TPCA8003-H
TOSHIBA Field Effect Transistor Silicon N-Channel MOS Type (Ultra-High-Speed U-MOSIII)
TPCA8003-H
High Efficiency DC/DC Converter Applications
Notebook PC Applications
Unit: mm
1.27
0.5±0.1
Portable Equipment Applications
0.4±0.1
•
High speed switching
•
Small gate charge: QSW = 8.4 nC (typ.)
5.0±0.2
Small footprint due to a small and thin package
6.0±0.3
•
0.15±0.05
4
1
•
High forward transfer admittance: |Yfs| = 60S (typ.)
•
Low leakage current: IDSS = 10 µA (max) (VDS = 30 V)
•
Enhancement mode: Vth = 1.1 to 2.3 V (VDS = 10 V, ID = 1 mA)
A
0.166±0.05
0.95±0.05
0.05 S
S
1
4
4.25±0.2
Absolute Maximum Ratings (Ta = 25°C)
8
Characteristic
Symbol
Rating
Unit
Drain-source voltage
VDSS
30
V
Drain-gate voltage (RGS = 20 kΩ)
VDGR
30
V
Gate-source voltage
VGSS
±20
V
(Note 1)
ID
35
Pulsed (Note 1)
IDP
105
PD
45
W
PD
2.8
W
PD
1.6
W
EAS
159
mJ
IAR
35
A
EAR
4.5
mJ
Channel temperature
Tch
150
°C
Storage temperature range
Tstg
−55 to 150
°C
DC
Drain current
Drain power dissipation
(Tc=25℃)
Drain power dissipation
(t = 10 s)
(Note 2a)
Drain power dissipation
(t = 10 s)
(Note 2b)
Single-pulse avalanche energy
(Note 3)
Avalanche current
Repetitive avalanche energy
(Tc=25℃) (Note 4)
A
1.1±0.2
3.5±0.2
Low drain-source ON-resistance: RDS (ON) = 5.1 mΩ (typ.)
0.595
5.0±0.2
0.6±0.1
•
0.05 M A
5
8
5 0.8±0.1
1,2,3:SOURCE
5,6,7,8:DRAIN
4:GATE
JEDEC
―
JEITA
―
TOSHIBA
2-5Q1A
Weight: 0.069 g (typ.)
Circuit Configuration
8
7
6
5
1
2
3
4
Note: For Notes 1 to 4, refer to the next page.
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate
reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and
Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
This transistor is an electrostatic-sensitive device. Handle with care.
1
2006-11-16
TPCA8003-H
Thermal Characteristics
Characteristic
Thermal resistance, channel to case
(Tc=25℃)
Thermal resistance, channel to ambient
(t = 10 s)
(Note 2a)
Thermal resistance, channel to ambient
(t = 10 s)
(Note 2b)
Symbol
Max
Unit
Rth (ch-c)
2.78
°C/W
Rth (ch-a)
44.6
°C/W
Rth (ch-a)
78.1
°C/W
Marking (Note 5)
TPCA
8003-H
Type
※
Lot No.
Note 1: The channel temperature should not exceed 150°C during use.
Note 2: (a) Device mounted on a glass-epoxy board (a)
(b) Device mounted on a glass-epoxy board (b)
FR-4
25.4 × 25.4 × 0.8
(Unit: mm)
FR-4
25.4 × 25.4 × 0.8
(Unit: mm)
(a)
(b)
Note 3: VDD = 24 V, Tch = 25°C (initial), L = 0.1 mH, RG = 25 Ω, IAR = 35 A
Note 4: Repetitive rating: pulse width limited by max. channel temperature
Note 5: * Weekly code: (Three digits)
Week of manufacture
(01 for first week of year, continuing up to 52 or 53)
Year of manufacture
(The last digit of the calendar year)
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2006-11-16
TPCA8003-H
Electrical Characteristics (Ta = 25°C)
Characteristic
Symbol
Test Condition
Min
Typ.
Max
Unit
Gate leakage current
IGSS
VGS = ±16 V, VDS = 0 V
⎯
⎯
±10
µA
Drain cutoff current
IDSS
VDS = 30 V, VGS = 0 V
⎯
⎯
10
µA
V (BR) DSS
ID = 10 mA, VGS = 0 V
30
⎯
⎯
V (BR) DSX
ID = 10 mA, VGS = −20 V
15
⎯
⎯
VDS = 10 V, ID = 1 mA
1.1
⎯
2.3
VGS = 4.5 V, ID = 18 A
⎯
7.3
9.5
VGS = 10 V, ID = 18 A
⎯
5.1
6.6
VDS = 10 V, ID = 18 A
30
60
⎯
⎯
1465
⎯
VDS = 10 V, VGS = 0 V, f = 1 MHz
⎯
175
⎯
⎯
610
⎯
⎯
4
⎯
⎯
11
⎯
Drain-source breakdown voltage
Gate threshold voltage
Vth
Drain-source ON-resistance
RDS (ON)
Forward transfer admittance
|Yfs|
Input capacitance
Ciss
Reverse transfer capacitance
Crss
Output capacitance
Coss
tr
Turn-on time
ton
4.7 Ω
Switching time
Fall time
toff
10
⎯
Duty <
= 1%, tw = 10 µs
⎯
36
⎯
Total gate charge
(gate-source plus gate-drain)
Qg
VDD ∼
− 24 V, VGS = 10 V, ID = 35 A
⎯
25
⎯
Gate-source charge 1
Qgs1
Gate-drain (“Miller”) charge
Qgd
Gate switch charge
QSW
VDD ∼
− 15 V
VDD ∼
− 24 V, VGS = 5 V, ID = 35 A
VDD ∼
− 24 V, VGS = 10 V, ID = 35 A
V
mΩ
S
pF
ns
⎯
tf
Turn-off time
ID = 18 A
VOUT
VGS 10 V
0V
RL =0.83Ω
Rise time
V
⎯
13
⎯
⎯
5.8
⎯
⎯
5.1
⎯
⎯
8.4
⎯
nC
Source-Drain Ratings and Characteristics (Ta = 25°C)
Characteristic
Drain reverse current
Forward voltage (diode)
Pulse
(Note 1)
Symbol
Test Condition
Min
Typ.
