找到“apl5308 33bc”相关的规格书共50,288个
| 型号 | 厂商 | 描述 | 数据手册 | 替代料 | 参考价格 |
|---|---|---|---|---|---|
| BC857AW | SECOS[SeCoSHalbleitertechnologieGmbH] | BC857AW - BC856AW - SeCoS Halbleitertechnologie GmbH | 获取价格 | ||
| BC 53,6 BS U11 KMGY | Phoenix Contact | PHOENIX CONTACT - BC 53,6 BS U11 KMGY - Keying Tab, Electronic Component Housings, BC Series | 获取价格 | ||
| 907-33-1-12-2-B-0 | wakefield engineering inc | HEATSINKELLIPFIN33X33MMCLIP | 获取价格 | ||
| ATS-MG330-R0 | Advanced Thermal Solutions Inc. | MAXIGRIPCLIPKIT33X33MM | 获取价格 | ||
| 907-33-1-28-2-B-0 | wakefield engineering inc | HEATSINKELLIPFIN33X33MMCLIP | 获取价格 | ||
| 907-33-2-23-2-B-0 | wakefield engineering inc | HEATSINKPINFIN33X33MMCLIP | 获取价格 | ||
| 907-33-2-28-2-B-0 | wakefield engineering inc | HEATSINKPINFIN33X33MMCLIP | 获取价格 | ||
| 3-1393248-3 | TE Connectivity Ltd | W33-T1N1Q-15=W33 | 获取价格 | ||
| 907-33-1-21-2-B-0 | wakefield engineering inc | HEATSINKELLIPFIN33X33MMCLIP | 获取价格 | ||
| 907-33-2-21-2-B-0 | wakefield engineering inc | HEATSINKPINFIN33X33MMCLIP | 获取价格 | ||
| 907-33-2-18-2-B-0 | wakefield engineering inc | HEATSINKPINFIN33X33MMCLIP | 获取价格 | ||
| 907-33-1-15-2-B-0 | wakefield engineering inc | HEATSINKELLIPFIN33X33MMCLIP | 获取价格 | ||
| BC858AW | SECOS[SeCoSHalbleitertechnologieGmbH] | BC858AW - BC856AW - SeCoS Halbleitertechnologie GmbH | 获取价格 | ||
| T15-BCF2 | Hakko Development Co., Ltd. | SOLDERING TIP SHAPE-2BC TINNED S | 获取价格 | ||
| T15-BCF3 | Hakko Development Co., Ltd. | SOLDERING TIP SHAPE-3BC TINNED S | 获取价格 | ||
| VJ1812Y224KXPTW1BC | Vishay Intertechnology, Inc. | VJ1812Y224KXPTW1BC | 获取价格 | ||
| VJ1812Y104MXPTW1BC | Vishay Intertechnology, Inc. | VJ1812Y104MXPTW1BC | 获取价格 | ||
| BC817K40WH6327 | Infineon Technologies | BC817K40WH6327 | 获取价格 | ||
| BC637_11 | ONSEMI[ONSemiconductor] | BC637_11 - High Current Transistors - ON Semiconductor | 获取价格 | ||
| BC637G | ONSEMI[ONSemiconductor] | BC637G - High Current Transistors - ON Semiconductor | 获取价格 |
