ECMF04-4HSWM10

ECMF04-4HSWM10 Datasheet Common mode filter with ESD protection for high speed serial interface Features • • QFN-10L 2.6 x 1.35 x 0.5 D1+ Con 1 10 D1+ IC D1- Con 2 9 D1- IC GND 3 8 GND D2+ Con 4 7 D2+ IC D2- Con 5 6 D2- IC Product status link ECMF04-4HSWM10 Product summary Order code ECMF04-4HSWM10 • • • • • • Very large differential bandwidth to comply with HDMI Full HD, MIPI, USB2.0, USB3.2 Gen 1, Display Port and other high speed serial interfaces High common mode attenuation on WLAN frequencies: – 28 dB at 2.4 GHz and -16 dB at 5.0 GHz Very good attenuation at LTE, GSM and GPS frequencies Large bandwidth: 4.2 GHz Low PCB space consumption Thin package for compact applications: 0.55 mm max. High reduction of parasitic elements through integration RoHS package Exceed the following standards • IEC 61000-4-2, level 4: – ±15 kV (air discharge) – ±8 kV (contact discharge) Applications • • • • Mobile phones Notebook, laptop Portable devices PND Description The ECMF04-4HSWM10 is a highly integrated common mode filter designed to suppress EMI/RFI common mode noise on high speed differential serial buses like HDMI Full HD, MIPI, Display Port and other high speed serial interfaces. The device has a very large differential bandwidth to comply with these standards and can protect and filter two differential lanes. DS10228 - Rev 3 - March 2021 For further information contact your local STMicroelectronics sales office. www.st.com ECMF04-4HSWM10 Characteristics 1 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value Unit Contact discharge 8 kV Air discharge 16 IEC 61000-4-2: VPP Peak pulse voltage IRMS Maximum RMS current Top Operating ambient temperature range Tj 100 -55 to +125 Maximum junction temperature Tstg mA 125 Storage temperature range °C -55 to +150 Figure 1. Electrical characteristics (definitions) I VRM VCL IRM IPP VBR Maximum stand-off voltage Clamping voltage at peak pulse current IPP Leakage current at VRM Peak pulse current Breakdown voltage RDC DC serial resistance fC Differential cut off frequency IPP IR IRM V VRM VBR VCL Table 2. Electrical characteristics (Tamb = 25 °C) Symbol Test conditions VBR IR = 1 mA IRM VRM = 3 V per line RDC DC serial resistance fC Min. Typ. 4.5 5.5 Max. V 100 -3 dB differential mode cut-off frequency Unit nA 5 Ω 4.2 GHz Table 3. Pin description DS10228 - Rev 3 Pin number Description Pin number Description 1 D1+ to connector 6 D2- to IC 2 D1- to connector 7 D2+ to IC 3 GND 8 GND 4 D2+ to connector 9 D1- to IC 5 D2- to connector 10 D1+ to IC page 2/14 ECMF04-4HSWM10 Characteristics (curves) 1.1 Characteristics (curves) Figure 2. Differential attenuation versus frequency (Z0_DIFF = 100 Ω) SDD21(dB) Figure 3. Common mode attenuation versus frequency (Z0_COM = 50 Ω) SCC21(dB) f(Hz) f(Hz) Figure 4. ESD response to IEC61000-4-2 (+8 kV contact discharge) Figure 5. ESD response to IEC61000-4-2 (-8 kV contact discharge) Figure 6. HDMI2.0 - 5.94 Gbps eye diagram without device (with worst cable and equalizer) Figure 7. HDMI2.0 - 5.94 Gbps eye diagram with device (with worst cable and equalizer) DS10228 - Rev 3 page 3/14 ECMF04-4HSWM10 Characteristics (curves) Figure 8. HDMI1.4 3.35 Gbps eye diagram without ECMF04-4HSWM10 Figure 9. HDMI1.4 3.35 Gbps eye diagram with ECMF04-4HSWM10 Figure 10. USB3.2 Gen 1 5.0 Gbps eye diagram without ECMF04-4HSWM10 (with worst cable and equalizer) Figure 11. USB3.2 Gen 1 5.0 Gbps eye diagram with ECMF04-4HSWM10 (with worst cable and equalizer) Figure 12. MIPI D-PHY 2.5 Gbps long reference channel eye diagram without ECMF04-4HSWM10 Figure 13. MIPI D-PHY 2.5 Gbps long reference channel eye diagram with