STPS5H100H

STPS5H100 High voltage power Schottky rectifier Datasheet - production data K A Description K This high voltage Schottky barrier rectifier is packaged in DPAK and IPAK and designed for high frequency compact switched mode power supply such as adapters and on board DC-DC converters. NC KA Table 1: Device summary IPAK Symbol K NC A K NC A DPAK Value IF(AV) 5A VRRM 100 V Tj(max.) 175 °C VF(typ.) 0.57 V Features       Negligible switching losses High junction temperature capability Low leakage current Good trade-off between leakage current and forward voltage drop Avalanche specification ECOPACK® compliant component for IPAK and DPAK on demand May 2017 DocID5388 Rev 13 This is information on a product in full production. 1/10 www.st.com Characteristics 1 STPS5H100 Characteristics Table 2: Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 100 V IF(RMS) RMS forward voltage 10 A IF(AV) Average forward current, δ = 0.5, square wave TC = 165 °C 5 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 75 A PARM Repetitive peak avalanche power tp = 10 µs, Tj = 125 °C 515 W -65 to +175 °C 175 °C Tstg Storage temperature range Tj Maximum operating junction temperature(1) Notes: (1)(dP tot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 3: Thermal parameters Symbol Rth(j-c) Parameter Junction to case Max. value Unit 2.5 °C/W Table 4: Static electrical characteristics Symbol IR(1) Parameter Test conditions Reverse leakage current Tj = 25 °C Tj = 125 °C Tj = 25 °C VF(2) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 5 A IF = 10 A Notes: (1)Pulse test: tp = 5 ms, δ < 2% (2)Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.51 x IF(AV) + 0.02 x IF2(RMS) 2/10 DocID5388 Rev 13 Min. Typ. - 1.3 - Unit 3.5 µA 4.5 mA 0.73 0.57 - Max. 0.61 0.85 0.66 0.71 V STPS5H100 1.1 Characteristics Characteristics (curves) Figure 1: Average forward power dissipation versus average forward current P F(AV)(W) Figure 2: Average forward current versus ambient temperature (δ = 0.5) IF(AV)(A) 6 4.0 δ = 0.2 δ = 0.1 Rth(j-a) = Rth(j-c) δ = 0.5 3.5 5 δ = 0.05 3.0 4 δ= 1 2.5 3 2.0 1.5 Rth(j-a) = 80 °C/W 2 T 1.0 T 1 0.5 IF( AV ) (A) δ=tp/T tp 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Figure 3: Normalized avalanche power derating versus pulse duration (at Tj = 125 °C) δ=tp/T tp 20 40 Tamb(°C) 0 0 60 80 100 120 160 140 180 Figure 4: Relative variation of thermal impedance junction to case versus pulse duration Zth(j-c)/Rth(j-c) 1.0 0.8 δ = 0.5 0.6 0.4 δ = 0.2 δ = 0.1 T 0.2 Single pulse 0.0 1E-3 Figure 5: Reverse leakage current versus reverse voltage applied (typical values) 5E+3 tp(s) 1E-2 δ =tp/T tp 1E-1 1E+0 Figure 6: Junction capacitance versus reverse voltage applied (typical values) C( pF) IR ( µA) 1000 F = 1 MHz Tj = 25 °C T j = 125 °C 1E+3 1E+2 1E+1 100 1E+0 T j = 25 °C 1E-1 VR ( V) 1E-2 0 10 20 30 40 50 60 70 80 9 0 100 DocID5388 Rev 13 V R (V) 10 1 100 10 3/10 Characteristics STPS5H100 Figure 7: Forward voltage drop versus forward current (typical values) 4/10 Figure 8: Thermal resistance junction to ambient versus copper surface under tab DocID5388 Rev 13 Package information STPS5H100 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.   2.1 Epoxy meets UL94, V0 Cooling method: by conduction (C) DPAK package information Figure 9: DPAK package outline This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. DocID5388 Rev 13 5/10 Package information STPS5H100 Table 5: DPAK package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 2.18 2.40 0.085 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b4 4.95 5.46 0.194 0.215 c 0.46 0.61 0.018 0.024 c2 0.46 0.60 0.018 0.023 D 5.97 6.22 0.235 0.244 D1 4.95 5.60 0.194 0.220 E 6.35 6.73 0.250 0.265 E1 4.32 5.50 0.170 0.216 e 2.286 typ. 0.090 typ. e1 4.40 4.70 0.173 0.185 H 9.35 10.40 0.368 0.409 L 1.0 1.78 0.039 0.070 L2 1.27 0.050 L4 0.60 1.02 0.023 0.040 V2 -8° +8° -8° +8° Figure 10: DPAK recommended footprint (dimensions in mm) 6/10 DocID5388 Rev 13 Package information STPS5H100 2.2 IPAK package information Figure 11: IPAK package outline This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. DocID5388 Rev 13 7/10 Package information STPS5H100 Table 6: IPAK package mechanical data Dimensions Ref. Inches(1) Millimiters Min. Typ. Max. Min. Max. A 2.20 2.40 0.086 0.094 A1 0.90 1.10 0.035 0.043 b 0.64 0.90 0.025 0.035 b2 b4 0.95 5.20 B5 5.43 0.037 0.204 0.30 0.213 0.012 c 0.45 0.60 0.017 0.023 c2 0.46 0.60 0.018 0.023 D 6.00 6.20 0.236 0.244 E 6.40 6.65 0.252 0.261 e 2.28 e1 4.40 H 0.089 4.60 0.173 16.10 0.181 0.633 L 9.00 9.60 0.354 0.378 L1 0.80 1.20 0.031 0.047 L2 0.80 V1 10° 1.25 Notes: (1)Inch 8/10 Typ. dimensions are for reference only. DocID5388 Rev 13 0.031 10° 0.049 Ordering information STPS5H100 3 Ordering information Table 7: Ordering information 4 Order code Marking STPS5H100B S5 H100 STPS5H100B-TR S5 H100 STPS5H100H S5 H100H Package Weight DPAK 320 mg IPAK 310 mg Base qty. Delivery mode 75 Tube 2500 Tape and reel 75 Tube Revision history Table 8: Document revision history Date Revision Changes Jul-2003 6B 03-Nov-2005 7 DPAK footprint dimensions updated. 15-Feb-2006 8 ECOPACK statement added. 05-Mar-2007 9 IPAK package added. 01-Aug-2014 10 Updated DPAK package information. 17-Sep-2014 11 Updated Table 2, title Figure 3 and Figure 11. 14-Oct-2014 12 Updated DPAK package information. 12-May-2017 13 Updated DPAK package information and reformatted to current standard. Last issue. DocID5388 Rev 13 9/10 STPS5H100 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2017 STMicroelectronics – All rights reserved 10/10 DocID5388 Rev 13