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FDMA420NZ

FDMA420NZ

  • 厂商:

    FAIRCHILD(仙童半导体)

  • 封装:

  • 描述:

    FDMA420NZ - Single N-Channel 2.5V Specified PowerTrench MOSFET 20V, 5.7A, 30mΩ - Fairchild Semicondu...

  • 数据手册
  • 价格&库存
FDMA420NZ 数据手册
FDMA420NZ Single N-Channel 2.5V Specified PowerTrench® MOSFET September 2006 FDMA420NZ Single N-Channel 2.5V Specified 20V, 5.7A, 30mΩ General Description This Single N-Channel MOSFET has been designed using Fairchild Semiconductor’s advanced Power Trench process to optimize the RDS(on) @VGS=2.5V on special MicroFET leadframe. PowerTrench® MOSFET Features RDS(on) = 30mΩ @ VGS = 4.5 V, ID = 5.7A RDS(on) = 40mΩ @ VGS = 2.5 V, ID = 5.0A tm Applications Li-lon Battery Pack Low Profile-0.8mm maximum-in the new package MicroFET 2x2 mm RoHS Compliant Pin 1 D D G Source S D D 4 3 Drain G D D 5 2 6 1 D D S Bottom Drain Contact MicroFET Bottom View 2X2 Absolute Maximum Ratings TA = 25°C unless otherwise noted Symbol VDSS VGSS ID PD TJ, TSTG Parameter Drain-Source Voltage Gate-Source Voltage Drain Current -Continuous -Pulsed (Note 1a) (Note 1a) (Note 1b) Ratings 20 ±12 5.7 24 0.9 2.4 -55 to +150 Units V V A W o Power dissipation (Steady State) Operating and Storage Junction Temperature Range C Thermal Characteristics RθJA RθJA Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Ambient (Note 1a) (Note 1b) 145 52 o C/W Package Marking and Ordering Information Device Marking 420 Device FDMA420NZ Reel Size 7” 1 Tape Width 12mm Quantity 3000 units www.fairchildsemi.com ©2006 Fairchild Semiconductor Corporation FDMA420NZ Rev B1 FDMA420NZ Single N-Channel 2.5V specified PowerTrench® MOSFET Electrical Characteristics TJ = 25°C unless otherwise noted Symbol Parameter Test Conditions Min Typ Max Units Off Characteristics BVDSS ∆BVDSS ∆TJ IDSS IGSS Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate-Body Leakage VGS = 0V , ID = 250µA ID = 250µA, Referenced to 25°C VDS = 16V, VGS = 0V, VGS = ±12V, VDS = 0V 20 12 1 ±10 V mV/°C µA µA On Characteristics (Note 2) VGS(th) ∆VGS(th) ∆TJ Gate Threshold Voltage Gate Threshold Voltage Temperature Coefficient VDS = VGS, ID = 250µA ID = 250µA, Referenced to 25°C VGS = 4.5V, ID = 5.7A VGS = 4.0V, ID = 5.7A RDS(ON) Static Drain-Source On-Resistance VGS = 3.1V, ID = 5.0A VGS = 2.5V, ID = 5.0A VGS = 4.5V, TJ =150°C gFS Forward Transconductance VDS = 5V, ID = 5.7A, ID = 5.7A 0.6 0.83 -3.1 16.8 17.3 18.9 21.2 24.8 28.3 30 31 33 40 44 S mΩ 1.5 V mV/°C Dynamic Characteristics Ciss Coss Crss RG Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance VDS = 10V, VGS = 0V, f = 1.0MHz f = 1.0MHz 701 163 125 1.92 935 220 190 pF pF pF Ω Switching Characteristics (Note 2) td(on) tr td(off) tf Qg Qgs Qgd Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge VDS = 10V, ID = 5.7A, VGS = 4.5V VDD = 10V, ID = 1A VGS = 4.5V, RGEN = 6Ω 9.8 8.6 21.5 8.6 8.8 0.9 2.4 20 18 43 18 12 2 4 ns ns ns ns nC nC nC Drain-Source Diode Characteristics and Maximum Ratings IS VSD trr Qrr Notes: 1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. a. 145°C/W when mounted on a minimum pad of 2 oz copper. b. 52°C/W when mounted on a 1 in2 pad of 2 oz copper. 