ECMF04-4HSWM10 DS10228 - Rev 3 page 4/14 ECMF04-4HSWM10 Characteristics (curves) Figure 14. TDR Figure 15. Differential an common mode impedance versus frequency Z(Ω) ZCOM ZDIFF f(Hz) DS10228 - Rev 3 page 5/14 ECMF04-4HSWM10 Application information 2 Application information Figure 16. HDMI schematic ECMF04 D0 ECMF04 HDMI A SIC D2 HEA C- HEA C+ HPD Clock UTIL ITY HDMI c o n n ec t o r D1 SDA HDP_IC SCL SDA_IC GND SCL_IC GND CEC_IC CEC VDD_CEC VDD_IC VDD_CFC_IC VDD_5V 5V_OUT FAULT HDMI2C1-6C1 More application information available in following AN: • AN4356: "Antenna desense on handheld equipment" • AN4511: "Common mode filters" • AN4540: "MHL link filtering and protection" DS10228 - Rev 3 page 6/14 ECMF04-4HSWM10 Package information 3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 3.1 QFN-10L package information Figure 17. QFN10L package outline E D A1 A TOP VIEW SIDE VIEW e L b DS10228 - Rev 3 page 7/14 ECMF04-4HSWM10 QFN10L package information Table 4. QFN10L package mechanical data Dimensions Millimeters Ref. Min. Typ. Max. A 0.45 0.50 0.55 A1 0.00 0.02 0.05 b 0.15 0.20 0.25 D 2.55 2.60 2.65 E 1.30 1.35 1.40 e L 0.50 0.40 0.50 0.60 Figure 18. Footprint recommendations (mm) DS10228 - Rev 3 page 8/14 ECMF04-4HSWM10 PCB assembly recommendations 4 PCB assembly recommendation Figure 19. Recommended PCB layout Host 170 µm Connector 170 µm Differential lanes (Z0 = 100 ) Pad layout 5000 µm 150 µm 350 µm 350 µm Differential lanes (Z0 = 100 ) 330 µm Figure 20. PCB stack dimensions 40 µm 105 µm εr = 4.28 4.1 Solder paste 1. 2. 3. 4. DS10228 - Rev 3 Halide-free flux qualification ROL0 according to ANSI/J-STD-004. “No clean” solder paste is recommended. Offers a high tack force to resist component movement during high speed. Use solder paste with fine particles: powder particle size is 20-38 μm. page 9/14 ECMF04-4HSWM10 QFN-10L packing information 4.2 QFN-10L packing information Figure 22. Package orientation in reel Figure 21. Marking XX Pin 1 located according to EIA-481 Note: Dot indicates pin 1 XX: Marking Pocket dimensions are not on scale Pocket shape may vary depending on package Figure 23. Tape and reel orientation Figure 24. Reel dimensions (mm) Ø 180 max 14.4 2±0.5 Ø 13 Ø 60 Ø 20.2 min Figure 25. Inner box dimensions (mm) 30 205 205 DS10228 - Rev 3 page 10/14 ECMF04-4HSWM10 Solder reflow Figure 26. Tape and reel outline 4.3 Solder reflow Figure 27. ST ECOPACK® recommended soldering reflow profile for PCB mounting 250 240-245 °C Temperature (°C) -2 °C/s 2 - 3 °C/s 60 sec (90 m ax) 200 -3 °C/s 150 -6 ° C/s 100 0.9 °C/s 50 Time (s) 0 Note: DS10228 - Rev 3 30 60 90 120 150 180 210 240 270 300 Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020. page 11/14 ECMF04-4HSWM10 Ordering information 5 Ordering information Figure 28. Ordering information scheme ECMF 04 – 4 HS W M10 Function Common mode filter with ESD protection Number if lines 04 = 4 filtered lines Number of ESD protected lines 4 lines with ESD protection Version HS = High Speed Application WLAN 2.4 GHz Package M10: µQFN-10L Order code Marking Package Weight Base qty. Delivery mode ECMF04-4HSWM10 KW(1) µQFN-10L 5 mg 3000 Tape and reel 1. The marking can be rotated by 90° to differentiate assembly location DS10228 - Rev 3 page 12/14 ECMF04-4HSWM10 Revision history Table 5. Document revision history DS10228 - Rev 3 Date Version Changes 10-Jun-2014 1 Initial release. 08-Jan-2018 2 Updated Table 1. 16-Mar-2021 3 Updated Figure 8 and Figure 9. Added Figure 10, Figure 11 and Figure 15. page 13/14 ECMF04-4HSWM10 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2021 STMicroelectronics – All rights reserved DS10228 - Rev 3 page 14/14