Max
Unit
IDRP
⎯
⎯
⎯
105
A
⎯
⎯
−1.2
V
VDSF
IDR = 35 A, VGS = 0 V
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2006-11-16
TPCA8003-H
ID – VDS
ID – VDS
10
8
Drain current ID (A)
40
6
5
4.5
4
3.6
3.8
100
Common source
Ta = 25°C
Pulse test
Drain current ID (A)
50
3.4
3.2
30
20
3
10
2.8
10
8
6
5
4.5
Common source
Ta = 25°C
Pulse test
4
4.1
3.8
80
3.6
60
3.4
40
3.2
3
20
2.8
VGS = 2.6V
0
0
0.2
0.4
0.6
0.8
Drain-source voltage VDS
VGS = 2.6V
0
0
1
(V)
1
2
Drain-source voltage VDS (V)
Drain current ID (A)
80
60
40
Ta = −55°C
100
25
0
0
1
2
4
3
Gate-source voltage
5
0.32
0.24
ID = 35 A
0.16
18
0.08
9
6
VGS (V)
2
4
Gate-source voltage
6
8
10
VGS (V)
RDS (ON) – ID
100
Drain-source ON-resistance
RDS (ON) (mΩ)
(S)
⎪Yfs⎪ – ID
Forward transfer admittance |Yfs|
(V)
Common source
Ta = 25°C
Pulse test
0
0
1000
100
Ta = −55°C
100
10
25
1
Common source
VDS = 10 V
Pulse test
0.1
0.1
5
VDS – VGS
0.4
Common source
VDS = 10 V
Pulse test
20
4
Drain-source voltage VDS
ID – VGS
100
3
1
10
Common source
Ta = 25°C
Pulse test
10
4.5
VGS = 10 V
1
0.1
100
Drain current ID (A)
1
10
100
Drain current ID (A)
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2006-11-16
TPCA8003-H
RDS (ON) – Ta
IDR – VDS
20
1000
Common source
Common source
Ta = 25°C
(A)
16
Pulse test
Drain reverse current IDR
Drain-source ON-resistance
RDS (ON) (mΩ)
Pulse test
ID = 35A
18
12
9
8
VGS = 4.5 V
ID = 35A,18A,9A
4
VGS = 10 V
0
−80
−40
0
40
80
Ambient temperature
120
Ta
100
10
3
10
1
1
VGS = 0 V
0.1
0
160
4.5
(°C)
−0.4
−0.2
Capacitance – VDS
−1.0
(V)
Vth – Ta
2.5
(V)
Ciss
Gate threshold voltage Vth
(pF)
Capacitance C
−0.8
Drain-source voltage VDS
10000
1000
Coss
100
−0.6
Common source
Crss
VGS = 0 V
f = 1 MHz
Ta = 25°C
10
0.1
1
10
1.5
1
Common source
0.5
(V)
VDS = 10 V
ID = 1 mA
Pulse test
0
−80
100
Drain-source voltage VDS
2
−40
0
40
Ambient temperature
80
Ta
120
160
(°C)
Dynamic input/output
characteristics
50
20
16
VDD = 6 V
Pulse test
12
30
12
VDS
24
20
VGS
10
0
0
8
8
16
4
24
Total gate charge Qg
32
(V)
ID = 35 A
40 Ta = 25°C
Gate-source voltage VGS
Drain-source voltage VDS
(V)
Common source
0
40
(nC)
5
2006-11-16
TPCA8003-H
(1) Device mounted on a glass-epoxy board (a)
(Note 2a)
(2)
(2) Device mounted on a glass-epoxy board (b)
100
(Note 2b)
(1)
(3) Tc=25℃
Transient thermal impedance
rth (°C/W)
rth – tw
1000
10
(3)
1
Single - pulse
0.1
0.001
0.01
0.1
1
Pulse width
10
100
PD – Ta
3
PD – Tc
(Note 2a)
(W)
(1)
(2)Device mounted on a
glass-epoxy board(b)
(Note 2b)
Drain power dissipation PD
(W)
Drain power dissipation PD
2
50
(1)Device mounted on a
glass-epoxy board(a)
2.5
t=10s
(2)
1.5
1
0.5
0
0
40
1000
tw (s)
80
120
Ambient temperature Ta
40
30
20
10
0
160
(°C)
0
40
80
Case temperature
120
TC
160
(°C)
Safe operating area
Drain current ID (A)
1000
ID max (Pulse) *
100
t=1ms *
10ms *
ID max (Continuous)
10
DC Operation
Tc = 25℃
* Single - pulse
1
Ta = 25℃
Curves must be derated
linearly with increase in
VDSS max
temperature.
0.1
0.1
1
10
Drain-source voltage VDS
100
(V)
6
2006-11-16
TPCA8003-H
7
2006-11-16
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