Si1555DL
Vishay Siliconix
Complementary Low-Threshold MOSFET Pair
FEATURES
PRODUCT SUMMARY
VDS (V)
N-Channel
P-Channel
20
-8
RDS(on) ()
ID (A)
0.385 at VGS = 4.5 V
0.70
0.630 at VGS = 2.5 V
0.54
0.600 at VGS = - 4.5 V
- 0.60
0.850 at VGS = - 2.5 V
- 0.50
1.200 at VGS = - 1.8 V
- 0.42
• TrenchFET® Power MOSFET
• Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
SOT-363
SC-70 (6-LEADS)
S1
1
6
D1
G1
2
5
G2
D2
3
4
S2
RB
XX
YY
Marking Code
Lot Traceability
and Date Code
Part # Code
Top View
Ordering Information: Si1555DL-T1-GE3 (Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
N-Channel
Parameter
Symbol
5s
P-Channel
Steady State
5s
Steady State
Drain-Source Voltage
VDS
20
-8
Gate-Source Voltage
VGS
± 12
±8
Continuous Drain Current (TJ = 150 °C)a
TA = 25 °C
TA = 85 °C
ID
± 0.70
± 0.66
± 0.50
± 0.48
IDM
Pulsed Drain Current
Continuous Source Current (Diode Conduction)a
IS
TA = 25 °C
Maximum Power Dissipationa
TA = 85 °C
Operating Junction and Storage Temperature Range
PD
V
- 0.60
- 0.57
- 0.43
- 0.41
±1
0.25
0.23
- 0.25
- 0.23
0.30
0.27
0.30
0.27
0.16
0.14
0.16
0.14
TJ, Tstg
Unit
- 55 to 150
A
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
t5s
Maximum Junction-to-Ambienta
Steady State
Maximum Junction-to-Foot (Drain)
Steady State
RthJA
RthJF
Typical
Maximum
360
415
400
460
300
350
Unit
°C/W
Note:
a. Surface mounted on 1" x 1" FR4 board.
Document Number: 71079
S13-0631-Rev. F, 25-Mar-13
For technical questions, contact: pmostechsupport@vishay.com
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This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Si1555DL
Vishay Siliconix
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
Parameter
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Static
VGS(th)
Gate Threshold Voltage
IGSS
Gate-Body Leakage
IDSS
Zero Gate Voltage Drain Current
On-State Drain Currenta
Drain-Source On-State
Forward Transconductancea
0.6
1.4
VDS = VGS, ID = - 250 µA
P-Ch
- 0.45
-1
VDS = 0 V, VGS = ± 12 V
N-Ch
± 100
VDS = 0 V, VGS = ± 8 V
P-Ch
± 100
VDS = 20 V, VGS = 0 V
N-Ch
1
P-Ch
-1
VDS = 20 V, VGS = 0 V, TJ = 85 °C
N-Ch
5
VDS = - 8 V, VGS = 0 V, TJ = 85 °C
P-Ch
VDS 5 V, VGS = 4.5 V
N-Ch
1
VDS - 5 V, VGS = - 4.5 V
P-Ch
-1
RDS(on)
gfs
Diode Forward Voltagea
N-Ch
VDS = - 8 V, VGS = 0 V
ID(on)
Resistancea
VDS = VGS, ID = 250 µA
VSD
V
nA
µA
-5
A
VGS = 4.5 V, ID = 0.66 A
N-Ch
0.320
0.385
VGS = - 4.5 V, ID = - 0.57 A
P-Ch
0.510
0.600
VGS = 2.5 V, ID = 0.40 A
N-Ch
0.560
0.630
VGS = - 2.5 V, ID = - 0.48 A
P-Ch
0.720
0.850
VGS = - 1.8 V, ID = - 0.20 A
P-Ch
1.000
1.200
VDS = 10 V, ID = 0.66 A
N-Ch
1.5
VDS = - 4 V, ID = - 0.57 A
P-Ch
1.2
IS = 0.23 A, VGS = 0 V
N-Ch
0.8
1.2
IS = - 0.23 A, VGS = 0 V
P-Ch
- 0.8
- 1.2
N-Ch
0.8
1.2
P-Ch
1.5
2.3
N-Ch
0.06
P-Ch
0.17
N-Ch
0.30
P-Ch
0.16
N-Ch
10
20
P-Ch
6
12
N-Ch
16
30
P-Ch
25
50
N-Ch
10
20
P-Ch
10
20
N-Ch
10
20
P-Ch
10
20
IF = 0.23 A, dI/dt = 100 A/µs
N-Ch
20
40
IF = - 0.23 A, dI/dt = 100 A/µs
P-Ch
20
40
S
V
Dynamicb
Qg
Total Gate Charge
N-Channel
VDS = 10 V, VGS = 4.5 V, ID = 0.66 A
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
td(on)
Turn-On Delay Time
tr
Rise Time
td(off)
Turn-Off Delay Time
tf
Fall Time
Source-Drain Reverse Recovery Time
P-Channel
VDS = - 4 V, VGS = - 4.5 V, ID = - 0.57 A
N-Channel
VDD = 10 V, RL = 20
ID 0.5 A, VGEN = 4.5 V, Rg = 6
P-Channel
VDD = - 4 V, RL = 8
ID - 0.5 A, VGEN = - 4.5 V, Rg = 6
trr
nC
ns
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 71079
S13-0631-Rev. F, 25-Mar-13
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Si1555DL
Vishay Siliconix
N-CHANNEL TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
1.0
1.0
VGS = 5 V thru 2.5 V
0.8
ID - Drain Current (A)
ID - Drain Current (A)
0.8
2V
0.6
0.4
0.6
0.4
TC = 125 °C
0.2
0.2
1.5 V
25 °C
- 55 °C
1V
0.5
1.0
1.5
2.0
2.5
0.0
0.0
3.0
0.5
1.0
1.5
2.0
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
1.0
100
0.8
80
C - Capacitance (pF)
RDS(on) - On-Resistance (Ω)
0.0
0.0
VGS = 2.5 V
0.6
0.4
VGS = 4.5 V
0.2
2.5
Ciss
60
40
Coss
20
Crss
0.0
0.0
0
0.2
0.4
0.6
0.8
1.0
0
12
16
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current
Capacitance
20
1.6
VDS = 10 V
ID = 0.66 A
VGS = 4.5 V
ID = 0.66 A
4
1.4
RDS(on) - On-Resistance
(Normalized)
VGS - Gate-to-Source Voltage (V)
8
ID - Drain Current (A)
5
3
2
1
0
0.0
4
1.2
1.0
0.8
0.2
