找到“without”相关的规格书共5,131个
| 型号 | 厂商 | 描述 | 数据手册 | 替代料 | 参考价格 |
|---|---|---|---|---|---|
| 0878321030 | MOLEX10[MolexElectronicsLtd.] | 0878321030 - 2.00mm (.079) Pitch Milli-Gridâ„¢ Header, Surface Mount, Vertical, Shrouded, 10 Circuits, 0.38μm (15μ) Gold (Au) Plating, without PCB Locator, with Locking Window - Molex Electronics Ltd. | 获取价格 | ||
| 74337-0062 | MOLEX8[MolexElectronicsLtd.] | 74337-0062 - 0.80mm (.031") Pitch Ultra™ VHDCI Receptacle, Stacked, Right Angle, EnhancedShield, Press-Fit PCB Retention Option, 136 Circuits, without Screw Locks and Cover - Molex Electronics Ltd. | 获取价格 | ||
| 74164-0124 | MOLEX8[MolexElectronicsLtd.] | 74164-0124 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded,10 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, without Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 15-97-7123 | MOLEX2[MolexElectronicsLtd.] | 15-97-7123 - 4.20mm (.165) Pitch Mini-Fit TPAâ„¢ Header, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 12 Circuits, Tin (Sn) Plating, without Drain Holes - Molex Electronics Ltd. | 获取价格 | ||
| 15-81-0361 | MOLEX2[MolexElectronicsLtd.] | 15-81-0361 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-1501 | MOLEX2[MolexElectronicsLtd.] | 15-80-1501 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-1401 | MOLEX2[MolexElectronicsLtd.] | 15-80-1401 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-1061 | MOLEX2[MolexElectronicsLtd.] | 15-80-1061 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0705 | MOLEX2[MolexElectronicsLtd.] | 15-80-0705 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 70 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0683 | MOLEX2[MolexElectronicsLtd.] | 15-80-0683 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0665 | MOLEX2[MolexElectronicsLtd.] | 15-80-0665 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 66 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0663 | MOLEX2[MolexElectronicsLtd.] | 15-80-0663 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 66 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0601 | MOLEX2[MolexElectronicsLtd.] | 15-80-0601 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 60 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0565 | MOLEX2[MolexElectronicsLtd.] | 15-80-0565 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 56 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0523 | MOLEX2[MolexElectronicsLtd.] | 15-80-0523 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 52 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0521 | MOLEX2[MolexElectronicsLtd.] | 15-80-0521 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 52 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0501 | MOLEX2[MolexElectronicsLtd.] | 15-80-0501 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0483 | MOLEX2[MolexElectronicsLtd.] | 15-80-0483 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 48 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0481 | MOLEX2[MolexElectronicsLtd.] | 15-80-0481 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 48 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0465 | MOLEX2[MolexElectronicsLtd.] | 15-80-0465 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 46 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 |
