找到“without”相关的规格书共5,131个
| 型号 | 厂商 | 描述 | 数据手册 | 替代料 | 参考价格 |
|---|---|---|---|---|---|
| A-4455-CY06A | MOLEX2[MolexElectronicsLtd.] | A-4455-CY06A - 2.54mm (.100) Pitch KK® PC Board Connector, Top Entry, with Cat Ear Terminal, 2.54μm (100μ) Tin (Sn), 6 Circuits, Without Hooks - Molex Electronics Ltd. | 获取价格 | ||
| A556614B210 | MOLEX3[MolexElectronicsLtd.] | A556614B210 - 4.20mm (.165") Pitch Mini-Fit Jr.™ Header, Dual Row, Vertical, without Snap-in Plastic Peg PCB Lock, 14 Circuits, PA Polyamide Nylon 6/6 94V-0, Tin (Sn) Plating, with Drain Holes - Molex Electronics Ltd. | 获取价格 | ||
| A556612AGS210 | MOLEX3[MolexElectronicsLtd.] | A556612AGS210 - 4.20mm (.165") Pitch Mini-Fit Jr. Header, Dual Row, Vertical, without Snap-in Plastic Peg PCB Lock - Molex Electronics Ltd. | 获取价格 | ||
| A556608AGS210 | MOLEX3[MolexElectronicsLtd.] | A556608AGS210 - 4.20mm (.165") Pitch Mini-Fit Jr. Header, Dual Row, Vertical, without Snap-in Plastic Peg PCB Lock - Molex Electronics Ltd. | 获取价格 | ||
| A-44472-2451 | MOLEX6[MolexElectronicsLtd.] | A-44472-2451 - 4.20mm (.165") Pitch Mini-Fit HCS™ Header, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 24 Circuits, PA Polyamide Nylon 6/6 94V-0, without Drain Holes - Molex Electronics Ltd. | 获取价格 | ||
| A-42440-1421 | MOLEX1[MolexElectronicsLtd.] | A-42440-1421 - 4.20mm (.165") Pitch Mini-Fit BMI™ Header, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 14 Circuits, PA Polyamide Nylon 6/6, UL 94V-0, Tin (Sn) Plating, without Drain Holes - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0363 | MOLEX2[MolexElectronicsLtd.] | A-70567-0363 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0295 | MOLEX2[MolexElectronicsLtd.] | A-70567-0295 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0285 | MOLEX2[MolexElectronicsLtd.] | A-70567-0285 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0283 | MOLEX2[MolexElectronicsLtd.] | A-70567-0283 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0282 | MOLEX2[MolexElectronicsLtd.] | A-70567-0282 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0278 | MOLEX2[MolexElectronicsLtd.] | A-70567-0278 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0277 | MOLEX2[MolexElectronicsLtd.] | A-70567-0277 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0227 | MOLEX2[MolexElectronicsLtd.] | A-70567-0227 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0170 | MOLEX2[MolexElectronicsLtd.] | A-70567-0170 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 72 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0157 | MOLEX2[MolexElectronicsLtd.] | A-70567-0157 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 46 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0155 | MOLEX2[MolexElectronicsLtd.] | A-70567-0155 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 42 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0154 | MOLEX2[MolexElectronicsLtd.] | A-70567-0154 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0150 | MOLEX2[MolexElectronicsLtd.] | A-70567-0150 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| A-70567-0147 | MOLEX2[MolexElectronicsLtd.] | A-70567-0147 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 |