0.4
0.6
0.8
0.6
- 50
- 25
Qg - Total Gate Charge (nC)
Gate Charge
Document Number: 71079
S13-0631-Rev. F, 25-Mar-13
0
25
50
75
100
125
150
TJ - Junction Temperature (°C)
On-Resistance vs. Junction Temperature
For technical questions, contact: pmostechsupport@vishay.com
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This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Si1555DL
Vishay Siliconix
N-CHANNEL TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
1.0
RDS(on) - On-Resistance (Ω)
IS - Source Current (A)
1
TJ = 150 °C
TJ = 25 °C
0.1
0.0
0.8
ID = 0.66 A
0.6
0.4
0.2
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0
1
2
3
4
5
VSD - Source-to-Drain Voltage (V)
VGS - Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.2
5
0.1
4
0.0
Power (W)
VGS(th) Variance (V)
ID = 250 µA
- 0.1
3
2
- 0.2
1
- 0.3
- 0.4
- 50
- 25
0
25
50
75
100
125
0
10-3
150
10-2
10-1
1
10
TJ - Junction Temperature (°C)
Time (s)
Threshold Voltage
Single Pulse Power
100
600
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 400 °C/W
3. TJM − TA = PDMZthJA(t)
Single Pulse
0.01
10-4
10
-3
4. Surface Mounted
10
-2
-1
1
10
Square Wave Pulse Duration (s)
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Ambient
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Document Number: 71079
S13-0631-Rev. F, 25-Mar-13
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Si1555DL
Vishay Siliconix
N-CHANNEL TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10-4
10-3
10-2
10-1
Square Wave Pulse Duration (s)
1
10
Normalized Thermal Transient Impedance, Junction-to-Foot
P-CHANNEL TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
1.0
1.0
2V
VGS = 5 V thru 2.5 V
TC = - 55 °C
0.8
ID - Drain Current (A)
ID - Drain Current (A)
0.8
0.6
1.5 V
0.4
0.2
25 °C
125 °C
0.6
0.4
0.2
1V
0.0
0.0
0.5
1.0
1.5
2.0
2.5
0.0
0.0
3.0
0.5
VDS - Drain-to-Source Voltage (V)
Output Characteristics
2.0
2.5
160
VGS = 1.8 V
1.5
1.0
Ciss
120
C - Capacitance (pF)
RDS(on) - On-Resistance (Ω)
1.5
Transfer Characteristics
2.0
VGS = 2.5 V
VGS = 4.5 V
80
Coss
40
0.5
0.0
0.0
1.0
VGS - Gate-to-Source Voltage (V)
Crss
0
0.2
0.4
0.6
0.8
1.0
0
2
4
6
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current
Capacitance
Document Number: 71079
S13-0631-Rev. F, 25-Mar-13
For technical questions, contact: pmostechsupport@vishay.com
8
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This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Si1555DL
Vishay Siliconix
P-CHANNEL TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
1.6
VGS = 4.5 V
ID = 0.57 A
VDS = 4 V
ID = 0.57 A
1.4
4
RDS(on) - On-Resistance
(Normalized)
VGS - Gate-to-Source Voltage (V)
5
3
2
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0.6
- 50
1.6
0
25
50
75
100
125
TJ - Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
150
2.0
RDS(on) - On-Resistance (Ω)
IS - Source Current (A)
TJ = 150 °C
TJ = 25 °C
1.5
ID = 0.57 A
1.0
0.5
0.0
0.2
0.4
0.6
0.8
1.0
0
1.2
1
2
3
4
5
VSD - Source-to-Drain Voltage (V)
VGS - Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.4
5
0.3
4
ID = 250 µA
0.2
Power (W)
VGS(th) Variance (V)
- 25
Qg - Total Gate Charge (nC)
1
0.1
0.0
1.0
0.8
1
0
0.0
1.2
0.1
3
2
0.0
1
- 0.1
- 0.2
- 50
- 25
0
25
50
75
100
125
150
0
10-3
10-2
TJ - Junction Temperature (°C)
Threshold Voltage
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10-1
1
10
100
600
Time (s)
Single Pulse Power
Document Number: 71079
S13-0631-Rev. F, 25-Mar-13
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Si1555DL
Vishay Siliconix
P-CHANNEL TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 400 °C/W
3. TJM - TA = PDMZthJA(t)
4. Surface Mounted
Single Pulse
0.01
10-4
10-3
10-2
10-1
1
Square Wave Pulse Duration (s)
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10-4
10-3
10-2
10-1
Square Wave Pulse Duration (s)
1
10
Normalized Thermal Transient Impedance, Junction-to-Foot
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Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?71079.
Document Number: 71079
S13-0631-Rev. F, 25-Mar-13
For technical questions, contact: pmostechsupport@vishay.com
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THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 01-Jan-2022
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Document Number: 91000