找到TLEGD1050相关的规格书共454
型号厂商描述数据手册替代料参考价格
M2256PWMinnesota Mining and ManufacturingCapacitive Graphic LCD Display Module Transmissive Red, Green, Blue (RGB) TFT - Color DVI, VGA 22" (558.80mm) 1680 x 1050 (WSXGA+)获取价格
ISO1050DWRTexas Instruments类型:收发器 协议类别:CAN总线 驱动器/接收器数:1/1 数据速率:1Mbps ISO1050 隔离式 5V CAN 收发器获取价格
50PT1050BXBOTHHAND[BothhandUSA,LP.] 50PT1050BX - 50 PIN DIP ETHERNET 10/100 BASE-TX HIGH SPEED LAN MAGNETICS - Bothhand USA, LP.获取价格
HMC829LP6GE_1109HITTITE[HittiteMicrowaveCorporation] HMC829LP6GE_1109 - FRACTIONAL-N PLL WITH INTEGRATED VCO 45 - 1050, 1400 - 2100, 2800 - 4200 MHz - Hittite Microwave Corporation获取价格
SD1050SPANJIT[PanJitInternationalInc.] SD1050S - DPAK SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER(VOLTAGE - 20 to 100 Volts CURRENT - 10.0 Amperes) - Pan Jit International Inc.获取价格
BPV22NFVishay Intertechnology, Inc.峰值波长:940nm 响应范围:790nm~1050nm 反向电压:60V 暗电流:2nA 接收角:±60° 工作温度:-40℃~+100℃ Photodiode 940nm 120° Radial, Side View,波长响应范围: 790nm ~ 1050nm获取价格
ERJ8ENF1050VPanasonic CorporationPANASONIC - ERJ8ENF1050V - SMD Chip Resistor, 1206 [3216 Metric], 105 ohm, ERJ8EN Series, 200 V, Thick Film, 250 mW - SMD Chip Resistor, 1206 [3216 Metric], 105 ohm, ERJ8EN Series, 200 V, Thick Film, 250 mW获取价格
87759-1050MOLEX10[MolexElectronicsLtd.] 87759-1050 - 2.00mm (.079) Pitch Milli-Grid™ Header, Surface Mount, Vertical, 10 Circuits, 0.38μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free - Molex Electronics Ltd.获取价格
87758-1050MOLEX9[MolexElectronicsLtd.] 87758-1050 - 2.00mm (.079) Pitch Milli-Grid™ Header, Through Hole, Vertical, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free - Molex Electronics Ltd.获取价格
09-06-1050MOLEX1[MolexElectronicsLtd.] 09-06-1050 - 3.96mm (.156") KK® IDT Trifurconâ„¢ Contact, 5 Circuits, Tin (Sn), Feed-To, 20 Solid or Fused Stranded, and 18 Stranded, Red ID Strip - Molex Electronics Ltd.获取价格
71349-1050MOLEX8[MolexElectronicsLtd.] 71349-1050 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded, 36 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, without Press-fit Plastic Pegs - Molex Electronics Ltd.获取价格
14-60-1050MOLEX1[MolexElectronicsLtd.] 14-60-1050 - 2.54mm (.100") Pitch SL™ Insulation Displacement Connector Assembly, Female, Single Row, Version D, Back Ribs, Wire Size 26, 3.81μm (150μ") Tin/Lead (SnPb) - Molex Electronics Ltd.获取价格
70287-1050MOLEX8[MolexElectronicsLtd.] 70287-1050 - 2.54mm (.100") Pitch C-Grid® Header, Breakaway, Dual Row, Vertical, with RetentionPin, 6 Circuits, 8.13mm (.320") Mating Pin Length, Tin (Sn) Plating - Molex Electronics Ltd.获取价格
74162-1050MOLEX8[MolexElectronicsLtd.] 74162-1050 - 2.54mm (.100") Pitch C-Grid® Receptacle, Right Angle, Through Hole, Dual RowShrouded, Version B, High-Temperature, 50 Circuits, Tin (Sn) - Molex Electronics Ltd.获取价格