找到“SN5426”相关的规格书共13,320个
| 型号 | 厂商 | 描述 | 数据手册 | 替代料 | 参考价格 |
|---|---|---|---|---|---|
| 74162-0032 | MOLEX8[MolexElectronicsLtd.] | 74162-0032 - 2.54mm (.100") Pitch C-Grid® Receptacle, Right Angle, Through Hole, Dual Row, Shrouded, Version A, High-Temperature, 32 Circuits, Tin (Sn) - Molex Electronics Ltd. | 获取价格 | ||
| 15-97-7023 | MOLEX2[MolexElectronicsLtd.] | 15-97-7023 - 4.20mm (.165) Pitch Mini-Fit TPAâ„¢ Header, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 2 Circuits, Tin (Sn) Plating, without Drain Holes - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0621 | MOLEX2[MolexElectronicsLtd.] | 15-80-0621 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 62 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0877970010 | MOLEX10[MolexElectronicsLtd.] | 0877970010 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row Dual Body, Vertical, 34 Circuits, Tin (Sn) Overall Plating, 15.10mm (.594) Stacking Height, Tray Packaging - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0381 | MOLEX2[MolexElectronicsLtd.] | 15-80-0381 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0241 | MOLEX2[MolexElectronicsLtd.] | 15-80-0241 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0201 | MOLEX2[MolexElectronicsLtd.] | 15-80-0201 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0181 | MOLEX2[MolexElectronicsLtd.] | 15-80-0181 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0877603038 | MOLEX10[MolexElectronicsLtd.] | 0877603038 - 2.00mm (.079) Pitch Milli-Gridâ„¢ Header, Right Angle, Through Hole, 30 Circuits, 2.54μm (100μ) Tin (Sn) Plating, Mating Pin Length: 3.06mm (.120), Tray, Lead-free - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0147 | MOLEX2[MolexElectronicsLtd.] | 15-80-0147 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 71349-2027 | MOLEX8[MolexElectronicsLtd.] | 71349-2027 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded58 Circuits, Tin (Sn) Plating, with Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 71349-2017 | MOLEX8[MolexElectronicsLtd.] | 71349-2017 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded38 Circuits, Tin (Sn) Plating, with Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 71349-1023 | MOLEX8[MolexElectronicsLtd.] | 71349-1023 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded50 Circuits, Tin (Sn) Plating, without Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 71349-1008 | MOLEX8[MolexElectronicsLtd.] | 71349-1008 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded20 Circuits, Tin (Sn) Plating, without Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 713084050N | MOLEX2[MolexElectronicsLtd.] | 713084050N - 2.54mm (.100) Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 50 Circuits, Tin (Sn) Plating, with 3.30mm (.130) PCB Locator Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 71308-6462 | MOLEX8[MolexElectronicsLtd.] | 71308-6462 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 62 Circuits,1.50μm (59μ") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130") - Molex Electronics Ltd. | 获取价格 | ||
| 71308-6450 | MOLEX8[MolexElectronicsLtd.] | 71308-6450 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 50 Circuits1.50μm (59μ") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130") - Molex Electronics Ltd. | 获取价格 | ||
| 71308-6442 | MOLEX8[MolexElectronicsLtd.] | 71308-6442 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 42 Circuits1.50μm (59μ") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130") - Molex Electronics Ltd. | 获取价格 | ||
| 71308-6434 | MOLEX8[MolexElectronicsLtd.] | 71308-6434 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 34 Circuits1.50μm (59μ") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130") - Molex Electronics Ltd. | 获取价格 | ||
| 71308-6424 | MOLEX8[MolexElectronicsLtd.] | 71308-6424 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 24 Circuits,1.50μm (59μ") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130") PCB Locator Pegs - Molex Electronics Ltd. | 获取价格 |
