找到“without”相关的规格书共5,131个
| 型号 | 厂商 | 描述 | 数据手册 | 替代料 | 参考价格 |
|---|---|---|---|---|---|
| 0713491047 | MOLEX8[MolexElectronicsLtd.] | 0713491047 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded,30 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, without Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 0713491041 | MOLEX8[MolexElectronicsLtd.] | 0713491041 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded18 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, without Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 0713491015 | MOLEX8[MolexElectronicsLtd.] | 0713491015 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded34 Circuits, Tin (Sn) Plating, without Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 0713491010 | MOLEX8[MolexElectronicsLtd.] | 0713491010 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded24 Circuits, Tin (Sn) Plating, without Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 0713491001 | MOLEX8[MolexElectronicsLtd.] | 0713491001 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded, 6Circuits, Tin (Sn) Plating, without Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 0713085478 | MOLEX8[MolexElectronicsLtd.] | 0713085478 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 78 Circuits1.50μm (59μ") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator - Molex Electronics Ltd. | 获取价格 | ||
| 0713085462 | MOLEX8[MolexElectronicsLtd.] | 0713085462 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 62 Circuits1.50μm (59μ") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator - Molex Electronics Ltd. | 获取价格 | ||
| 0713085448 | MOLEX8[MolexElectronicsLtd.] | 0713085448 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 48 Circuits1.50μm (59μ") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB LocatorPegs - Molex Electronics Ltd. | 获取价格 | ||
| 0713085446 | MOLEX8[MolexElectronicsLtd.] | 0713085446 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 46 Circuits1.50μm (59μ") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator - Molex Electronics Ltd. | 获取价格 | ||
| 0713085404 | MOLEX8[MolexElectronicsLtd.] | 0713085404 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 4 Circuits,1.50μm (59μ") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 53748-0708 | MOLEX7[MolexElectronicsLtd.] | 53748-0708 - 0.50mm (.020") Pitch SlimStack™ Plug, Surface Mount, Dual Row, Vertical, 3.00mm(.118") Stack Height, 70 Circuits, without Vacuum Pick-up Tape - Molex Electronics Ltd. | 获取价格 | ||
| 43374-3001 | MOLEX5[MolexElectronicsLtd.] | 43374-3001 - Sabre™ Crimp Terminal, Female, With Tin (Sn) Plated Brass Contact, 18-20 AWG, Reel Packaged, without TPA, UL1015 or UL1056 Wire - Molex Electronics Ltd. | 获取价格 | ||
| 0015800605 | MOLEX2[MolexElectronicsLtd.] | 0015800605 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 60 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015800583 | MOLEX2[MolexElectronicsLtd.] | 0015800583 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 58 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015800565 | MOLEX2[MolexElectronicsLtd.] | 0015800565 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 56 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015800523 | MOLEX2[MolexElectronicsLtd.] | 0015800523 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 52 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015800483 | MOLEX2[MolexElectronicsLtd.] | 0015800483 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 48 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015800463 | MOLEX2[MolexElectronicsLtd.] | 0015800463 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 46 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015800383 | MOLEX2[MolexElectronicsLtd.] | 0015800383 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0705430009 | MOLEX8[MolexElectronicsLtd.] | 0705430009 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 24 Circuits1.50μm (59μ") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator - Molex Electronics Ltd. | 获取价格 |
