找到“without”相关的规格书共5,131个
| 型号 | 厂商 | 描述 | 数据手册 | 替代料 | 参考价格 |
|---|---|---|---|---|---|
| A-70567-0163 | MOLEX2[MolexElectronicsLtd.] | A-70567-0163 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 58 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0162 | MOLEX2[MolexElectronicsLtd.] | A-70567-0162 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 56 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0149 | MOLEX2[MolexElectronicsLtd.] | A-70567-0149 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0148 | MOLEX2[MolexElectronicsLtd.] | A-70567-0148 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0145 | MOLEX2[MolexElectronicsLtd.] | A-70567-0145 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0089 | MOLEX2[MolexElectronicsLtd.] | A-70567-0089 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 46 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0085 | MOLEX2[MolexElectronicsLtd.] | A-70567-0085 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0081 | MOLEX2[MolexElectronicsLtd.] | A-70567-0081 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0077 | MOLEX2[MolexElectronicsLtd.] | A-70567-0077 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0023 | MOLEX2[MolexElectronicsLtd.] | A-70567-0023 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0011 | MOLEX2[MolexElectronicsLtd.] | A-70567-0011 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0004 | MOLEX2[MolexElectronicsLtd.] | A-70567-0004 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 89485-8201 | MOLEX10[MolexElectronicsLtd.] | 89485-8201 - Universal Serial Bus (USB) Shielded I/O Type A Receptacle, Single Upright, Right Angle, Terminal Length 2.00mm (.079), Without Mylar, 0.76μm (30μ) Gold (Au) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 87982-3050 | MOLEX10[MolexElectronicsLtd.] | 87982-3050 - 2.00mm (.079) Pitch Milli-Grid™ Header, Through Hole, Vertical, Shrouded, Lead-free, 50 Circuits, 0.38μm (15μ) Gold (Au) Plating, Center Polarization Slot, without Cap - Molex Electronics Ltd. | 获取价格 | ||
| 87898-1426 | MOLEX10[MolexElectronicsLtd.] | 87898-1426 - 2.54mm (.100) Pitch KK® Header, Surface Mount, Breakaway, Vertical, 14 Circuits, Tin (Sn) Overall Plating, Tube Packaging, without Cap, Lead- free - Molex Electronics Ltd. | 获取价格 | ||
| 87898-0826 | MOLEX10[MolexElectronicsLtd.] | 87898-0826 - 2.54mm (.100) Pitch KK® Header, Surface Mount, Breakaway, Vertical, 8 Circuits, Tin (Sn) Overall Plating, Tube Packaging, without Cap, Lead- free - Molex Electronics Ltd. | 获取价格 | ||
| 87898-0626 | MOLEX10[MolexElectronicsLtd.] | 87898-0626 - 2.54mm (.100) Pitch KK® Header, Surface Mount, Breakaway, Vertical, 6 Circuits, Tin (Sn) Overall Plating, Tube Packaging, without Cap, Lead- free - Molex Electronics Ltd. | 获取价格 | ||
| 87858-0760 | MOLEX10[MolexElectronicsLtd.] | 87858-0760 - 2.00mm (.079) Pitch Milli-Grid™ Breakaway Header, Surface Mount, Single Row, Parallel, 2.54μm (100μ) Tin (Sn) Plating, without Peg, withKapton Tape, Mating Pin - Molex Electronics Ltd. | 获取价格 | ||
| 87834-4419 | MOLEX10[MolexElectronicsLtd.] | 87834-4419 - 2.54mm (.100) Pitch C-Grid® Header, Dual Row, Low Profile, Vertical, Shrouded, 44 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCB Locator - Molex Electronics Ltd. | 获取价格 | ||
| 87834-4043 | MOLEX10[MolexElectronicsLtd.] | 87834-4043 - 2.54mm (.100) Pitch C-Grid® Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without PCB Locator - Molex Electronics Ltd. | 获取价格 |
