找到“without”相关的规格书共5,131个
| 型号 | 厂商 | 描述 | 数据手册 | 替代料 | 参考价格 |
|---|---|---|---|---|---|
| 53748-0308 | MOLEX7[MolexElectronicsLtd.] | 53748-0308 - 0.50mm (.020") Pitch SlimStack™ Plug, Surface Mount, Dual Row, Vertical, 3.00mm (.118") Stack Height, 30 Circuits, without Vacuum Pick-up Tape - Molex Electronics Ltd. | 获取价格 | ||
| 0015801221 | MOLEX2[MolexElectronicsLtd.] | 0015801221 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015801161 | MOLEX2[MolexElectronicsLtd.] | 0015801161 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015800725 | MOLEX2[MolexElectronicsLtd.] | 0015800725 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 72 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015800705 | MOLEX2[MolexElectronicsLtd.] | 0015800705 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 70 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 5011905027 | MOLEX11[MolexElectronicsLtd.] | 5011905027 - 1.00mm (.039") Pitch Pico-Clasp™ Wire-to-Board PCB Header, Dual Row, Vertical, 50 Circuits, Lead-free, without Pick-and-Place Tape - Molex Electronics Ltd. | 获取价格 | ||
| 0015800663 | MOLEX2[MolexElectronicsLtd.] | 0015800663 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 66 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015800645 | MOLEX2[MolexElectronicsLtd.] | 0015800645 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 64 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 43020-1008 | MOLEX5[MolexElectronicsLtd.] | 43020-1008 - 3.00mm (.118") Pitch Micro-Fit 3.0™ Plug Housing, Dual Row, without Panel Mount Ears, Halogen-Free, 10 Circuits - Molex Electronics Ltd. | 获取价格 | ||
| 0015800585 | MOLEX2[MolexElectronicsLtd.] | 0015800585 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 58 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015800503 | MOLEX2[MolexElectronicsLtd.] | 0015800503 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015800465 | MOLEX2[MolexElectronicsLtd.] | 0015800465 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 46 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015800385 | MOLEX2[MolexElectronicsLtd.] | 0015800385 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015800369 | MOLEX2[MolexElectronicsLtd.] | 0015800369 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0705430109 | MOLEX8[MolexElectronicsLtd.] | 0705430109 - 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded34 Circuits, Tin (Sn) Plating, without Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 0015800305 | MOLEX2[MolexElectronicsLtd.] | 0015800305 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015800285 | MOLEX2[MolexElectronicsLtd.] | 0015800285 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015800265 | MOLEX2[MolexElectronicsLtd.] | 0015800265 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015800249 | MOLEX2[MolexElectronicsLtd.] | 0015800249 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0015800225 | MOLEX2[MolexElectronicsLtd.] | 0015800225 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating - Molex Electronics Ltd. | 获取价格 |
