找到“PACKAGE”相关的规格书共9,694个
| 型号 | 厂商 | 描述 | 数据手册 | 替代料 | 参考价格 |
|---|---|---|---|---|---|
| BUP48 | SEME-LAB[SemeLAB] | BUP48 - Bipolar NPN Device in a Hermetically sealed TO3 Metal Package - Seme LAB | 获取价格 | ||
| BUL49B | SEME-LAB[SemeLAB] | BUL49B - Bipolar NPN Device in a Hermetically sealed TO3 Metal Package. - Seme LAB | 获取价格 | ||
| 1N4481 | NJSEMI[NewJerseySemi-ConductorProducts,Inc.] | 1N4481 - DO-41 Package - New Jersey Semi-Conductor Products, Inc. | 获取价格 | ||
| BUJ303AX_11 | NXP[NXPSemiconductors] | BUJ303AX_11 - NPN power transistor Very high voltage capability Isolated package - NXP Semiconductors | 获取价格 | ||
| 1N4477 | NJSEMI[NewJerseySemi-ConductorProducts,Inc.] | 1N4477 - DO-41 Package - New Jersey Semi-Conductor Products, Inc. | 获取价格 | ||
| 1N4467 | NJSEMI[NewJerseySemi-ConductorProducts,Inc.] | 1N4467 - DO-41 Package - New Jersey Semi-Conductor Products, Inc. | 获取价格 | ||
| 1N4464 | NJSEMI[NewJerseySemi-ConductorProducts,Inc.] | 1N4464 - DO-41 Package - New Jersey Semi-Conductor Products, Inc. | 获取价格 | ||
| 1N4463 | NJSEMI[NewJerseySemi-ConductorProducts,Inc.] | 1N4463 - DO-41 Package - New Jersey Semi-Conductor Products, Inc. | 获取价格 | ||
| 1N4461 | NJSEMI[NewJerseySemi-ConductorProducts,Inc.] | 1N4461 - DO-41 Package - New Jersey Semi-Conductor Products, Inc. | 获取价格 | ||
| B0303YS-W2 | MORNSUN[MORNSUNScience&TechnologyLtd.] | B0303YS-W2 - MINIATURE SIP PACKAGE - MORNSUN Science& Technology Ltd. | 获取价格 | ||
| BSS72 | SEME-LAB[SemeLAB] | BSS72 - Bipolar NPN Device in a Hermetically sealed TO18 Metal Package - Seme LAB | 获取价格 | ||
| 1N4150-1 | MICROSEMI[MicrosemiCorporation] | 1N4150-1 - Silicon Switching Diode DO-35 Glass Package - Microsemi Corporation | 获取价格 | ||
| BPT-NP23C2 | BRIGHT[BRIGHTLEDELECTRONICSCORP] | BPT-NP23C2 - SIDE- LOOK PACKAGE PHOTOTRANSISTOR - BRIGHT LED ELECTRONICS CORP | 获取价格 | ||
| BP240160C | BOLYMIN[Bolymin,Inc] | BP240160C - FSTN LCD, TAB IC and PCB package LCD driver only - Bolymin, Inc | 获取价格 | ||
| BO1602D | BOLYMIN[Bolymin,Inc] | BO1602D - COG package 5x7 dots with cursor, with icons - Bolymin, Inc | 获取价格 | ||
| BO128128C | BOLYMIN[Bolymin,Inc] | BO128128C - COG package Built-in controller ST7528 - Bolymin, Inc | 获取价格 | ||
| Q6600 | INTEL[IntelCorporation] | Q6600 - on 65 nm Process in the 775-land LGA Package supporting Intel 64 architecture - Intel Corporation | 获取价格 | ||
| BIR-BO03J4G-1 | BRIGHT[BRIGHTLEDELECTRONICSCORP] | BIR-BO03J4G-1 - END-LOOK PACKAGE LIGHT EMITTING DIODE - BRIGHT LED ELECTRONICS CORP | 获取价格 | ||
| BHP20201F | BITECH[Bitechnologies] | BHP20201F - Noninductive Planar Low Cost, 20 Watt TO 220 Package Thick Film Resistor - Bi technologies | 获取价格 | ||
| 17-21-Y2C-AN1P2-3T | EVERLIGHT[EverlightElectronicsCo.,Ltd] | 17-21-Y2C-AN1P2-3T - 0805 Package Chip LED(1.0mm Height) - Everlight Electronics Co., Ltd | 获取价格 |
