找到“without”相关的规格书共5,131个
| 型号 | 厂商 | 描述 | 数据手册 | 替代料 | 参考价格 |
|---|---|---|---|---|---|
| 0878310420 | MOLEX10[MolexElectronicsLtd.] | 0878310420 - 2.00mm (.079) Pitch Milli-Gridâ„¢ Header, Vertical, Through Hole, Shrouded, Lead-free, 4 Circuits, 0.38μm (15μ) Gold (Au) Plating, without Center Polarization Slot - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0621 | MOLEX2[MolexElectronicsLtd.] | 15-80-0621 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 62 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0009016211 | MOLEX1[MolexElectronicsLtd.] | 0009016211 - 3.96mm (.156") Pitch KK® Crimp Housing, Edge Card Connector, Single-Sided,Surface Mount, Polarized, Without Flange, 21 Circuits, Rib between 5 & 6, 10 & 11, 15 & 16 - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0509 | MOLEX2[MolexElectronicsLtd.] | 15-80-0509 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0505 | MOLEX2[MolexElectronicsLtd.] | 15-80-0505 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0425 | MOLEX2[MolexElectronicsLtd.] | 15-80-0425 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 42 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0381 | MOLEX2[MolexElectronicsLtd.] | 15-80-0381 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0303 | MOLEX2[MolexElectronicsLtd.] | 15-80-0303 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 71741-2002 | MOLEX8[MolexElectronicsLtd.] | 71741-2002 - 1.00mm (.039") Pitch Mezzanine Plug, Surface Mount, Dual Row, Vertical Stacking84 Circuits, 6.35mm (.250") Unmated Height, without PCB Locator Pegs, with Robotic - Molex Electronics Ltd. | 获取价格 | ||
| 71741-0001 | MOLEX8[MolexElectronicsLtd.] | 71741-0001 - 1.00mm (.039") Pitch Mezzanine Plug, Surface Mount, Dual Row, Vertical Stacking84 Circuits, 8.35mm (.329") Unmated Height, with PCB Locator Pegs, without Robotic - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0241 | MOLEX2[MolexElectronicsLtd.] | 15-80-0241 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0223 | MOLEX2[MolexElectronicsLtd.] | 15-80-0223 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, - Molex Electronics Ltd. | 获取价格 | ||
| 71436-1864 | MOLEX8[MolexElectronicsLtd.] | 71436-1864 - 1.00mm (.039") Pitch Mezzanine IEEE 1386 Plug, Surface Mount, Dual Row, VerticalStacking, 64 Circuits, 7.35mm (.289") Unmated Height, without PCB Locator Pegs, with - Molex Electronics Ltd. | 获取价格 | ||
| 71436-0764 | MOLEX8[MolexElectronicsLtd.] | 71436-0764 - 1.00mm (.039") Pitch Mezzanine IEEE 1386 Plug, Surface Mount, Dual Row, VerticalStacking, 64 Circuits, 6.35mm (.250") Unmated Height, without PCB Locator Pegs, with - Molex Electronics Ltd. | 获取价格 | ||
| 71436-0564 | MOLEX8[MolexElectronicsLtd.] | 71436-0564 - 1.00mm (.039") Pitch Mezzanine IEEE 1386 Plug, Surface Mount, Dual Row, VerticalStacking, 64 Circuits, 6.35mm (.250") Unmated Height, without PCB Locator Pegs, - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0201 | MOLEX2[MolexElectronicsLtd.] | 15-80-0201 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0181 | MOLEX2[MolexElectronicsLtd.] | 15-80-0181 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0169 | MOLEX2[MolexElectronicsLtd.] | 15-80-0169 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0147 | MOLEX2[MolexElectronicsLtd.] | 15-80-0147 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0145 | MOLEX2[MolexElectronicsLtd.] | 15-80-0145 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 |
