STPS2L25AFN

STPS2L25 Datasheet 25 V, 2 A low drop power Schottky rectifier Features • • • • Very low forward voltage drop for less power dissipation Optimized conduction/reverse losses trade-off which means the highest efficiency in the applications Avalanche rated ECOPACK2 compliant Applications • • • • • Cordless appliance SSD Battery charger Telecom power DC / DC converter Description Schottky rectifiers designed for high frequency miniature switched mode power supplies such as adaptors and on board DC/DC converters. Packaged in SMA Flat Notch or SMB for thermal resistance characteristic improvement, the STPS2L25 is ideal for use in parallel with MOSFETs in synchronous rectification. Product status STPS2L25 Product summary Symbol Value IF(AV) 2A VRRM 25 V T j(max.) 150 °C VF(typ.) 0.325 V DS1245 - Rev 7 - September 2019 For further information contact your local STMicroelectronics sales office. www.st.com STPS2L25 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 25 V IF(RMS) Forward rms current 10 A 2 A IF(AV) Average forward current, δ = 0.5 square wave IFSM Surge non repetitive forward current PARM Repetitive peak avalanche power Tstg Tj SMB TL = 125 °C SMA Flat Notch TL = 130 °C SMB SMA Flat Notch tp = 10 ms sinusoidal tp = 10 µs, Tj = 125 °C Storage temperature range Maximum operating junction temperature(1) 75 A 90 108 W -65 to +150 °C +150 °C 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameter Symbol Rth(j-l) Parameter Junction to lead Max. value SMB 25 SMA Flat Notch 20 Unit °C/W For more information, please refer to the following application note : • AN5088 : Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics Symbol IR(1) Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C VF(1) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 2 A IF = 4 A Min. Typ. - 15 - Unit 90 µA 30 mA 0.450 0.325 - Max. 0.375 0.530 0.430 V 0.510 1. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.24 x IF(AV) + 0.068 x IF2(RMS) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode DS1245 - Rev 7 page 2/12 STPS2L25 Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current Figure 2. Average forward current versus ambient temperature (δ = 0.5) IF(AV)(A) PF(AV)(W) 2.2 1.2 δ = 0.05 1.1 δ = 0.1 δ = 0.2 δ = 0.5 Rth(j-a)= Rth(j-l) 2.0 1.0 SMB 1.8 0.9 1.6 0.8 δ=1 0.7 1.4 Rth(j-a)=100° C/W 1.2 0.6 1.0 0.5 0.8 0.4 0.6 0.3 T T 0.4 0.2 0.2 0.1 I F(A V) (A) 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 δ=tp/T 1.4 1.6 1.8 2.0 2.2 tp 0 2.4 2.6 Figure 3. Normalized avalanche power derating versus junction temperature (Tj = 125 °C) PARM (t p ) PARM (10 µs) 25 50 75 100 125 150 Figure 4. Relative variation of thermal impedance junction to ambient versus pulse duration 1.0 1 Tam b (°C) tp δ=tp/T 0.0 0.9 Zth(j-a)/Rth(j-a) SMB 0.8 0.7 0.1 0.6 0.5 0.4 0.3 0.01 0.2 0.1 0.001 DS1245 - Rev 7 10 t p (s) 0.0 t p(µs) 1 Single pulse 1.E-02 100 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1000 page 3/12 STPS2L25 Characteristics (curves) Figure 5. Reverse leakage current versus reverse voltage applied (typical values) Figure 6. Junction capacitance versus reverse voltage applied (typical values) C(pF) IR(mA) 1000 1.E+02 F=1MHz VOSC=30mVRMS Tj=25°C T j =150°C T j =125°C 1.E+01 T j =100°C 1.E+00 100 1.E-01 T j =25°C 1.E-02 VR (V) 1.E-03 0 5 V R (V) 10 10 15 20 1 25 Figure 7. Forward voltage drop versus forward current (high level) 10 100 Figure 8. Forward voltage drop versus forward current (low