找到“Without”相关的规格书共5,131个
| 型号 | 厂商 | 描述 | 数据手册 | 替代料 | 参考价格 |
|---|---|---|---|---|---|
| 15-80-0323 | MOLEX2[MolexElectronicsLtd.] | 15-80-0323 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0309 | MOLEX2[MolexElectronicsLtd.] | 15-80-0309 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0285 | MOLEX2[MolexElectronicsLtd.] | 15-80-0285 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 71741-0003 | MOLEX8[MolexElectronicsLtd.] | 71741-0003 - 1.00mm (.039") Pitch Mezzanine Plug, Surface Mount, Dual Row, Vertical Stacking84 Circuits, 8.35mm (.329") Unmated Height, without PCB Locator Pegs, with Robotic - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0229 | MOLEX2[MolexElectronicsLtd.] | 15-80-0229 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0225 | MOLEX2[MolexElectronicsLtd.] | 15-80-0225 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating - Molex Electronics Ltd. | 获取价格 | ||
| 71436-2964 | MOLEX8[MolexElectronicsLtd.] | 71436-2964 - 1.00mm (.039") Pitch Mezzanine IEEE 1386 Plug, Surface Mount, Dual Row, VerticalStacking, 64 Circuits, 8.35mm (.329") Unmated Height, without PCB Locator Pegs, with - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0221 | MOLEX2[MolexElectronicsLtd.] | 15-80-0221 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0163 | MOLEX2[MolexElectronicsLtd.] | 15-80-0163 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 71349-1091 | MOLEX8[MolexElectronicsLtd.] | 71349-1091 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded50 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, without Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 71349-1090 | MOLEX8[MolexElectronicsLtd.] | 71349-1090 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded, 48 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, without Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 71349-1086 | MOLEX8[MolexElectronicsLtd.] | 71349-1086 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded40 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, without Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 71349-1075 | MOLEX8[MolexElectronicsLtd.] | 71349-1075 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded18 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, without Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 71349-1069 | MOLEX8[MolexElectronicsLtd.] | 71349-1069 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded, 6Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, without Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 71349-1050 | MOLEX8[MolexElectronicsLtd.] | 71349-1050 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded, 36 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, without Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 71349-1042 | MOLEX8[MolexElectronicsLtd.] | 71349-1042 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded20 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, without Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0143 | MOLEX2[MolexElectronicsLtd.] | 15-80-0143 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 71349-1041 | MOLEX8[MolexElectronicsLtd.] | 71349-1041 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded18 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, without Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 71349-1040 | MOLEX8[MolexElectronicsLtd.] | 71349-1040 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded,16 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, without Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 71349-1036 | MOLEX8[MolexElectronicsLtd.] | 71349-1036 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded, 8 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, without Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 |
