找到“without”相关的规格书共5,131个
| 型号 | 厂商 | 描述 | 数据手册 | 替代料 | 参考价格 |
|---|---|---|---|---|---|
| 15-80-0067 | MOLEX2[MolexElectronicsLtd.] | 15-80-0067 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 15-80-0065 | MOLEX2[MolexElectronicsLtd.] | 15-80-0065 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0877594865 | MOLEX10[MolexElectronicsLtd.] | 0877594865 - 2.00mm (.079) Pitch Milli-Gridâ„¢ Header, Surface Mount, Vertical, 48 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 0877594451 | MOLEX10[MolexElectronicsLtd.] | 0877594451 - 2.00mm (.079) Pitch Milli-Gridâ„¢ Header, Surface Mount, Vertical, 44 Circuits, 0.38μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free - Molex Electronics Ltd. | 获取价格 | ||
| 0877594251 | MOLEX10[MolexElectronicsLtd.] | 0877594251 - 2.00mm (.079) Pitch Milli-Gridâ„¢ Header, Surface Mount, Vertical, 42 Circuits, 0.38μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free - Molex Electronics Ltd. | 获取价格 | ||
| 0877594214 | MOLEX10[MolexElectronicsLtd.] | 0877594214 - 2.00mm (.079) Pitch Milli-Gridâ„¢ Header, Surface Mount, Vertical, 42 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free - Molex Electronics Ltd. | 获取价格 | ||
| 0877594075 | MOLEX10[MolexElectronicsLtd.] | 0877594075 - 2.00mm (.079) Pitch Milli-Gridâ„¢ Header, Surface Mount, Vertical, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 0877594015 | MOLEX10[MolexElectronicsLtd.] | 0877594015 - 2.00mm (.079) Pitch Milli-Gridâ„¢ Header, Surface Mount, Vertical, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free - Molex Electronics Ltd. | 获取价格 | ||
| 0877593215 | MOLEX10[MolexElectronicsLtd.] | 0877593215 - 2.00mm (.079) Pitch Milli-Gridâ„¢ Header, Surface Mount, Vertical, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free - Molex Electronics Ltd. | 获取价格 | ||
| 0877592865 | MOLEX10[MolexElectronicsLtd.] | 0877592865 - 2.00mm (.079) Pitch Milli-Gridâ„¢ Header, Surface Mount, Vertical, 28 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, with Pick-and-Place Cap - Molex Electronics Ltd. | 获取价格 | ||
| 0877592815 | MOLEX10[MolexElectronicsLtd.] | 0877592815 - 2.00mm (.079) Pitch Milli-Gridâ„¢ Header, Surface Mount, Vertical, 28 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free - Molex Electronics Ltd. | 获取价格 | ||
| 0877592675 | MOLEX10[MolexElectronicsLtd.] | 0877592675 - 2.00mm (.079) Pitch Milli-Gridâ„¢ Header, Surface Mount, Vertical, 26 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 0877592665 | MOLEX10[MolexElectronicsLtd.] | 0877592665 - 2.00mm (.079) Pitch Milli-Gridâ„¢ Header, Surface Mount, Vertical, 26 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 70567-0165 | MOLEX2[MolexElectronicsLtd.] | 70567-0165 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 62 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 70567-0164 | MOLEX2[MolexElectronicsLtd.] | 70567-0164 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 60 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 70567-0142 | MOLEX2[MolexElectronicsLtd.] | 70567-0142 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, - Molex Electronics Ltd. | 获取价格 | ||
| 70567-0125 | MOLEX8[MolexElectronicsLtd.] | 70567-0125 - 2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 50 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 70567-0023 | MOLEX2[MolexElectronicsLtd.] | 70567-0023 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 70567-0013 | MOLEX2[MolexElectronicsLtd.] | 70567-0013 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 70567-0012 | MOLEX2[MolexElectronicsLtd.] | 70567-0012 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 |
