STTH30L06WY

STTH30L06-Y Datasheet Automotive 600 V, 30 A low drop ultrafast diode Features A K K K A D²PAK A A DO-247 K • • • • • • • AEC-Q101 qualified Ultrafast recovery Low conduction losses High surge capability Low leakage current High junction temperature VRRM guaranteed from -40 to +175 °C • ECOPACK2 compliant (DO-247) Applications • • • • OBC in EV-HEV Charging station Output rectification PFC topologies Description Product status link STTH30L06-Y The STTH30L06-Y is an ultrafast recovery power rectifier dedicated to energy efficiency housed in DO-247 and D²PAK. The STTH30L06-Y is especially designed for PFC boost function in Automotive applications. Product summary IF(AV) 30 A VRRM 600 V VF typ.) 1.10 V trr (max.) 65 ns Tj (max.) 175 °C DS7255 - Rev 3 - October 2020 For further information contact your local STMicroelectronics sales office. www.st.com STTH30L06-Y Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage (Tj = -40 °C to +175 °C) 600 V IF(RMS) Forward rms current 50 A IF(AV) Average forward current δ = 0.5, square wave Tc = 125 °C 30 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 300 A Tstg Storage temperature range -65 to +175 °C Operating junction temperature range -40 to +175 °C Max. value Unit 1.1 °C/W Tj Table 2. Thermal resistance parameter Symbol Parameter Rth(j-c) Junction to case For more information, please refer to the following application note : • AN5088 : Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics Symbol Parameter IR(1) Reverse leakage current VF(2) Forward voltage drop Test conditions Tj = 25 °C Tj = 150 °C Tj = 25 °C Tj = 150 °C VR = VRRM IF = 30 A Min. Typ. - 25 80 - Max. 800 1.55 1.0 1.25 Unit µA V 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.95 x IF(AV) + 0.010 x IF2(RMS) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode • AN5028: Calculation of turn-off power losses generated by an ultrafast diode DS7255 - Rev 3 page 2/13 STTH30L06-Y Characteristics Table 4. Dynamic characteristics (Tj = 25 °C unless otherwise specified) DS7255 - Rev 3 Symbol Parameters trr Reverse recovery time IRM Test conditions Min. Typ. Max. Unit IF = 0.5 A, IR = 1 A,IRR = 0.25 A - IF = 1 A, VR = 30 V, dlF/dt = 50 A/µs - 65 90 Reverse recovery current IF = 30 A, VR = 400 V, dlF/dt = 100 A/µs - 11.5 16 A tfr Forward recovery time IF = 30 A, dIF/dt = 100 A/μs, VFR = 1.1 VF(max.) - 500 ns VFP Forward recovery voltage IF = 30 A, dIF/dt = 100 A/μs, VFR = 1.1 VF(max.) - 65 2.5 ns V page 3/13 STTH30L06-Y Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Conduction losses versus average forward current (square waveform) 50 P(W) Figure 2. Conduction losses versus average forward current (sinusoidal waveform) 50 45 δ = 0.5 35 δ = 0.1 40 δ = 0.1 δ = 0.05 35 δ = 0.05 δ=1 30 30 25 25 20 20 15 δ= 1 δ = 0.5 δ = 0.2 45 δ = 0.2 40 P(W) 15 T 10 10 5 δ=tp/T IF(AV) (A) 5 tp 0 IF(AV)(A) 0 0 5 10 15 20 25 30 35 40 Figure 3. Forward voltage drop versus forward current 0 10 15 20 25 30 35 40 Figure 4. Relative variation of thermal impedance junction to case versus pulse duration IFM(A) 100 5 1.0 Zth(j-c)R/th(j-c) 90 0.9 Tj = 150 °C (maximum values) 80 0.8 70 0.7 60 Tj = 150 °C (typical values) 50 0.6 0.5 40 Tj = 25 °C (maximum values) 0.4 30 0.3 20 0.2 10 Single pulse VFM(V) 0.1 0 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 t p(s) 0.0 1.E-03 Figure 5. Peak reverse recovery current versus dIF/dt (typical values) 45 IRM(A) 40 IF=2 x IF(AV) 35 IF=IF(AV) 30 IF=0.5 x IF(AV) 25 20 15 10 5 dIF/dt(A/µs) 0 0 50 DS7255 - Rev 3 100 150 200 250 300 350 400 450 500 1.E-01 1.E+00 Figure 6. Reverse recovery time versus dIF/dt (typical values) 800 750 700 650 600 550 500 450 400 350 300 250 200 150 100 50 0 VR = 400 V Tj = 125 °C 1.E-02 t rr(ns) VR = 400 V Tj = 125 °C IF=2 x IF(AV) IF=IF(AV) IF=0.5 x IF(AV) dIF /dt(A/µs) 0 50 100 150 200 250 300 350 400 450 500 page 4/13 STTH30L06-Y Characteristics (curves) Figure 7. Reverse recovery charges versus dIF/dt (typical values) Q rr(nC) S factor 1.6 3500 VR=400V Tj=125°C 3000 Figure 8. Reverse recovery softness factor versus dIF/dt (typical values) IF< 2 x IF(AV) VR = 