2. Pulse Test: Pulse Width < 300 µs, Duty Cycle < 2.0%. 3. The diode connected between the gate and the source serves only as proection against ESD. No gate overvoltage rating is implied. Maximum Continuous Drain-Source Diode Forward Current Drain-Source Diode Forward Voltage Diode Reverse Recovery Time Diode Reverse Recovery Charge VGS = 0V, IS = 2.0A IF = 5.7A, di/dt = 100A/µs 0.69 2.0 1.2 20 5 A V ns nC 2 FDMA420NZ Rev B1 www.fairchildsemi.com FDMA420NZ Single N-Channel 2.5V specified PowerTrench® MOSFET Typical Characteristics TJ = 25°C unless otherwise noted PULSE DURATION = 300µs DUTY CYCLE = 2.0%MAX VGS = 4.5V VGS = 3.5V VGS = 3.0V VGS = 2.0V VGS = 1.5V VGS = 2.5V NORMALIZED DRAIN TO SOURCE ON-RESISTANCE 50 45 ID, DRAIN CURRENT (A) 2.1 PULSE DURATION = 300µS DUTY CYCLE = 2.0%MAX 40 35 30 25 20 15 10 5 0 0 1 1.8 VGS = 2.0V VGS = 3.0V VGS = 2.5V 1.5 VGS = 3.5V 1.2 VGS = 4.5V 2 3 4 0.9 10 20 30 40 50 VDS, DRAIN-SOURCE VOLTAGE (V) ID, DRAIN CURRENT(A) Figure 1. On Region Characteristics Figure 2. On-Resistance vs Drain Current and Gate Voltage 60 RDS(ON), DRAIN TO SOURCE ON-RESISTANCE (mΩ) NORMALIZED DRAIN TO SOURCE ON-RESISTANCE 1.6 1.4 1.2 1.0 0.8 0.6 -80 ID = 5.7A VGS = 4.5V 50 40 30 20 10 PULSE DURATION = 300µS DUTY CYCLE = 2.0%MAX ID = 2.8A TJ = 125oC TJ = 25oC -40 0 40 80 120 160 1 TJ, JUNCTION TEMPERATURE (oC) 2 3 4 VGS, GATE TO SOURCE VOLTAGE (V) 5 Figure 3. Normalized On Resistance vs Junction Temperature 30 ID, DRAIN CURRENT (A) 25 20 15 10 5 0 0.5 PULSE DURATION = 300µs DUTY CYCLE = 2.0%MAX Figure 4. On-Resistance vs Gate to Source Votlage 100 IS, REVERSE DRAIN CURRENT (A) 10 1 0.1 0.01 1E-3 1E-4 0.2 VGS = 0V VDS = 5V TJ = 125oC TJ = 25oC TJ = -55oC TJ = 125oC TJ = 25oC TJ = -55oC 1.0 1.5 2.0 2.5 0.4 0.6 0.8 1.0 1.2 1.4 VGS, GATE TO SOURCE VOLTAGE (V) VSD, BODY DIODE FORWARD VOLTAGE (V) Figure 5. Transfer Characteristics Figure 6. Source to Drain Diode Forward Voltage vs Source Current 3 www.fairchildsemi.com FDMA420NZ Rev B1 FDMA420NZ Single N-Channel 2.5V specified PowerTrench® MOSFET Typical Characteristics TJ = 25°C unless otherwise noted VGS, GATE TO SOURCE VOLTAGE(V) 5 4 3 2 1 0 VDS = 15V VDS = 20V VDS = 25V 2000 1000 CAPACITANCE (pF) Ciss Coss 100 50 0.1 f = 1MHz VGS = 0V Crss 0 2 4 6 Qg, GATE CHARGE(nC) 8 10 12 1 10 VDS, DRAIN TO SOURCE VOLTAGE (V) 30 Figure 7. Gate Charge Characteristics 100 Figure 8. Capacitance vs Drain to Source Voltage 6 ID, DRAIN CURRENT (A) ID, DRAIN CURRENT (A) 10us 5 4 3 2 1 0 25 VGS = 4.5V 10 100us 1ms OPERATION IN THIS AREA MAY BE LIMITED BY RDS(ON) SINGLE PULSE TJ=MAX RATED TA=25oC 1 10ms 100ms 1s 10s DC VGS = 2.5V 0.1 0.01 0.1 1 10 VDS, DRAIN TO SOURCE VOLTAGE (V) 50 50 75 100 125 TA, AMBIENT TEMPERATURE(oC) 150 Figure 9. Forward Bias Safe Operating Area 200 P(PK), PEAK TRANSIENT POWER (W) Figure 10. Maximum Continuous Drain Current vs Ambient Temperature TA = 25oC FOR TEMPERATURES ABOVE 25oC DERATE PEAK CURRENT AS FOLLOWS: I= I 25 A -------------------125 150 – T 100 VGS = 10V 10 SINGLE PULSE 1 0.5 -4 10 10 -3 10 -2 10 t, PULSE WIDTH (s) -1 10 0 10 1 10 2 10 3 Figure 11. Single Pulse Maximum Power Dissipation 4 FDMA420NZ Rev B1 www.fairchildsemi.com FDMA420NZ Single N-Channel 2.5V specified PowerTrench® MOSFET Typical Characteristics TJ = 25°C unless otherwise noted 2 DUTY CYCLE-DESCENDING ORDER D = 0.5 0.2 0.1 0.05 0.02 0.01 1 Normalized Thermal Impedance, ZθJA PDM 0.1 t1 t2 NOTES: DUTY FACTOR: D = t1/t2 PEAK TJ = PDM x ZθJA x RθJA + TA RθJA = 145oC SINGLE PULSE 0.01 -4 10 10 -3 10 -2 10 -1 10 0 10 1 10 2 10 3 t, RECTANGULAR PULSE DURATION(s) Figure 12. Transient Thermal Response Curve 5 FDMA420NZ Rev B1 www.fairchildsemi.com FDMA420NZ Single N-Channel 2.5V specified PowerTrench® MOSFET Dimensional Outline and Pad Layout NOTES: A. NOT FULLY CONFORM TO JEDEC REGISTRATION MO-229 DATED AUG/2003. B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCES PER ASMEY14.5M,1994 MLP06LrevA 6 FDMA420NZ Rev B1 www.fairchildsemi.com FDMA420NZ Single N-Channel 2.5V specified PowerTrench® MOSFET TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. FACT Quiet Series™ GlobalOptoisolator™ GTO™ HiSeC™ I2C™ i-Lo™ ImpliedDisconnect™ IntelliMAX™ ISOPLANAR™ LittleFET™ MICROCOUPLER™ MicroFET™ MicroPak™ MICROWIRE™ MSX™ MSXPro™ Across the board. Around the world.™ The Power Franchise® Programmable Active Droop™ ACEx™ ActiveArray™ Bottomless™ Build it Now™ CoolFET™ CROSSVOLT™ DOME™ EcoSPARK™ E2CMOS™ EnSigna™ FACT™ FAST® FASTr™ FPS™ FRFET™ OCX™ OCXPro™ OPTOLOGIC® OPTOPLANAR™ PACMAN™ POP™ Power247™ PowerEdge™ PowerSaver™ PowerTrench® QFET® QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ RapidConnect™ µSerDes™ ScalarPump™ SILENT SWITCHER® SMART START™ SPM™ Stealth™ SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TCM™ TinyBoost™ TinyBuck™ TinyPWM™ TinyPower™ TinyLogic® TINYOPTO™ TruTranslation™ UHC™ UniFET™ UltraFET® VCX™ Wire™ DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Datasheet Identification Advance Information Product Status Formative or In Design First Production Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Preliminary No Identification Needed Full Production Obsolete Not In Production Rev. I20 7 FDMA420NZ Rev B1 www.fairchildsemi.com
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