找到“without”相关的规格书共5,131个
| 型号 | 厂商 | 描述 | 数据手册 | 替代料 | 参考价格 |
|---|---|---|---|---|---|
| 78120-8013 | MOLEX9[MolexElectronicsLtd.] | 78120-8013 - 1.27mm (.050") Pitch Wire-to-Board Receptacle, Dual Row, Vertical, SMT, 0.25μm (10μ") Gold (Au) Plating, without Kapton Tape, 80 Circuits - Molex Electronics Ltd. | 获取价格 | ||
| 760685001 | MOLEX9[MolexElectronicsLtd.] | 760685001 - Small Form-factor Pluggable Plus (SFP) Stacked 2-by-6 Multi-Port Press Fit Connector without Lightpipe Ports, EMI Metal Gasket, 240 Circuits, Tin (Sn) Tails - Molex Electronics Ltd. | 获取价格 | ||
| 760675001 | MOLEX9[MolexElectronicsLtd.] | 760675001 - Small Form-factor Pluggable Plus (SFP) Stacked 2-by-5 Multi-Port Press Fit Connector without Lightpipe Ports, EMI Metal Gasket, 200 Circuits, Tin (Sn) Tails - Molex Electronics Ltd. | 获取价格 | ||
| 760665001 | MOLEX9[MolexElectronicsLtd.] | 760665001 - Small Form-factor Pluggable Plus (SFP) Stacked 2-by-4 Multi-Port Press Fit Connector without Lightpipe Ports, EMI Metal Gasket, 160 Circuits, Tin (Sn) Tails - Molex Electronics Ltd. | 获取价格 | ||
| 76065-0001 | MOLEX9[MolexElectronicsLtd.] | 76065-0001 - Small Form-factor Pluggable Plus (SFP) Stacked 2-by-2 Multi-Port Press FitConnector without Lightpipe Ports, EMI Metal Gasket, 80 Circuits, Tin (Sn)/Lead(Pb) - Molex Electronics Ltd. | 获取价格 | ||
| 0878982066 | MOLEX10[MolexElectronicsLtd.] | 0878982066 - 2.54mm (.100) Pitch KK® Header, Surface Mount, Breakaway, Vertical, 20 Circuits, 2.50μm (98μ) Tin (Sn) Plating, Tube Packaging, without Cap, Lead-free - Molex Electronics Ltd. | 获取价格 | ||
| 0878580760 | MOLEX10[MolexElectronicsLtd.] | 0878580760 - 2.00mm (.079) Pitch Milli-Gridâ„¢ Breakaway Header, Surface Mount, Single Row, Parallel, 2.54μm (100μ) Tin (Sn) Plating, without Peg, withKapton Tape, Mating Pin - Molex Electronics Ltd. | 获取价格 | ||
| 0878344019 | MOLEX10[MolexElectronicsLtd.] | 0878344019 - 2.54mm (.100) Pitch C-Grid® Header, Dual Row, Low Profile, Vertical, Shrouded, 40 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCB Locator - Molex Electronics Ltd. | 获取价格 | ||
| 0878343419 | MOLEX10[MolexElectronicsLtd.] | 0878343419 - 2.54mm (.100) Pitch C-Grid® Header, Dual Row, Low Profile, Vertical, Shrouded, 34 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCB Locator - Molex Electronics Ltd. | 获取价格 | ||
| 70247-0869 | MOLEX8[MolexElectronicsLtd.] | 70247-0869 - 2.54mm (.100") Pitch C-Grid® Header, Dual Row, Low Profile, Right Angle, Shrouded8 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, without - Molex Electronics Ltd. | 获取价格 | ||
| 0878335052 | MOLEX10[MolexElectronicsLtd.] | 0878335052 - 2.00mm (.079) Pitch Milli-Gridâ„¢ Header, Right Angle, Shrouded, Lead-free, 50 Circuits, 0.05μm (2μ) Gold (Au) Plating, without PCB Locator - Molex Electronics Ltd. | 获取价格 | ||
| 0878334821 | MOLEX10[MolexElectronicsLtd.] | 0878334821 - 2.00mm (.079) Pitch Milli-Gridâ„¢ Header, Right Angle, Shrouded, Lead-free, 48 Circuits, 0.76μm (30μ) Gold (Au) Plating, without PCB Locator, with Locking Windows - Molex Electronics Ltd. | 获取价格 | ||
| 0878334424 | MOLEX10[MolexElectronicsLtd.] | 0878334424 - 2.00mm (.079) Pitch Milli-Gridâ„¢ Header, Right Angle, Through Hole, Shrouded, Lead-free, 44 Circuits, 0.38μm (15μ) Gold (Au) Plating, without PCB Locator - Molex Electronics Ltd. | 获取价格 | ||
| 0878333820 | MOLEX10[MolexElectronicsLtd.] | 0878333820 - 2.00mm (.079) Pitch Milli-Gridâ„¢ Header, Right Angle, Shrouded, Lead-free, 38 Circuits, 0.38μm (15μ) Gold (Au) Plating, without PCB Locator, with Locking Windows - Molex Electronics Ltd. | 获取价格 | ||
| 74337-0066 | MOLEX8[MolexElectronicsLtd.] | 74337-0066 - 0.80mm (.031") Pitch Ultra™ VHDCI Receptacle, Stacked, Right Angle, Press-Fit PCBRetention Option, 136 Circuits, without Screw Locks, with Cover, for 1.6mm (.062") - Molex Electronics Ltd. | 获取价格 | ||
| 15-97-7023 | MOLEX2[MolexElectronicsLtd.] | 15-97-7023 - 4.20mm (.165) Pitch Mini-Fit TPAâ„¢ Header, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 2 Circuits, Tin (Sn) Plating, without Drain Holes - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-1201 | MOLEX2[MolexElectronicsLtd.] | 15-80-1201 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-1161 | MOLEX2[MolexElectronicsLtd.] | 15-80-1161 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-1121 | MOLEX2[MolexElectronicsLtd.] | 15-80-1121 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-1101 | MOLEX2[MolexElectronicsLtd.] | 15-80-1101 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 |
