找到“package.”相关的规格书共9,694个
| 型号 | 厂商 | 描述 | 数据手册 | 替代料 | 参考价格 |
|---|---|---|---|---|---|
| BO128128C | BOLYMIN[Bolymin,Inc] | BO128128C - COG package Built-in controller ST7528 - Bolymin, Inc | 获取价格 | ||
| Q6600 | INTEL[IntelCorporation] | Q6600 - on 65 nm Process in the 775-land LGA Package supporting Intel 64 architecture - Intel Corporation | 获取价格 | ||
| BIR-BO03J4G-1 | BRIGHT[BRIGHTLEDELECTRONICSCORP] | BIR-BO03J4G-1 - END-LOOK PACKAGE LIGHT EMITTING DIODE - BRIGHT LED ELECTRONICS CORP | 获取价格 | ||
| BHP20201F | BITECH[Bitechnologies] | BHP20201F - Noninductive Planar Low Cost, 20 Watt TO 220 Package Thick Film Resistor - Bi technologies | 获取价格 | ||
| 17-21-Y2C-AN1P2-3T | EVERLIGHT[EverlightElectronicsCo.,Ltd] | 17-21-Y2C-AN1P2-3T - 0805 Package Chip LED(1.0mm Height) - Everlight Electronics Co., Ltd | 获取价格 | ||
| BGB203 | PHILIPS[NXPSemiconductors] | BGB203 - Bluetooth System-in-a-Package radio with baseband controller - NXP Semiconductors | 获取价格 | ||
| 17-21-R7C-AN2Q1B-3T | EVERLIGHT[EverlightElectronicsCo.,Ltd] | 17-21-R7C-AN2Q1B-3T - 0805 Package Chip LED (1.1mm Height) - Everlight Electronics Co., Ltd | 获取价格 | ||
| 17-21-G6C-FM1N2B-3T | EVERLIGHT[EverlightElectronicsCo.,Ltd] | 17-21-G6C-FM1N2B-3T - 0805 Package Chip LED - Everlight Electronics Co., Ltd | 获取价格 | ||
| 17-21-G6C-AN1P1B-3T | EVERLIGHT[EverlightElectronicsCo.,Ltd] | 17-21-G6C-AN1P1B-3T - 0805 Package Chip LED(1.0mm Height) - Everlight Electronics Co., Ltd | 获取价格 | ||
| BFT62 | SEME-LAB[SemeLAB] | BFT62 - Bipolar PNP Device in a Hermetically sealed TO39 Metal Package. - Seme LAB | 获取价格 | ||
| BF128128E | BOLYMIN[Bolymin,Inc] | BF128128E - FSTN Transflective LCD, COF package Built-in driver HD66750 - Bolymin, Inc | 获取价格 | ||
| BD2246G | ROHM[Rohm] | BD2246G - 1ch Small Package High Side Switch ICs for USB Devices and Memory Cards - Rohm | 获取价格 | ||
| BD2226G | ROHM[Rohm] | BD2226G - 1ch Small Package High Side Switch ICs for USB Devices and Memory Cards - Rohm | 获取价格 | ||
| BD2221G | ROHM[Rohm] | BD2221G - 1ch Small Package High Side Switch ICs for USB Devices and Memory Cards - Rohm | 获取价格 | ||
| 1N4005G | PHILIPS[NXPSemiconductors] | 1N4005G - Rectifiers(Rugged glass package, using a high temperature alloyed construction) - NXP Semiconductors | 获取价格 | ||
| BCW29_98 | KEC[KEC(KoreaElectronics)] | BCW29_98 - SOT-23 PACKAGE - KEC(Korea Electronics) | 获取价格 | ||
| BC460-4 | SEME-LAB[SemeLAB] | BC460-4 - Bipolar PNP Device in a Hermetically sealed TO39 Metal Package - Seme LAB | 获取价格 | ||
| BAT54CSM | SEME-LAB[SemeLAB] | BAT54CSM - SCHOTTKY DIODE IN HERMETIC CERAMIC SURFACE MOUNT PACKAGE FOR HIGH RELIABILITY APPLICATIONS - Seme LAB | 获取价格 | ||
| BAS21H | PHILIPS[NXPSemiconductors] | BAS21H - Single high-voltage switching diode in small SOD123F package - NXP Semiconductors | 获取价格 | ||
| B2415LM-1W | MORNSUN[MORNSUNScience&TechnologyLtd.] | B2415LM-1W - DUAL/SINGLE OUTPUT,SUPERMINIATURE SIP PACKAGE - MORNSUN Science& Technology Ltd. | 获取价格 |