level) IF(A) IF(A) 10.0 3.0 Tj =125°C (maximum values) 2.5 Tj =125°C (maximum values) 2.0 Tj =125°C (typical values) 1.0 1.5 Tj =25°C (maximum values) Tj =125°C (typical values) 1.0 Tj =25°C (maximum values) 0.5 V F (V) V F (V) 0.1 0.0 0.1 0.2 0.3 0.0 0.4 0.5 0.6 0.0 0.7 Figure 9. Forward voltage drop versus forward current (typical values) 0.1 0.2 0.3 0.4 0.5 Figure 10. Thermal resistance junction to ambient versus copper surface under each lead IF(A) Rth(j-a) (°C/W) 10.00 200 Epoxy p ri nted ci rcui t board FR4, coppe r t hi ckness: 35 µm SMB 150 Tj=125°C 1.00 0.6 Tj=150°C 100 Tj=25°C 50 S(Cu)(cm²) V F (V) 0.10 0.0 DS1245 - Rev 7 0.1 0.2 0.3 0.4 0 0.5 0.6 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 page 4/12 STPS2L25 Characteristics (curves) Figure 11. Thermal resistance junction to ambient versus copper surface under each lead (SMA Flat Notch) Rth(j-a) (°C/W) 200 Epoxy printed circuit board FR4, copper thickness: 35 µm SMA Flat Notch 150 100 50 S(Cu)(cm²) 0 0.0 DS1245 - Rev 7 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 page 5/12 STPS2L25 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 SMB package information • • Epoxy meets UL94, V0 Lead-free package Figure 12. SMB package outline E1 D E A1 C A2 L DS1245 - Rev 7 b page 6/12 STPS2L25 SMB package information Table 4. SMB package mechanical data Dimensions Ref. Millimeters Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.074 0.097 A2 0.05 0.20 0.001 0.008 b 1.95 2.20 0.076 0.087 c 0.15 0.40 0.005 0.016 D 3.30 3.95 0.129 0.156 E 5.10 5.60 0.200 0.221 E1 4.05 4.60 0.159 0.182 L 0.75 1.50 0.029 0.060 Figure 13. SMB recommended footprint 1.62 2.60 1.62 (0.064) (0.102) (0.064) 2.18 (0.086) 5.84 (0.230) DS1245 - Rev 7 page 7/12 STPS2L25 SMA Flat Notch package information 2.2 SMA Flat Notch package information • • • Epoxy meets UL94, V0 Cooling method: by conduction (C) Band indicates cathode Figure 14. SMA Flat Notch package outline Table 5. SMA Flat Notch package mechanical data Dimensions Ref. Millimeters Min. A1 0.90 A1 Max. Min. 1.10 0.035 0.05 Typ. Max. 0.044 0.002 b 1.25 1.65 0.049 0.065 C 0.15 0.40 0.005 0.016 D 2.25 2.90 0.088 0.115 E 5.00 5.35 0.196 0.211 E1 3.95 4.60 0.155 0.182 G 2.00 0.079 G1 0.85 0.033 L DS1245 - Rev 7 Typ. Inches (for reference only) 0.75 1.20 0.029 L1 0.45 0.018 L2 0.45 0.018 L3 0.05 0.002 V 8° 8° V1 8° 8° page 8/12 STPS2L25 SMA Flat Notch package information Figure 15. SMA Flat Notch recommended footprint in mm (inches) 1.20 (0.047) 3.12 1.20 (0.123) (0.047) 1.52 (0.060) 5.52 (0.217) DS1245 - Rev 7 page 9/12 STPS2L25 Ordering Information 3 Ordering information Table 6. Ordering information DS1245 - Rev 7 Order code Marking Package Weight Base qty. Delivery mode STPS2L25U G23 SMB 0.107 g 2500 Tape and reel STPS2L25AFN A22 SMA Flat Notch 0.039 g 10 000 Tape and reel page 10/12 STPS2L25 Revision history Table 7. Document revision history DS1245 - Rev 7 Date Version Changes Jul-2003 4A 08-Feb-2007 5 Reformatted to current standard. Added ECOPACK statement. Added SMB flat package. 09-Oct-2018 6 Updated Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) and Figure 3. Normalized avalanche power derating versus junction temperature (Tj = 125 °C). Removed SMB flat package. 27-Sep-2019 7 Added Section 2.2 SMA Flat Notch package information. Last update. page 11/12 STPS2L25 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2019 STMicroelectronics – All rights reserved DS1245 - Rev 7 page 12/12