找到“SN54136W”相关的规格书共13,308个
| 型号 | 厂商 | 描述 | 数据手册 | 替代料 | 参考价格 |
|---|---|---|---|---|---|
| 15-80-0067 | MOLEX2[MolexElectronicsLtd.] | 15-80-0067 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0877600838 | MOLEX10[MolexElectronicsLtd.] | 0877600838 - 2.00mm (.079) Pitch Milli-Gridâ„¢ Header, Right Angle, Through Hole, 8 Circuits, 2.54μm (100μ) Tin (Sn) Plating, Mating Pin Length: 3.06mm (.120), Tray, Lead-free - Molex Electronics Ltd. | 获取价格 | ||
| 15-47-7670 | MOLEX2[MolexElectronicsLtd.] | 15-47-7670 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 70 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-47-7570 | MOLEX2[MolexElectronicsLtd.] | 15-47-7570 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 70 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-47-7554 | MOLEX2[MolexElectronicsLtd.] | 15-47-7554 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 54 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-47-7552 | MOLEX2[MolexElectronicsLtd.] | 15-47-7552 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 52 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-47-7544 | MOLEX2[MolexElectronicsLtd.] | 15-47-7544 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 44 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-47-7532 | MOLEX2[MolexElectronicsLtd.] | 15-47-7532 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 32 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-47-7530 | MOLEX2[MolexElectronicsLtd.] | 15-47-7530 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 30 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 70575-0011 | MOLEX8[MolexElectronicsLtd.] | 70575-0011 - 2.54mm (.100") Pitch SL™ Header, Single Row, Right Angle, .180" Pocket, Shroudedwith Press-fit Plastic Peg, 12 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 70575-0006 | MOLEX8[MolexElectronicsLtd.] | 70575-0006 - 2.54mm (.100") Pitch SL™ Header, Single Row, Right Angle, .180" Pocket, Shroudedwith Press-fit Plastic Peg, 7 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 70567-0125 | MOLEX8[MolexElectronicsLtd.] | 70567-0125 - 2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 50 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 70567-0023 | MOLEX2[MolexElectronicsLtd.] | 70567-0023 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 70567-0013 | MOLEX2[MolexElectronicsLtd.] | 70567-0013 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 70567-0012 | MOLEX2[MolexElectronicsLtd.] | 70567-0012 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 70567-0011 | MOLEX2[MolexElectronicsLtd.] | 70567-0011 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 70563-0122 | MOLEX8[MolexElectronicsLtd.] | 70563-0122 - 2.54mm (.100") Pitch SL™ Header, Single Row, Vertical, .180" Pocket, Shrouded, 18Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating - Molex Electronics Ltd. | 获取价格 | ||
| 70563-0114 | MOLEX8[MolexElectronicsLtd.] | 70563-0114 - 2.54mm (.100") Pitch SL™ Header, Single Row, Vertical, .180" Pocket, Shrouded, 10Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating - Molex Electronics Ltd. | 获取价格 | ||
| 70563-0112 | MOLEX8[MolexElectronicsLtd.] | 70563-0112 - 2.54mm (.100") Pitch SL™ Header, Single Row, Vertical, .180" Pocket, Shrouded, 8Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating - Molex Electronics Ltd. | 获取价格 | ||
| 70563-0020 | MOLEX8[MolexElectronicsLtd.] | 70563-0020 - 2.54mm (.100") Pitch SL™ Header, Single Row, Vertical, .180" Pocket, Shrouded, 21Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating - Molex Electronics Ltd. | 获取价格 |
