找到“without”相关的规格书共5,131个
| 型号 | 厂商 | 描述 | 数据手册 | 替代料 | 参考价格 |
|---|---|---|---|---|---|
| 53885-0408 | MOLEX7[MolexElectronicsLtd.] | 53885-0408 - 0.50mm (.020") Pitch SlimStack™ Plug, Surface Mount, Dual Row, Vertical, 2.50mm(.098") Stack Height, without Solder Tab, 40 Circuits - Molex Electronics Ltd. | 获取价格 | ||
| 53748-0808 | MOLEX7[MolexElectronicsLtd.] | 53748-0808 - 0.50mm (.020") Pitch SlimStack™ Plug, Surface Mount, Dual Row, Vertical, 3.00mm (.118") Stack Height, 80 Circuits, without Vacuum Pick-up Tape - Molex Electronics Ltd. | 获取价格 | ||
| 433742001 | MOLEX5[MolexElectronicsLtd.] | 433742001 - Sabre™ Crimp Terminal, Female, With Tin (Sn) Plated Brass Contact, 18-20 AWG, Reel Packaged, without TPA, UL1007 or UL1015 Wire - Molex Electronics Ltd. | 获取价格 | ||
| 0015801401 | MOLEX2[MolexElectronicsLtd.] | 0015801401 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015801201 | MOLEX2[MolexElectronicsLtd.] | 0015801201 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015801121 | MOLEX2[MolexElectronicsLtd.] | 0015801121 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015800723 | MOLEX2[MolexElectronicsLtd.] | 0015800723 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 72 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015800685 | MOLEX2[MolexElectronicsLtd.] | 0015800685 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015800509 | MOLEX2[MolexElectronicsLtd.] | 0015800509 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015800445 | MOLEX2[MolexElectronicsLtd.] | 0015800445 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 44 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015800425 | MOLEX2[MolexElectronicsLtd.] | 0015800425 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 42 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015800405 | MOLEX2[MolexElectronicsLtd.] | 0015800405 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015800323 | MOLEX2[MolexElectronicsLtd.] | 0015800323 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015800303 | MOLEX2[MolexElectronicsLtd.] | 0015800303 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015800283 | MOLEX2[MolexElectronicsLtd.] | 0015800283 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015800263 | MOLEX2[MolexElectronicsLtd.] | 0015800263 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015800245 | MOLEX2[MolexElectronicsLtd.] | 0015800245 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015800209 | MOLEX2[MolexElectronicsLtd.] | 0015800209 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015800185 | MOLEX2[MolexElectronicsLtd.] | 0015800185 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015800149 | MOLEX2[MolexElectronicsLtd.] | 0015800149 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 |
