LSIC1MO170E0750
Silicon Carbide MOSFET Datasheet
LSIC1MO170E0750
1700 V, 750 mOhm N-Channel SiC MOSFET
Product Summary
Characteristic
Value
VDS
1700
V
Typical RDS(ON)
750
mOhm
4.4
A
ID (TC
°C)
Unit
Features
• Optimized for high-frequency, high-efficiency
applications
• Extremely low gate charge and output
capacitance
• Low gate resistance for high-frequency switching
• Normally-off operations at all temperatures
Ultra-low on-resistance
Agency Approvals and Environmental
Environmental Approvals
Applications
• High-frequency applications
• Solar Inverters
• Switch Mode Power Supplies
• UPS
• Motor Drives
• High Voltage DC/DC Converters
• Battery Chargers
• Induction Heating
Circuit Diagram
1
Specifications are subject to change without notice.
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Revised: 12/14/2020
LSIC1MO170E0750
Silicon Carbide MOSFET Datasheet
1. Maximum Ratings...........................................................................................................................................3
2. Thermal Characteristics ..................................................................................................................................3
3. Electrical Characteristics .................................................................................................................................3
3.1. Static Characteristics (TJ = 25 °C unless otherwise specified) ................................................................3
3.2. Dynamic Characteristics (TJ = 25 °C unless otherwise specified) ...........................................................4
4. Reverse Diode Characteristics .......................................................................................................................4
5. Figure Data .....................................................................................................................................................5
6. Package Dimensions ......................................................................................................................................9
7. Part Numbering and Marking ..........................................................................................................................9
8. Packing Options ..............................................................................................................................................9
9. Packing Specifications ..................................................................................................................................10
2
Specifications are subject to change without notice.
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Revised: 12/14/2020
LSIC1MO170E0750
Silicon Carbide MOSFET Datasheet
1. Maximum Ratings
Characteristic
Symbol
Drain-Source Voltage
Conditions
Value
Unit
V
VDS
VGS = 0 V
1700
VGS = 20 V, TC = 25 °C
6.2
VGS = 20 V, TC = 100 °C
4.4
ID(pulse)
TC = 25 °C
11
A
PD
TC = 25 °C, TJ = 175 °C
60
W
Continuous Drain Current
ID
Pulsed Drain Current 1
Power Dissipation
VGS,MAX
Gate-Source Voltage
Absolute maximum values
Steady state
6 to +22
VGS,OP,TR 2
Transient, ttransient < 300 nsec
10 to +25
VGS,OP 3
Recommended DC operating values
5 to +20
Operating Junction Temperature
A
V
TJ
-
55 to +175
°C
Storage Temperature
TSTG
-
55 to +150
°C
Lead Temperature for Soldering
TSOLD
-
260
°C
MD
M3 or 6-32 screw
Mounting Torque
1
Nm
8.8
in-lb
Footnote 1: Pulse width limited by TJ,MAX
Footnote 2: See Figure 21 for further information
Footnote 3: MOSFET can operate with VGS(OFF) = 0 V
dependent upon PCB layout. VGS(OFF) = 5 V provides added noise margin and faster turn-off speed
2. Thermal Characteristics
Characteristic
Symbol
Value
Unit
Typical Thermal Resistance, junction-to-case
Rth,JC,MAX
2.5
°C/W
Maximum Thermal Resistance, junction-to-ambient
Rth,JA,MAX
40
°C/W
3. Electrical Characteristics
3.1. Static Characteristics (T
J
Characteristic
= 25 °C unless otherwise specified)
Symbol
Conditions
Drain-Source Breakdown Voltage
V(BR)DSS
Zero Gate Voltage Drain Current
IDSS
Gate Leakage Current
Typ
Max
VGS = 0 V, ID = 100 µA
1700
-
-
VDS = 1700, VGS = 0 V
-
0.05
10
VDS = 1700 V, VGS = 0 V, TJ = 175 °C
-
0.1
-
IGSS,F
VGS = 22 V, VDS = 0 V
-
-
100
IGSS,R
VGS = 6 V, VDS = 0 V
-
-
100
Drain-Source On-State Resistance
RDS(ON)
Gate Threshold Voltage
VGS(TH)
Gate Resistance
Value
Min
RG
ID = 2 A, VGS = 20 V
-
750
1000
ID = 2 A, VGS = 20 V, TJ = 175 °C
-
1550
-
VDS = VGS, ID = 1 mA
1.8
2.8
4.0
VDS = VGS, ID = 1 mA, TJ = 175 °C
-
1.9
-
Resonance method, Drain-Source
shorted1
-
29
-
Unit
V
µA
nA
V
Footnote 1: For a description of the resonance method for measuring RG, refer to the JEDEC Standard JESD24-11 test method
3
Specifications are subject to change without notice.
Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.
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Revised: 12/14/2020
LSIC1MO170E0750
Silicon Carbide MOSFET Datasheet
3.2. Dynamic Characteristics (T
J
Characteristic
= 25 °C unless otherwise specified)
Value
Symbol
Conditions
Turn-On Switching Energy
EON
Turn-Off Switching Energy
EOFF
VDD = 1200 V, ID = 2 A,
VGS = -5 / +20 V,
RG,ext
1.4 mH,
FWD = LSIC1MO170E0750
Min
Typ
Max
-
52
-
-
61
-
Total Per-Cycle Switching Energy
ETS
-
113
-
Input Capacitance
CISS
-
200
-
Output Capacitance
COSS
-
11.5
-
-
1.7
-
-
5.7
-
-
13
-
-
3.5
-
-
6
-
-
8
-
-
12
-
-
23
-
-
74
-
Reverse Transfer Capacitance
CRSS
COSS Stored Energy
EOSS
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Turn-On Delay Time
td(on)
Rise Time
tr
Turn-Off Delay Time
td(off)
Fall Time
tf
VDD = 1000 V, VGS = 0 V,
f = 1 MHz, VAC = 25 mV
VDD = 1200 V, ID = 2 A,
VGS = -5 / +20 V
VDD = 1200 V, VGS = -5 / +20 V,
ID = 2 A, RG,ext
RL = 600
Timing relative to VDS
Unit
µJ
pF
µJ
nC
ns
4. Reverse Diode Characteristics
Characteristic
Symbol
Diode Forward Voltage
VSD
Continuous Diode Forward Current
Peak Diode Forward Current
1
IS
ISP
Value
Conditions
Min
Typ
Max
IS = 1 A, VGS = 0 V
-
3.7
-
IS = 1 A, VGS = 0 V, TJ = 175 °C
-
3.2
-
-
-
9
-
-
15
VGS = 0 V, TC = 25 °C
Unit
V
A
Footnote 1: Pulse width limited by TJ,MAX
4
Specifications are subject to change without notice.
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Revised: 12/14/2020
LSIC1MO170E0750
Silicon Carbide MOSFET Datasheet
5. Figure Data
Figure 1. Maximum Power Dissipation (TJ = 175 °C)
Figure 2. Typical Transfer Characteristics
9
8
60
Drain Current, ID (A)
50
40
30
20
10
TJ = 25 °C
7
6
5
4
175 °C
3
-55 °C
2
VDS = 10 V
1
0
0
-75
-50
-25
0
25
50
75
100 125 150 175 200
0
5
Case Temperature, TC (°C)
Figure 3. Typical Output Characteristics (TJ = 25 °C)
20
9
8
8
VGS = 20 V
7
6
18 V
5
16 V
4
14 V
Drain Current, ID (A)
Drain Current, ID (A)
15
Figure 4. Typical Output Characteristics (TJ = 175 °C)
9
3
12 V
2
10 V
1
7
6
VGS = 20 V
5
18 V
16 V
4
14 V
12 V
3
10 V
2
1
0
0
0
2
4
6
8
10
0
2
Drain-Source Voltage, VDS (V)
4
6
8
10
Drain-Source Voltage, VDS (V)
Figure 5. Typical Output Characteristics (TJ = -55 °C)
Figure 6. Typical Reverse Conduction Characteristics (TJ = 25 °C)
9
Reverse Voltage, VSD (V)
8
Drain Current, ID (A)
10
Gate-Source Voltage, VGS (V)
7
6
5
4
3
2
1
0
0
7
VGS = 20 V
6
5
18 V
4
16 V
0.5
1
1.5
2
-5 V 0 V
3
5V
10 V 15 V
2.5
14 V
2
VGS = 20 V
12 V
1
3.5
10 V
4
0
0
2
4
6
8
3
10
Reverse Current, IS (A)
Power Dissipation, PD (W)
70
4.5
Drain-Source Voltage, VDS (V)
5
5
Specifications are subject to change without notice.
Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.
© 2020 Littelfuse, Inc.
Revised: 12/14/2020
LSIC1MO170E0750
Silicon Carbide MOSFET Datasheet
Figure 7. Typical Reverse Conduction Characteristics (TJ = 175 °C)
Figure 8. Typical Reverse Conduction Characteristics (TJ = -55 °C)
5
4
3
Reverse Voltage, VSD (V)
2
1
0
7
15 V
3.5
1.5
2
-5 V
5V
3
3.5
4
4.5
4.5
5
5
Figure 10. Maximum Safe Operating Area (TC = 25 °C)
10
0.1
0.05
0.02
0.01
Single Pulse
Pulse
10 µs
1
100 µs
1 ms
0.1
100 ms
(Single Pulse)
1E-3
1E-06
0.01
1E-05
1E-04
1E-03
1E-02
1E-01
1E+00
0.1
1
Pulse Width (s)
10
100
1000
10000
Drain-Source Voltage, VDS (V)
Figure 11. Typical On-resistance vs. Drain Current
Figure 12. Normalized On-resistance vs. Junction Temperature
2.5
Normalized On-resistance, RDS(ON)
3500
On-resistance, RDS(ON) (mOhm)
10 V 15 V
VGS = 20 V
Drain Current, ID (A)
Thermal Impedance, Zth,JC (°C/W)
0V
2.5
Duty = 0.5
0.3
1E-2
0
1
Figure 9. Transient Thermal Impedance
1E-1
1
0.5
4
1E+0
2
1
3
5V
3
0
2.5
10 V
4
0.5
2
VGS = 20 V
5
0
1.5
-5 V 0 V
6
Reverse Current, IS (A)
6
Reverse Current, IS (A)
Reverse Voltage, VSD (V)
7
3000
2500
TJ = 175 °C
2000
-55 °C
1500
1000
25 °C
500
(VGS = 20 V)
0
2
1.5
1
0.5
(VGS = 20 V, ID = 2 A)
0
0
2
4
6
8
-75
Drain Current, ID (A)
-50
-25
0
25
50
75
100 125 150 175 200
Junction Temperature, TJ (°C)
6
Specifications are subject to change without notice.
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Revised: 12/14/2020
LSIC1MO170E0750
Silicon Carbide MOSFET Datasheet
Figure 13. Typical On-resistance vs. Junction Temperature
Figure 14. Typical Threshold Voltage
4.5
1600
Threshold Voltage, VGS(TH) (V)
On-resistance, RDS(ON) (mOhm)
1800
1400
1200
16 V
1000
18 V
800
20 V
600
Conditions:
ID = 2 A
VGS traces labeled
400
200
0
4
3.5
3
2.5
2
1.5
1
0.5
(ID = 1 mA, VDS = VGS)
0
-50
-25
0
25
50
75
100
125
150
175
-75
-50
-25
Junction Temperature, TJ (°C)
0
25
50
75
100 125 150 175 200
Junction Temperature, TJ (°C)
Figure 15. Typical Junction Capacitances up to 1000 V
Figure 16. Typical Junction Capacitances up to 200 V
1000
1000
CISS
Capacitance (pF)
Capacitance (pF)
CISS
100
COSS
10
100
COSS
10
CRSS
CRSS
(f = 1 MHz)
1
0
200
(f = 1 MHz)
1
400
600
800
1000
0
50
Drain-Source Voltage, VDS (V)
Figure 17. Typical COSS Stored Energy EOSS
150
200
Figure 18. Typical Gate Charge
7
20
Gate-Source Voltage, VGS (V)
6
Stored Energy, EOSS (µJ)
100
Drain-Source Voltage, VDS (V)
5
4
3
2
1
15
10
5
0
(VDD = 1200 V, ID = 2 A)
0
-5
0
200
400
600
800
1000
0
Drain-Source Voltage, VDS (V)
2
4
6
8
10
12
14
Gate Charge, QG (nC)
7
Specifications are subject to change without notice.
