes. This variation does not affect acoustic or
electrical performance.
Ring plating can be subject to change not affecting acoustic and electrical
performance.
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MP34DT04
Package information
Figure 12: Land pattern
0.85
GND
0.85
0.35
1.30
2.30
GND
Vdd
DOUT
GND
0.95
LR
CLK
0.40
0.35
GND
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Pad + solder paste
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Revision history
10
MP34DT04
Revision history
Table 10: Document revision history
Date
Revision
10-Mar-2015
1
Initial release
07-May-2015
2
Updated Section 9.2: "HCLGA package information"
3
Added CLOAD to Table 3: "Acoustic and electrical characteristics"
Updated Section 3: "Application recommendations"
Updated Section 5: "Process recommendations"
04-Nov-2016
Changes
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MP34DT04
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and
improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST
products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order
acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the
design of Purchasers’ products.
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No license, express or implied, to any intellectual property right is granted by ST herein.
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Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
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ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
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Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
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© 2016 STMicroelectronics – All rights reserved
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