找到“Without”相关的规格书共5,131个
| 型号 | 厂商 | 描述 | 数据手册 | 替代料 | 参考价格 |
|---|---|---|---|---|---|
| 0713491013 | MOLEX8[MolexElectronicsLtd.] | 0713491013 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded,30 Circuits, Tin (Sn) Plating, without Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 0713491004 | MOLEX8[MolexElectronicsLtd.] | 0713491004 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded12 Circuits, Tin (Sn) Plating, without Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 0713491002 | MOLEX8[MolexElectronicsLtd.] | 0713491002 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded, 8 Circuits, Tin (Sn) Plating, without Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 0713085476 | MOLEX8[MolexElectronicsLtd.] | 0713085476 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 76 Circuits,1.50μm (59μ") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 0713085470 | MOLEX8[MolexElectronicsLtd.] | 0713085470 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 70 Circuits1.50μm (59μ") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator - Molex Electronics Ltd. | 获取价格 | ||
| 0713085454 | MOLEX8[MolexElectronicsLtd.] | 0713085454 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 54 Circuits1.50μm (59μ") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator - Molex Electronics Ltd. | 获取价格 | ||
| 0713085426 | MOLEX8[MolexElectronicsLtd.] | 0713085426 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 26 Circuits,1.50μm (59μ") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator - Molex Electronics Ltd. | 获取价格 | ||
| 53885-0608 | MOLEX7[MolexElectronicsLtd.] | 53885-0608 - 0.50mm (.020") Pitch SlimStack™ Plug, Surface Mount, Dual Row, Vertical, 2.50mm(.098") Stack Height, without Solder Tab, 60 Circuits - Molex Electronics Ltd. | 获取价格 | ||
| 53748-0608 | MOLEX7[MolexElectronicsLtd.] | 53748-0608 - 0.50mm (.020") Pitch SlimStack™ Plug, Surface Mount, Dual Row, Vertical, 3.00mm(.118") Stack Height, 60 Circuits, without Vacuum Pick-up Tape - Molex Electronics Ltd. | 获取价格 | ||
| 53748-0408 | MOLEX7[MolexElectronicsLtd.] | 53748-0408 - 0.50mm (.020") Pitch SlimStack™ Plug, Surface Mount, Dual Row, Vertical, 3.00mm118") Stack Height, 40 Circuits, without Vacuum Pick-up Tape - Molex Electronics Ltd. | 获取价格 | ||
| 0015801521 | MOLEX2[MolexElectronicsLtd.] | 0015801521 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 52 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015801501 | MOLEX2[MolexElectronicsLtd.] | 0015801501 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015801061 | MOLEX2[MolexElectronicsLtd.] | 0015801061 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015800703 | MOLEX2[MolexElectronicsLtd.] | 0015800703 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 70 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, - Molex Electronics Ltd. | 获取价格 | ||
| 501190-5027 | MOLEX11[MolexElectronicsLtd.] | 501190-5027 - 1.00mm (.039") Pitch Pico-Clasp™ Wire-to-Board PCB Header, Dual Row, Vertical, 50 Circuits, Lead-free, without Pick-and-Place Tape - Molex Electronics Ltd. | 获取价格 | ||
| 0015800683 | MOLEX2[MolexElectronicsLtd.] | 0015800683 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015800665 | MOLEX2[MolexElectronicsLtd.] | 0015800665 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 66 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015800625 | MOLEX2[MolexElectronicsLtd.] | 0015800625 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 62 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015800623 | MOLEX2[MolexElectronicsLtd.] | 0015800623 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 62 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015800603 | MOLEX2[MolexElectronicsLtd.] | 0015800603 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 60 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 |
