找到“without”相关的规格书共5,131个
| 型号 | 厂商 | 描述 | 数据手册 | 替代料 | 参考价格 |
|---|---|---|---|---|---|
| A556610BGS210 | MOLEX3[MolexElectronicsLtd.] | A556610BGS210 - 4.20mm (.165") Pitch Mini-Fit Jr. Header, Dual Row, Vertical, without Snap-in Plastic Peg PCB Lock - Molex Electronics Ltd. | 获取价格 | ||
| A556604B210 | MOLEX3[MolexElectronicsLtd.] | A556604B210 - 4.20mm (.165") Pitch Mini-Fit Jr.™ Header, Dual Row, Vertical, without Snap-in Plastic Peg PCB Lock, 4 Circuits, PA Polyamide Nylon 6/6 94V-0, Tin (Sn) Plating, with Drain Holes - Molex Electronics Ltd. | 获取价格 | ||
| A556602AGS210 | MOLEX3[MolexElectronicsLtd.] | A556602AGS210 - 4.20mm (.165") Pitch Mini-Fit Jr. Header, Dual Row, Vertical, without Snap-in Plastic Peg PCB Lock - Molex Electronics Ltd. | 获取价格 | ||
| A-30069-10C1 | MOLEX2[MolexElectronicsLtd.] | A-30069-10C1 - 4.20mm (.165) Pitch Mini-Fit TPA™ Header, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 10 Circuits, Tin (Sn) Plating, without Drain Holes - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0348 | MOLEX2[MolexElectronicsLtd.] | A-70567-0348 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0341 | MOLEX2[MolexElectronicsLtd.] | A-70567-0341 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0288 | MOLEX2[MolexElectronicsLtd.] | A-70567-0288 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0286 | MOLEX2[MolexElectronicsLtd.] | A-70567-0286 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0279 | MOLEX2[MolexElectronicsLtd.] | A-70567-0279 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0276 | MOLEX2[MolexElectronicsLtd.] | A-70567-0276 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0273 | MOLEX2[MolexElectronicsLtd.] | A-70567-0273 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0209 | MOLEX2[MolexElectronicsLtd.] | A-70567-0209 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0206 | MOLEX2[MolexElectronicsLtd.] | A-70567-0206 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0164 | MOLEX2[MolexElectronicsLtd.] | A-70567-0164 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 60 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0159 | MOLEX2[MolexElectronicsLtd.] | A-70567-0159 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0153 | MOLEX2[MolexElectronicsLtd.] | A-70567-0153 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0138 | MOLEX2[MolexElectronicsLtd.] | A-70567-0138 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0137 | MOLEX2[MolexElectronicsLtd.] | A-70567-0137 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0100 | MOLEX2[MolexElectronicsLtd.] | A-70567-0100 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0097 | MOLEX2[MolexElectronicsLtd.] | A-70567-0097 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 62 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 |
