找到“without”相关的规格书共5,131个
| 型号 | 厂商 | 描述 | 数据手册 | 替代料 | 参考价格 |
|---|---|---|---|---|---|
| A-70567-0144 | MOLEX2[MolexElectronicsLtd.] | A-70567-0144 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0099 | MOLEX2[MolexElectronicsLtd.] | A-70567-0099 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 66 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0096 | MOLEX2[MolexElectronicsLtd.] | A-70567-0096 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 60 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0092 | MOLEX2[MolexElectronicsLtd.] | A-70567-0092 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 52 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0088 | MOLEX2[MolexElectronicsLtd.] | A-70567-0088 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 44 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0076 | MOLEX2[MolexElectronicsLtd.] | A-70567-0076 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0074 | MOLEX2[MolexElectronicsLtd.] | A-70567-0074 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0073 | MOLEX2[MolexElectronicsLtd.] | A-70567-0073 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0070 | MOLEX2[MolexElectronicsLtd.] | A-70567-0070 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0032 | MOLEX2[MolexElectronicsLtd.] | A-70567-0032 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0029 | MOLEX2[MolexElectronicsLtd.] | A-70567-0029 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 62 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0024 | MOLEX2[MolexElectronicsLtd.] | A-70567-0024 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 52 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0016 | MOLEX2[MolexElectronicsLtd.] | A-70567-0016 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0015 | MOLEX2[MolexElectronicsLtd.] | A-70567-0015 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 34 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0014 | MOLEX2[MolexElectronicsLtd.] | A-70567-0014 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0013 | MOLEX2[MolexElectronicsLtd.] | A-70567-0013 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0008 | MOLEX2[MolexElectronicsLtd.] | A-70567-0008 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0007 | MOLEX2[MolexElectronicsLtd.] | A-70567-0007 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0006 | MOLEX2[MolexElectronicsLtd.] | A-70567-0006 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0003 | MOLEX2[MolexElectronicsLtd.] | A-70567-0003 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 |
