找到“without”相关的规格书共5,131个
| 型号 | 厂商 | 描述 | 数据手册 | 替代料 | 参考价格 |
|---|---|---|---|---|---|
| 15-97-7083 | MOLEX2[MolexElectronicsLtd.] | 15-97-7083 - 4.20mm (.165) Pitch Mini-Fit TPAâ„¢ Header, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 8 Circuits, Tin (Sn) Plating, without Drain Holes - Molex Electronics Ltd. | 获取价格 | ||
| 15-97-7063 | MOLEX2[MolexElectronicsLtd.] | 15-97-7063 - 4.20mm (.165) Pitch Mini-Fit TPAâ„¢ Header, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 6 Circuits, Gold (Au) Plating, without Drain Holes - Molex Electronics Ltd. | 获取价格 | ||
| 15-97-7043 | MOLEX2[MolexElectronicsLtd.] | 15-97-7043 - 4.20mm (.165) Pitch Mini-Fit TPAâ„¢ Header, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 4 Circuits, Tin (Sn) Plating, without Drain Holes - Molex Electronics Ltd. | 获取价格 | ||
| 0009016241 | MOLEX1[MolexElectronicsLtd.] | 0009016241 - 3.96mm (.156") Pitch KK® Crimp Housing, Edge Card Connector, Single-Sided,Surface Mount, Polarized, Without Flange, 24 Circuits, Rib between 4 & 5, 8 & 9, 12 &13, 16 & 17, 20 & 21 - Molex Electronics Ltd. | 获取价格 | ||
| 15-91-2600 | MOLEX2[MolexElectronicsLtd.] | 15-91-2600 - 2.54mm (.100) Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 60 Circuits, Tin (Sn) Plating, without PCB Locator Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0703 | MOLEX2[MolexElectronicsLtd.] | 15-80-0703 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 70 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0681 | MOLEX2[MolexElectronicsLtd.] | 15-80-0681 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0625 | MOLEX2[MolexElectronicsLtd.] | 15-80-0625 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 62 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0878101001 | MOLEX10[MolexElectronicsLtd.] | 0878101001 - 1.00mm (.039) Pitch iCoolâ„¢ Low Profile VRM, Vertical, Through Hole, without Tower, with Beveled Metal Pins, 22 Signal, 88 Power, 0.76μm (30μ) Gold (Au) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0585 | MOLEX2[MolexElectronicsLtd.] | 15-80-0585 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 58 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0583 | MOLEX2[MolexElectronicsLtd.] | 15-80-0583 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 58 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0561 | MOLEX2[MolexElectronicsLtd.] | 15-80-0561 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 56 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0461 | MOLEX2[MolexElectronicsLtd.] | 15-80-0461 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 46 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0443 | MOLEX2[MolexElectronicsLtd.] | 15-80-0443 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 44 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0383 | MOLEX2[MolexElectronicsLtd.] | 15-80-0383 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0329 | MOLEX2[MolexElectronicsLtd.] | 15-80-0329 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0301 | MOLEX2[MolexElectronicsLtd.] | 15-80-0301 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0283 | MOLEX2[MolexElectronicsLtd.] | 15-80-0283 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0261 | MOLEX2[MolexElectronicsLtd.] | 15-80-0261 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0249 | MOLEX2[MolexElectronicsLtd.] | 15-80-0249 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 |
