找到“without”相关的规格书共5,131个
| 型号 | 厂商 | 描述 | 数据手册 | 替代料 | 参考价格 |
|---|---|---|---|---|---|
| 15-80-0463 | MOLEX2[MolexElectronicsLtd.] | 15-80-0463 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 46 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0405 | MOLEX2[MolexElectronicsLtd.] | 15-80-0405 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0385 | MOLEX2[MolexElectronicsLtd.] | 15-80-0385 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0341 | MOLEX2[MolexElectronicsLtd.] | 15-80-0341 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 34 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0305 | MOLEX2[MolexElectronicsLtd.] | 15-80-0305 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0289 | MOLEX2[MolexElectronicsLtd.] | 15-80-0289 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0269 | MOLEX2[MolexElectronicsLtd.] | 15-80-0269 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0263 | MOLEX2[MolexElectronicsLtd.] | 15-80-0263 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 71436-2764 | MOLEX8[MolexElectronicsLtd.] | 71436-2764 - 1.00mm (.039") Pitch Mezzanine IEEE 1386 Plug, Surface Mount, Dual Row, VerticalStacking, 64 Circuits, 8.35mm (.329") Unmated Height, without PCB Locator Pegs, with - Molex Electronics Ltd. | 获取价格 | ||
| 71436-2164 | MOLEX8[MolexElectronicsLtd.] | 71436-2164 - 1.00mm (.039") Pitch Mezzanine IEEE 1386 Plug, Surface Mount, Dual Row, VerticalStacking, 64 Circuits, 8.35mm (.329") Unmated Height, with PCB Locator Pegs, without - Molex Electronics Ltd. | 获取价格 | ||
| 71436-0864 | MOLEX8[MolexElectronicsLtd.] | 71436-0864 - 1.00mm (.039") Pitch Mezzanine IEEE 1386 Plug, Surface Mount, Dual Row, VerticalStacking, 64 Circuits, 6.35mm (.250") Unmated Height, without PCB Locator Pegs, with - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0209 | MOLEX2[MolexElectronicsLtd.] | 15-80-0209 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0203 | MOLEX2[MolexElectronicsLtd.] | 15-80-0203 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 71349-1074 | MOLEX8[MolexElectronicsLtd.] | 71349-1074 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded16 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, without Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 71349-1073 | MOLEX8[MolexElectronicsLtd.] | 71349-1073 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded,14 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, without Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 71349-1071 | MOLEX8[MolexElectronicsLtd.] | 71349-1071 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded10 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, without Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 71349-1057 | MOLEX8[MolexElectronicsLtd.] | 71349-1057 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded50 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, without Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 71349-1013 | MOLEX8[MolexElectronicsLtd.] | 71349-1013 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded,30 Circuits, Tin (Sn) Plating, without Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 71349-1009 | MOLEX8[MolexElectronicsLtd.] | 71349-1009 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded22 Circuits, Tin (Sn) Plating, without Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 71308-5474 | MOLEX8[MolexElectronicsLtd.] | 71308-5474 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 74 Circuits1.50μm (59μ") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator - Molex Electronics Ltd. | 获取价格 |