400 V Tj = 125 °C 1.4 IF=2 x IF(AV) 1.2 2500 1.0 IF=IF(AV) 2000 0.8 IF=0.5 x IF(AV) 1500 0.6 1000 0.4 500 0.2 dIF /dt(A/µs) dIF /dt(A/µs) 0.0 0 0 100 200 300 400 0 500 Figure 9. Relative variations of dynamic parameters versus junction temperature 1.4 150 200 250 300 350 400 450 500 VFP (V) IF=IF(AV) Tj=125°C 9 1.2 100 Figure 10. Transient peak forward voltage versus dIF/dt (typical values) 10 S factor 50 8 1.0 7 6 0.8 QRR 0.6 IF = IF(AV) VR=400V Reference: Tj = 125 °C trr IRM 0.4 5 4 3 2 0.2 Tj (°C) 0.0 25 50 1 75 100 125 Figure 11. Forward recovery time versus dIF/dt (typical values) 500 t fr(ns) 0 50 100 150 200 250 300 350 400 450 500 Figure 12. Junction capacitance versus reverse voltage applied (typical values) 1000 C(pF) F = 1 MHz VOSC=30mVRMS Tj = 25 °C IF=IF(AV) VFR=1.1 x VF max. Tj=125°C D2PAK 450 dIF /dt(A/µs) 0 400 350 300 100 250 200 150 100 50 dIF /dt(A/µs) VR(V) 0 10 0 DS7255 - Rev 3 100 200 300 400 500 1 10 100 1000 page 5/13 STTH30L06-Y Characteristics (curves) Figure 13. Thermal resistance junction to ambient versus copper surface under each lead (typical values) 80 R th(j-a) (°C/W) Epoxy printed circuit board FR4, copper thickness = 35 µm 70 60 50 40 30 20 10 S CU(cm²) 0 0 DS7255 - Rev 3 5 10 15 20 25 30 35 40 page 6/13 STTH30L06-Y Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 D²PAK package information • • Epoxy meets UL94, V0. Cooling method: by conduction (C) Figure 14. D²PAK package outline Note: DS7255 - Rev 3 This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. page 7/13 STTH30L06-Y D²PAK package information Table 5. D²PAK package mechanical data Dimensions Millimeters Ref. Min. Typ. Inches (for reference only) Max. Min. Typ. Max. A 4.40 4.60 0.173 0.181 A1 0.03 0.23 0.001 0.009 b 0.70 0.93 0.028 0.037 b2 1.14 1.70 0.045 0.067 c 0.45 0.60 0.018 0.024 c2 1.23 1.36 0.048 0.053 D 8.95 9.35 0.352 0.368 D1 7.50 7.75 8.00 0.295 0.305 0.315 D2 1.10 1.30 1.50 0.043 0.051 0.060 E 10.00 10.40 0.394 E1 8.30 8.50 8.70 0.335 0.343 0.346 E2 6.85 7.05 7.25 0.266 0.278 0.282 e 2.54 0.409 0.100 e1 4.88 5.28 0.190 0.205 H 15.00 15.85 0.591 0.624 J1 2.49 2.69 0.097 0.106 L 2.29 2.79 0.090 0.110 L1 1.27 1.40 0.049 0.055 L2 1.30 1.75 0.050 0.069 R V2 0.40 0° 0.015 8° 0° 8° Figure 15. D²PAK recommended footprint (dimensions are in mm) Footprint_26 DS7255 - Rev 3 page 8/13 STTH30L06-Y DO-247 package information 2.2 DO-247 package information • • • • Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.8 N·m Maximum torque value: 1.0 N·m Figure 16. DO-247 package outline V Dia V "RESIN GATE" (SEE NOTE 6) A H A L5 A L L2 L4 F2 L3 L1 F3 A V2 D A F(x3) M E G = = Note: DS7255 - Rev 3 This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. page 9/13 STTH30L06-Y DO-247 package information Figure 17. DO-247 package min-max drawing H H C L2 L4 L4 L2 L L L5 L5 C F3 V2 L1 F3 V2 F(x2) C // F2 L3 L3 L1 F2 F(x2) C // // // G G Table 6. DO-247 package mechanical data Dimensions Millimeters Ref. Min. Max. Min. Typ. Max. A 4.85 5.15 0.1909 0.2027 D 2.2 2.6 0.0866 0.1023 E 0.4 0.8 0.0157 0.0314 F 1 1.4 0.0393 0.0551 2.4 0.0787 F2 F3 2 2 G 0.0787 10.9 0.0944 0.4291 H 15.45 15.75 0.6082 0.6200 L 19.85 20.15 0.7814 0.7933 L1 3.7 4.3 0.1456 0.1692 L2 L3 18.5 14.2 0.7283 14.8 0.5590 0.5826 L4 34.6 1.3622 L5 5.5 0.2165 M 2 3 0.0787 0.1181 V 5° 5° V2 60° 60° Diam. DS7255 - Rev 3 Typ. Inches (for reference only) 3.55 3.65 0.1397 0.1437 page 10/13 STTH30L06-Y Ordering information 3 Ordering information Table 7. Ordering information DS7255 - Rev 3 Order code Marking Package Weight Base qty. Delivery mode STTH30L06GY-TR STTH30L06GY D²PAK 1.48 g 1000 Tape and reel STTH30L06WY STTH30L06WY DO-247 4.36 g 30 Tube page 11/13 STTH30L06-Y Revision history Table 8. Document revision history Date Version Changes 24-Oct-2012 1 21-Sep-2020 2 Added Figure 2. Conduction losses versus average forward current (sinusoidal waveform). 21-Oct-2020 3 Added Figure 17. First issue. Updated package information. DS7255 - Rev 3 page 12/13 STTH30L06-Y IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2020 STMicroelectronics – All rights reserved DS7255 - Rev 3 page 13/13