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© 2020 Littelfuse, Inc.
Revised: 12/14/2020
LSIC1MO170E0750
Silicon Carbide MOSFET Datasheet
Figure 20. Typical Switching Energy vs. External Gate Resistance
Figure 19. Typical Switching Energy vs. Drain Current
250
VDD = 1200 V
RG,ext = 2 Ohm
VGS = -5/+20 V
FWD = LSIC1MO170E0750
L = 1.4 mH
TJ = 25 °C
200
Switching Energy, ESW (µJ)
Switching Energy, ESW (µJ)
250
Etot
150
Eon
100
Eoff
50
VDD = 1200 V
ID = 2 A
VGS = -5/+20 V
FWD = LSIC1MO170E0750
L = 1.4 mH
TJ = 25 °C
200
Etot
150
Eon
100
Eoff
50
0
0
0
1
2
3
4
5
0
6
10
20
30
40
50
60
External Gate Resistance, RG,ext (Ohm)
Drain Current, ID (A)
Figure 21. VGS Waveform Definitions
+25 V
ttransient
+22 V
0V
ttransient
-6 V
-10 V
8
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Revised: 12/14/2020
LSIC1MO170E0750
Silicon Carbide MOSFET Datasheet
6. Package Dimensions
Symbol
Millimeters
Min
Nom
Max
A
4.699
-
5.309
A1
2.210
-
2.591
A2
1.499
-
2.489
b
0.990
-
1.400
b2
1.650
-
2.390
b4
2.590
-
3.430
c
0.380
-
0.890
21.463
D
20.800
-
D1
13.081
-
-
D2
0.508
-
1.350
e
Recommended Hole Pattern Layout:
Notes:
1. Dimensions are in millimeters
2. Dimensions D & E do not include mold
flash. Mold flash shall not exceed 0.127
mm per side. These dimensions are
measured at the outermost extreme of the
plastic body.
5.440 BSC
E
15.494
-
16.256
E1
13.060
-
14.150
E2
3.429
-
5.486
L
19.810
-
20.570
L1
3.810
-
4.496
øP
3.550
-
3.660
øP1
7.060
-
7.390
Q
5.385
-
6.200
S
6.050
-
6.300
3. øP to have a maximum draft angle of 1.7°
to the top of the part with a maximum hole
diameter of 3.912 mm.
7. Part Numbering and Marking
SiC
= SiC
1
= Gen 1
MO
= MOSFET
170
= Voltage Rating (1700 V)
E
= TO-247-3L
0750
= RDS(ON) (750 mOhm)
YY
= Year
WW
= Week
D
= Special Code
ZZZZZZ-ZZ
= Lot Number
8. Packing Options
9
Part Number
Marking
LSIC1MO170E0750
SIC1MO170E0750
Packing
Mode
Tube
(30 Pcs)
M.O.Q.
450
Specifications are subject to change without notice.
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© 2020 Littelfuse, Inc.
Revised: 12/14/2020
LSIC1MO170E0750
Silicon Carbide MOSFET Datasheet
9. Packing Specifications
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the product may result in personal injury, death, or property damage) other than those expressly forth in applicable Littelfuse product documentation. Littelfuse shall not be liable for
any claims or damages arising out of products used in applications not expressly intended by Littelfuse as set forth in applicable Littelfuse documentation.
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10
Specifications are subject to change without notice.
Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.
© 2020 Littelfuse, Inc.
Revised: 12/14/2020